Market Overview:
The global dry etching equipment market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices and miniaturization of electronic components. In addition, the growing demand for 3D integrated circuits (ICs) is also contributing to the growth of this market. On the basis of type, inductively coupled plasma (ICP) accounted for the largest share in 2017 and is expected to maintain its dominance during the forecast period. This can be attributed to its ability to provide high-quality results with low overhang and sidewall profiles.
Product Definition:
Dry etching equipment is used to chemically remove material from a surface. The importance of dry etching equipment is that it can be used to create very precise and detailed patterns on a surface.
Inductively Coupled Plasma (ICP):
Inductively coupled plasma (ICP) is a chemical process that produces an ionized gas from a non-ionized one. ICP is used in industries such as petrochemical, oil & gas, and pharmaceuticals for various applications such as detection of trace metals in blood or urine samples; determination of the presence or absence of certain elements in raw materials; and analysis of complex mixtures.
The global dry etching equipment market size was valued at USD 3.
Capacitive Coupled Plasma (CCP):
Plasma is a state of matter similar to gas in which solid particles are suspended in a gaseous medium. It is created when gases are introduced under high pressure and temperature (plasma bar) or low pressure and high temperature (plasma jet). The most commonly used plasma for industrial applications is the cold-neutral plasma (CNP), which has lower temperatures than the neutral gas phase, typically ranging from -50°C to -150°C.
Application Insights:
The market is segmented by application into logic and memory, microelectronics, power devices, and others. The other applications include medical equipment manufacturing and industrial machinery. Dry etching is used in the production of various electronic components such as integrated circuits (ICs), sensors, capacitors, resistors etc. using different types of etchants such as ICP-based systems for deep reactive ion etching (DRIE) or RIE for planarization of chips or wafer level packaging (WLP).
Logic and memory was the largest application segment in 2017 with a revenue share of over 40% owing to increasing demand from semiconductor manufacturers for advanced products with higher storage capacity at affordable costs. Semiconductor manufacturers are continuously working towards miniaturization resulting in increased demand for dry etched systems to meet this challenge especially during initial stages when production rates are low.
Regional Analysis:
Asia Pacific dominated the global dry etching equipment market in 2016 with a revenue share of over 38%. The region is expected to maintain its dominance throughout the forecast period. This can be attributed to increasing demand for advanced technology products, such as integrated circuits and memory devices, which require high-quality surface treatments. Moreover, rising investments by key players in developing countries of Asia Pacific are anticipated to boost regional growth during the forecast period.
The market in North America is expected to grow at a significant rate from 2017 to 2030 owing to growing technological advancements and increased focus on energy conservation among manufacturers operating within this region. Furthermore, presence of major industry participants with extensive experience in R&D will help them capitalize on opportunities arising from future technological developments thus contributing towards overall regional growth during the same period.
In Europe, ICP dry etching equipment was found dominate the market followed by Reactive Ion Etching (RIE) due their similar applications across various industries including military & aerospace.
Growth Factors:
- Increasing demand for semiconductor devices
- Rising demand from the optoelectronics and MEMS industries
- Growing popularity of 3D printing technology
- Proliferation of nanotechnology and miniaturization trend in electronics industry
- Technological advancements in dry etching equipment
Scope Of The Report
Report Attributes
Report Details
Report Title
Dry Etching Equipment Market Research Report
By Type
Inductively Coupled Plasma (ICP), Capacitive Coupled Plasma (CCP), Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE), Others
By Application
Logic and Memory, MEMS, Power Device, Others
By Companies
Lam Research, TEL, Applied Materials, Hitachi High-Technologies, Oxford Instruments, ULVAC, SPTS Technologies, GigaLane, Plasma-Therm, SAMCO, AMEC, NAURA
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
202
Number of Tables & Figures
142
Customization Available
Yes, the report can be customized as per your need.
