Market Overview:
The global die encapsulant market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for semiconductor devices and miniaturization of electronic components. Die encapsulants are used to protect the dies or integrated circuits from environmental factors such as moisture, dust, and heat. They also help in improving the performance of semiconductor devices by reducing electrical noise and thermal stress. Silicone-based die encapsulants are preferred over epoxy-based die encapsulants due to their superior properties such as low shrinkage, high thermal conductivity, and resistance to chemicals and solvents.
Product Definition:
Die encapsulant is a material that is used to protect the die or integrated circuit (IC) during the manufacturing process. It also helps to keep the IC in place and prevents it from being damaged.
Epoxy Based:
Epoxy-based die encapsulant is a polymer, which contains an epoxide group. It can be either thermosetting or thermoplastic. Epoxy based die encapsulant has low viscosity and shows high compatibility with most of the commercial microelectronics packaging materials including polyimide, PTFE, and polyethersulfone.
Silicone Based:
Silicone based die encapsulant is a type of thermal interface material that is used to make direct contact between the heat sink and processor in an electronic device. It offers low coefficient of friction, excellent adhesion, and high thermal conductivity. The major applications include computer hard disk drives, mobile phone chipsets, digital cameras memory modules etc.
Application Insights:
The wafer application segment accounted for the largest revenue share in 2017 and is projected to continue its dominance over the forecast period. The growth of this segment can be attributed to increasing demand for semiconductors from various sectors such as telecommunication, computing, consumer electronics and automotive. Furthermore, technological advancements coupled with high yield rates are expected to drive die encapsulant market growth over the coming years.
Silicon based die encapsulants are extensively used in disk drive components owing to their low volatile organic compound (VOC) content which reduces environmental pollution caused due to toxic emissions during production & consumption of solvents during curing process. Growing demand for green technologies along with regulations regarding toxic emissions is anticipated fuel market growth over the coming years.
Regional Analysis:
Asia Pacific dominated the global die encapsulant market in terms of revenue with a share of over 40.0% in 2017. The region is also expected to register the fastest CAGR from 2018 to 2030 owing to increasing demand for electronic devices and rapid industrialization and urbanization resulting in high population growth, which drives the need for consumer electronics, automobiles, medical devices & others.
The presence of major semiconductor manufacturing companies such as Micron Technology Inc., Samsung Electronics Co., Ltd; Hynix Semiconductor Inc.; TSMC Corporation; Qualcomm Technologies Inc.; Broadcom Limited; Mediatek (HK) Limited; and Xiamen Hongxin Electron-Tech Co., Ltd has fueled market growth across Asia Pacific region. In addition, favorable government policies promoting domestic manufacturing are anticipated to drive industry expansion over the forecast period.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Growing trend of using advanced materials in die encapsulant to improve device performance
- Proliferation of semiconductor and LED packaging industries
- Rising demand from automotive and medical sectors
- Technological advancements in die encapsulant manufacturing process
Scope Of The Report
Report Attributes
Report Details
Report Title
Die Encapsulant Market Research Report
By Type
Epoxy Based, Silicone Based
By Application
Wafers, Optical Substrate, Optical Lenses, Disk Drive Components and Others
By Companies
Dupont, Shin-Etsu, Wacker, Darbond, LG Chem, Henkel, Niche-Tech, Eternal, Sekisui Chemical, PICOMAX, Avantor, H.B. Fuller, Epic Resins, Segment by Type, Epoxy, Silicone
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
227
Number of Tables & Figures
159
Customization Available
Yes, the report can be customized as per your need.
Global Die Encapsulant Market Report Segments:
The global Die Encapsulant market is segmented on the basis of:
Types
Epoxy Based, Silicone Based
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Wafers, Optical Substrate, Optical Lenses, Disk Drive Components and Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Dupont
- Shin-Etsu
- Wacker
- Darbond
- LG Chem
- Henkel
- Niche-Tech
- Eternal
- Sekisui Chemical
- PICOMAX
- Avantor
- H.B. Fuller
- Epic Resins
- Segment by Type
- Epoxy
- Silicone
Highlights of The Die Encapsulant Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Epoxy Based
- Silicone Based
- By Application:
- Wafers
- Optical Substrate
- Optical Lenses
- Disk Drive Components and Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Die Encapsulant Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Die Encapsulant is a new type of packaging material that can protect products from environmental damage. The material is made up of tiny capsules that can be filled with any type of product. When the capsules are opened, the product inside is released and ready to use.
Some of the major companies in the die encapsulant market are Dupont, Shin-Etsu, Wacker, Darbond, LG Chem, Henkel, Niche-Tech, Eternal, Sekisui Chemical, PICOMAX, Avantor, H.B. Fuller, Epic Resins, Segment by Type, Epoxy, Silicone.
The die encapsulant market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Die Encapsulant Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Die Encapsulant Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Die Encapsulant Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Die Encapsulant Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Die Encapsulant Market Size & Forecast, 2020-2028 4.5.1 Die Encapsulant Market Size and Y-o-Y Growth 4.5.2 Die Encapsulant Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Epoxy Based
5.2.2 Silicone Based
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Wafers
6.2.2 Optical Substrate
6.2.3 Optical Lenses
6.2.4 Disk Drive Components and Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Die Encapsulant Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Die Encapsulant Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Epoxy Based
9.6.2 Silicone Based
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Wafers
9.10.2 Optical Substrate
9.10.3 Optical Lenses
9.10.4 Disk Drive Components and Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Epoxy Based
10.6.2 Silicone Based
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Wafers
10.10.2 Optical Substrate
10.10.3 Optical Lenses
10.10.4 Disk Drive Components and Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Epoxy Based
11.6.2 Silicone Based
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Wafers
11.10.2 Optical Substrate
11.10.3 Optical Lenses
11.10.4 Disk Drive Components and Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Epoxy Based
12.6.2 Silicone Based
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Wafers
12.10.2 Optical Substrate
12.10.3 Optical Lenses
12.10.4 Disk Drive Components and Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Epoxy Based
13.6.2 Silicone Based
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Wafers
13.10.2 Optical Substrate
13.10.3 Optical Lenses
13.10.4 Disk Drive Components and Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Die Encapsulant Market: Competitive Dashboard
14.2 Global Die Encapsulant Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Dupont
14.3.2 Shin-Etsu
14.3.3 Wacker
14.3.4 Darbond
14.3.5 LG Chem
14.3.6 Henkel
14.3.7 Niche-Tech
14.3.8 Eternal
14.3.9 Sekisui Chemical
14.3.10 PICOMAX
14.3.11 Avantor
14.3.12 H.B. Fuller
14.3.13 Epic Resins
14.3.14 Segment by Type
14.3.15 Epoxy
14.3.16 Silicone