Market Overview:
The global digital I-O module market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for sensors and automation across different industries. Additionally, the growing demand for wireless digital I-O modules is also contributing to the growth of this market. North America dominates the global digital I-O module market, followed by Europe and Asia Pacific.
Product Definition:
A digital I-O module is a device that allows a computer to communicate with external devices, such as sensors or actuators. It provides an interface between the computer and the outside world, allowing the computer to control and monitor these devices. The importance of digital I-O modules is that they allow computers to interact with real-world objects, which can be used in many different applications.
Wired Digital I-O Module:
Wired digital I-O module is a device that allows computer systems to communicate with other electronic devices, by establishing a connection between the output and input of a computer system. It's an interface between the peripheral devices such as printers, scanners, monitors and others; and the central processing unit (CPU) or another networked computer.
Wireless Digital I-O Module:
The wireless digital i-o module is a device that allows the connection of analog devices to IP-based networks. It provides an easy way for implementing networked I/O in portable instruments such as handhelds, mobile phones, and other consumer electronic products.
Application Insights:
The automation segment dominated the global digital I-O module market in terms of revenue share in 2017. The growth can be attributed to increasing adoption of industrial robots across various industries such as automotive, medical, and packaging among others. Moreover, rising demand for smart devices that are connected to the enterprise network is also driving the automation segment.
The sensors application segment is expected to witness significant growth over the forecast period owing to its wide range of applications including consumer electronics, healthcare monitoring systems and factory automation systems among others. Increasing use cases related with health monitoring and fitness tracking are also propelling demand for these modules across various regions worldwide.
Regional Analysis:
The market in Asia Pacific is expected to grow at a significant rate over the forecast period owing to the increasing adoption of automation and digital technologies across various industrial sectors. The growing manufacturing sector, rising number of smart factories, and rapid growth of IoT applications are also driving the demand for digital I-O modules in this region. Moreover, favorable government initiatives such as “Make in India†initiative by encouraging domestic manufacturing activities are anticipated to drive regional market growth over the forecast period.
The North America regional market accounted for more than 25% share in terms of revenue due to high investments made by prominent players such as National Instruments Corporation and Maxim Integrated Products Inc., which has resulted into higher penetration rates across several industries including oil & gas; automotive; power generation; healthcare & life sciences; process industries etc. In addition, presence of major universities focusing on engineering science offering advanced degree programs related to computer engineering will boost industry expansion over next eight years (until 2030).
Growth Factors:
- Increasing demand for data-driven decision making across industries
- Proliferation of digital technologies and big data analytics
- Growing need for faster and more efficient business processes
- Emergence of Industry 4.0 and the Internet of Things (IoT)
- Rising demand for cloud-based solutions
Scope Of The Report
Report Attributes
Report Details
Report Title
Digital I-O Module Market Research Report
By Type
Wired Digital I-O Module, Wireless Digital I-O Module
By Application
Sensors, Automation, Others
By Companies
CONTEC, Pepperl+Fuchs, iFM electronic, Hans TURCK, Hitachi, AAEON, Balluff, Ascon Tecnologic, SIKO, Pilz INT, Advantech, Emerson, HIMA, STW Technic, ST Microelectronics
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
217
Number of Tables & Figures
152
Customization Available
Yes, the report can be customized as per your need.
Global Digital I-O Module Market Report Segments:
The global Digital I-O Module market is segmented on the basis of:
Types
Wired Digital I-O Module, Wireless Digital I-O Module
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Sensors, Automation, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- CONTEC
- Pepperl+Fuchs
- iFM electronic
- Hans TURCK
- Hitachi
- AAEON
- Balluff
- Ascon Tecnologic
- SIKO
- Pilz INT
- Advantech
- Emerson
- HIMA
- STW Technic
- ST Microelectronics
Highlights of The Digital I-O Module Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Wired Digital I-O Module
- Wireless Digital I-O Module
- By Application:
- Sensors
- Automation
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Digital I-O Module Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A Digital I/O Module (DIM) is a type of computer peripheral that provides an interface between the computer and various devices, such as digital input/output (I/O) ports, serial ports, and parallel ports.
Some of the key players operating in the digital i-o module market are CONTEC, Pepperl+Fuchs, iFM electronic, Hans TURCK, Hitachi, AAEON, Balluff, Ascon Tecnologic, SIKO, Pilz INT, Advantech, Emerson, HIMA, STW Technic, ST Microelectronics.
The digital i-o module market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Digital I-O Module Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Digital I-O Module Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Digital I-O Module Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Digital I-O Module Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Digital I-O Module Market Size & Forecast, 2020-2028
4.5.1 Digital I-O Module Market Size and Y-o-Y Growth
4.5.2 Digital I-O Module Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Wired Digital I-O Module
5.2.2 Wireless Digital I-O Module
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Sensors
6.2.2 Automation
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Digital I-O Module Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Digital I-O Module Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Wired Digital I-O Module
9.6.2 Wireless Digital I-O Module
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Sensors
9.10.2 Automation
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Wired Digital I-O Module
10.6.2 Wireless Digital I-O Module
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Sensors
10.10.2 Automation
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Wired Digital I-O Module
11.6.2 Wireless Digital I-O Module
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Sensors
11.10.2 Automation
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Wired Digital I-O Module
12.6.2 Wireless Digital I-O Module
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Sensors
12.10.2 Automation
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Wired Digital I-O Module
13.6.2 Wireless Digital I-O Module
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Sensors
13.10.2 Automation
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Digital I-O Module Market: Competitive Dashboard
14.2 Global Digital I-O Module Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 CONTEC
14.3.2 Pepperl+Fuchs
14.3.3 iFM electronic
14.3.4 Hans TURCK
14.3.5 Hitachi
14.3.6 AAEON
14.3.7 Balluff
14.3.8 Ascon Tecnologic
14.3.9 SIKO
14.3.10 Pilz INT
14.3.11 Advantech
14.3.12 Emerson
14.3.13 HIMA
14.3.14 STW Technic
14.3.15 ST Microelectronics