Global Dry Etching Equipment Market Report Segments:
The global Dry Etching Equipment market is segmented on the basis of:
Types
Inductively Coupled Plasma (ICP), Capacitive Coupled Plasma (CCP), Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE), Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Logic and Memory, MEMS, Power Device, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Lam Research
- TEL
- Applied Materials
- Hitachi High-Technologies
- Oxford Instruments
- ULVAC
- SPTS Technologies
- GigaLane
- Plasma-Therm
- SAMCO
- AMEC
- NAURA
Highlights of The Dry Etching Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Inductively Coupled Plasma (ICP)
- Capacitive Coupled Plasma (CCP)
- Reactive Ion Etching (RIE)
- Deep Reactive Ion Etching (DRIE)
- Others
- By Application:
- Logic and Memory
- MEMS
- Power Device
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Dry Etching Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Dry etching equipment is used to remove material by a process of chemical vapor deposition. The equipment uses an electron beam to create a vacuum and heat the surface of the workpiece until it melts. This liquid metal then flows into a depression in the tool, where it is drawn off by capillary action.
Some of the major players in the dry etching equipment market are Lam Research, TEL, Applied Materials, Hitachi High-Technologies, Oxford Instruments, ULVAC, SPTS Technologies, GigaLane, Plasma-Therm, SAMCO, AMEC, NAURA.
The dry etching equipment market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Dry Etching Equipment Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Dry Etching Equipment Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Dry Etching Equipment Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Dry Etching Equipment Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Dry Etching Equipment Market Size & Forecast, 2020-2028
4.5.1 Dry Etching Equipment Market Size and Y-o-Y Growth
4.5.2 Dry Etching Equipment Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Inductively Coupled Plasma (ICP)
5.2.2 Capacitive Coupled Plasma (CCP)
5.2.3 Reactive Ion Etching (RIE)
5.2.4 Deep Reactive Ion Etching (DRIE)
5.2.5 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Logic and Memory
6.2.2 MEMS
6.2.3 Power Device
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Dry Etching Equipment Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Dry Etching Equipment Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Inductively Coupled Plasma (ICP)
9.6.2 Capacitive Coupled Plasma (CCP)
9.6.3 Reactive Ion Etching (RIE)
9.6.4 Deep Reactive Ion Etching (DRIE)
9.6.5 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Logic and Memory
9.10.2 MEMS
9.10.3 Power Device
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Inductively Coupled Plasma (ICP)
10.6.2 Capacitive Coupled Plasma (CCP)
10.6.3 Reactive Ion Etching (RIE)
10.6.4 Deep Reactive Ion Etching (DRIE)
10.6.5 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Logic and Memory
10.10.2 MEMS
10.10.3 Power Device
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Inductively Coupled Plasma (ICP)
11.6.2 Capacitive Coupled Plasma (CCP)
11.6.3 Reactive Ion Etching (RIE)
11.6.4 Deep Reactive Ion Etching (DRIE)
11.6.5 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Logic and Memory
11.10.2 MEMS
11.10.3 Power Device
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Inductively Coupled Plasma (ICP)
12.6.2 Capacitive Coupled Plasma (CCP)
12.6.3 Reactive Ion Etching (RIE)
12.6.4 Deep Reactive Ion Etching (DRIE)
12.6.5 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Logic and Memory
12.10.2 MEMS
12.10.3 Power Device
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Inductively Coupled Plasma (ICP)
13.6.2 Capacitive Coupled Plasma (CCP)
13.6.3 Reactive Ion Etching (RIE)
13.6.4 Deep Reactive Ion Etching (DRIE)
13.6.5 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Logic and Memory
13.10.2 MEMS
13.10.3 Power Device
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Dry Etching Equipment Market: Competitive Dashboard
14.2 Global Dry Etching Equipment Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Lam Research
14.3.2 TEL
14.3.3 Applied Materials
14.3.4 Hitachi High-Technologies
14.3.5 Oxford Instruments
14.3.6 ULVAC
14.3.7 SPTS Technologies
14.3.8 GigaLane
14.3.9 Plasma-Therm
14.3.10 SAMCO
14.3.11 AMEC
14.3.12 NAURA
