Market Overview:
The global electroless nickel immersion gold (ENIG) market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The other type segment is expected to grow at the highest CAGR during the forecast period. The PCB industry segment is expected to hold the largest share of the global ENIG market in 2018. Asia Pacific is expected to be the fastest-growing region during the forecast period.
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Product Definition:
Electroless nickel immersion gold (ENIG) is a type of plating used to protect copper-based surfaces from corrosion and to improve their electrical conductivity. ENIG plating is composed of a thin layer of gold that is deposited on a surface using an electroless process, followed by a thicker layer of nickel. The combination of these two layers provides good protection against corrosion and improves the electrical conductivity of the underlying metal.
0.05-0.1 µm Gold:
0.05-0.1 µm Gold is also known as colloidal gold and is a suspension of solid particles in a liquid solution of nitric acid and hydrogen cyanide. It's color depends on the concentration but it can be anywhere between yellow to orange brown depending on the exact composition of the solution used while processing it.
Other:
Other is a compound of nickel and metal from another group or family which includes copper, zinc, iron, etc. It has no relation with the term "otherwise" as used in programming languages. The other metals are usually used to make stainless steel; however ENIG is not stainless so it uses different metals such as gold and silver for its plating bath.
Application Insights:
The PCB industry was the largest application segment in 2017 and is expected to continue its dominance over the forecast period. The electroless nickel immersion gold process reduces waste and improves overall efficiency of the plants, which are major factors driving its demand in this application.
Electroless nickel immersion gold offers several advantages such as high-quality product with low cost, less energy consumption, no pollution generation due to reduced use of chemicals during production process and also provides a uniform coating over large areas thus making it an ideal choice for industrial applications.
Other applications include medical equipment & devices manufacturing, solar panels (ENIG is used as a protective layer) and others. High-cost associated with these processes makes it unviable in some cases; however, low-cost compared to other deposition techniques such as sputtering or vapor deposition remains an attractive feature that cannot be ignored by manufacturers across various industries globally.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to rising product demand from end-use industries such as electronics, automotive, medical devices, etc. China is one of the largest producers and consumers of electroless nickel immersion gold in this region owing to presence of a large number of manufacturers and assemblers located there.
Europe accounted for a significant share in terms of revenue due to high production volume realized by European companies through their local manufacturing units or joint ventures with foreign partners. North America ENIG market size was estimated at USD X million based on statistics provided by ENA Technology Inc., an American company specialized in providing solutions for industrial coating using electroless nickel immersion technology (ENIG).
North America has been witnessing steady growth since past few years on account that increasing use electronic products such as smartphones.
Growth Factors:
- ENIG offers superior surface finish and electrical performance as compared to other finishes, such as HASL and immersion silver. This makes it an attractive option for applications that require high reliability and performance.
- ENIG is a cost-effective alternative to hard gold plating, which makes it popular among manufacturers looking for a low-cost solution that still delivers high quality results.
- The environmental benefits of using ENIG instead of traditional plating processes also make it a more sustainable option for many manufacturers.
- ENIG has good resistance to corrosion and oxidation, making it ideal for applications in harsh environments or those that are exposed to moisture or other corrosive elements.
Scope Of The Report
Report Attributes
Report Details
Report Title
Electroless Nickel Immersion Gold(ENIG) Market Research Report
By Type
0.05-0.1 µm Gold, Other
By Application
PCB Industry, Other
By Companies
Würth Elektronik Group, Guangdong Guanghua Sci-Tech, Uyemura, Umicore, MacDermid Alpha Electronics Solutions
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
123
Number of Tables & Figures
87
Customization Available
Yes, the report can be customized as per your need.
Global Electroless Nickel Immersion Gold(ENIG) Market Report Segments:
The global Electroless Nickel Immersion Gold(ENIG) market is segmented on the basis of:
Types
0.05-0.1 µm Gold, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
PCB Industry, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Würth Elektronik Group
- Guangdong Guanghua Sci-Tech
- Uyemura
- Umicore
- MacDermid Alpha Electronics Solutions
 Market Overview.svg)
Highlights of The Electroless Nickel Immersion Gold(ENIG) Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 0.05-0.1 µm Gold
- Other
- By Application:
- PCB Industry
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Electroless Nickel Immersion Gold(ENIG) Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
 Market Statistics.svg)
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
ENIG is a process that uses electroless nickel to remove gold from an ore. The nickel creates a thin film on the surface of the gold, which is then removed by a chemical reaction.
Some of the key players operating in the electroless nickel immersion gold(enig) market are W¼rth Elektronik Group, Guangdong Guanghua Sci-Tech, Uyemura, Umicore, MacDermid Alpha Electronics Solutions.
The electroless nickel immersion gold(enig) market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Electroless Nickel Immersion Gold(ENIG) Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Electroless Nickel Immersion Gold(ENIG) Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Electroless Nickel Immersion Gold(ENIG) Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Electroless Nickel Immersion Gold(ENIG) Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Electroless Nickel Immersion Gold(ENIG) Market Size & Forecast, 2020-2028
4.5.1 Electroless Nickel Immersion Gold(ENIG) Market Size and Y-o-Y Growth
4.5.2 Electroless Nickel Immersion Gold(ENIG) Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 0.05-0.1 µm Gold
5.2.2 Other
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 PCB Industry
6.2.2 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Electroless Nickel Immersion Gold(ENIG) Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Electroless Nickel Immersion Gold(ENIG) Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 0.05-0.1 µm Gold
9.6.2 Other
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 PCB Industry
9.10.2 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 0.05-0.1 µm Gold
10.6.2 Other
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 PCB Industry
10.10.2 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 0.05-0.1 µm Gold
11.6.2 Other
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 PCB Industry
11.10.2 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 0.05-0.1 µm Gold
12.6.2 Other
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 PCB Industry
12.10.2 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 0.05-0.1 µm Gold
13.6.2 Other
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 PCB Industry
13.10.2 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Electroless Nickel Immersion Gold(ENIG) Market: Competitive Dashboard
14.2 Global Electroless Nickel Immersion Gold(ENIG) Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Würth Elektronik Group
14.3.2 Guangdong Guanghua Sci-Tech
14.3.3 Uyemura
14.3.4 Umicore
14.3.5 MacDermid Alpha Electronics Solutions
