Industry Growth Insights published a new data on “Direct Bonded Copper Substrate Market”. The research report is titled “Direct Bonded Copper Substrate Market research by Types (AlN DBC Ceramic Substrate, Al2O3 DBC Ceramic Substrate), By Applications (IGBT Modules, Automotive, Home Appliances and CPV, Aerospace and Others), By Players/Companies Rogers/Curamik, KCC, Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics), Heraeus Electronics, Nanjing Zhongjiang New Material Science & Technology, NGK Electronics Devices, Littelfuse IXYS, Remtec, Stellar Industries Corp, Tong Hsing (acquired HCS), Rogers/Curamik”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Direct Bonded Copper Substrate Market Research Report
By Type
AlN DBC Ceramic Substrate, Al2O3 DBC Ceramic Substrate
By Application
IGBT Modules, Automotive, Home Appliances and CPV, Aerospace and Others
By Companies
Rogers/Curamik, KCC, Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics), Heraeus Electronics, Nanjing Zhongjiang New Material Science & Technology, NGK Electronics Devices, Littelfuse IXYS, Remtec, Stellar Industries Corp, Tong Hsing (acquired HCS), Rogers/Curamik
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
225
Number of Tables & Figures
158
Customization Available
Yes, the report can be customized as per your need.
Global Direct Bonded Copper Substrate Market Report Segments:
The global Direct Bonded Copper Substrate market is segmented on the basis of:
Types
AlN DBC Ceramic Substrate, Al2O3 DBC Ceramic Substrate
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
IGBT Modules, Automotive, Home Appliances and CPV, Aerospace and Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Rogers/Curamik
- KCC
- Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics)
- Heraeus Electronics
- Nanjing Zhongjiang New Material Science & Technology
- NGK Electronics Devices
- Littelfuse IXYS
- Remtec
- Stellar Industries Corp
- Tong Hsing (acquired HCS)
- Rogers/Curamik
Highlights of The Direct Bonded Copper Substrate Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- AlN DBC Ceramic Substrate
- Al2O3 DBC Ceramic Substrate
- By Application:
- IGBT Modules
- Automotive
- Home Appliances and CPV
- Aerospace and Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Direct Bonded Copper Substrate Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Direct Bonded Copper Substrate is a type of copper substrate that uses direct bonding technology to create a strong and durable connection between the copper sheet and the PCB. This type of substrate is often used in electronics applications because it offers high performance and reliability.
Some of the major players in the direct bonded copper substrate market are Rogers/Curamik, KCC, Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics), Heraeus Electronics, Nanjing Zhongjiang New Material Science & Technology, NGK Electronics Devices, Littelfuse IXYS, Remtec, Stellar Industries Corp, Tong Hsing (acquired HCS), Rogers/Curamik.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Direct Bonded Copper Substrate Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Direct Bonded Copper Substrate Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Direct Bonded Copper Substrate Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Direct Bonded Copper Substrate Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Direct Bonded Copper Substrate Market Size & Forecast, 2018-2028
4.5.1 Direct Bonded Copper Substrate Market Size and Y-o-Y Growth
4.5.2 Direct Bonded Copper Substrate Market Absolute $ Opportunity
Chapter 5 Global Direct Bonded Copper Substrate Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Direct Bonded Copper Substrate Market Size Forecast by Type
5.2.1 AlN DBC Ceramic Substrate
5.2.2 Al2O3 DBC Ceramic Substrate
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Direct Bonded Copper Substrate Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Direct Bonded Copper Substrate Market Size Forecast by Applications
6.2.1 IGBT Modules
6.2.2 Automotive
6.2.3 Home Appliances and CPV
6.2.4 Aerospace and Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Direct Bonded Copper Substrate Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Direct Bonded Copper Substrate Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Direct Bonded Copper Substrate Analysis and Forecast
9.1 Introduction
9.2 North America Direct Bonded Copper Substrate Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Direct Bonded Copper Substrate Market Size Forecast by Type
9.6.1 AlN DBC Ceramic Substrate
9.6.2 Al2O3 DBC Ceramic Substrate
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Direct Bonded Copper Substrate Market Size Forecast by Applications
9.10.1 IGBT Modules
9.10.2 Automotive
9.10.3 Home Appliances and CPV
9.10.4 Aerospace and Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Direct Bonded Copper Substrate Analysis and Forecast
10.1 Introduction
10.2 Europe Direct Bonded Copper Substrate Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Direct Bonded Copper Substrate Market Size Forecast by Type
10.6.1 AlN DBC Ceramic Substrate
10.6.2 Al2O3 DBC Ceramic Substrate
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Direct Bonded Copper Substrate Market Size Forecast by Applications
10.10.1 IGBT Modules
10.10.2 Automotive
10.10.3 Home Appliances and CPV
10.10.4 Aerospace and Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Direct Bonded Copper Substrate Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Direct Bonded Copper Substrate Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Direct Bonded Copper Substrate Market Size Forecast by Type
11.6.1 AlN DBC Ceramic Substrate
11.6.2 Al2O3 DBC Ceramic Substrate
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Direct Bonded Copper Substrate Market Size Forecast by Applications
11.10.1 IGBT Modules
11.10.2 Automotive
11.10.3 Home Appliances and CPV
11.10.4 Aerospace and Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Direct Bonded Copper Substrate Analysis and Forecast
12.1 Introduction
12.2 Latin America Direct Bonded Copper Substrate Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Direct Bonded Copper Substrate Market Size Forecast by Type
12.6.1 AlN DBC Ceramic Substrate
12.6.2 Al2O3 DBC Ceramic Substrate
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Direct Bonded Copper Substrate Market Size Forecast by Applications
12.10.1 IGBT Modules
12.10.2 Automotive
12.10.3 Home Appliances and CPV
12.10.4 Aerospace and Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Direct Bonded Copper Substrate Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Direct Bonded Copper Substrate Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Direct Bonded Copper Substrate Market Size Forecast by Type
13.6.1 AlN DBC Ceramic Substrate
13.6.2 Al2O3 DBC Ceramic Substrate
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Direct Bonded Copper Substrate Market Size Forecast by Applications
13.10.1 IGBT Modules
13.10.2 Automotive
13.10.3 Home Appliances and CPV
13.10.4 Aerospace and Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Direct Bonded Copper Substrate Market: Competitive Dashboard
14.2 Global Direct Bonded Copper Substrate Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Rogers/Curamik
14.3.2 KCC
14.3.3 Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics)
14.3.4 Heraeus Electronics
14.3.5 Nanjing Zhongjiang New Material Science & Technology
14.3.6 NGK Electronics Devices
14.3.7 Littelfuse IXYS
14.3.8 Remtec
14.3.9 Stellar Industries Corp
14.3.10 Tong Hsing (acquired HCS)
14.3.11 Rogers/Curamik
