Market Overview:
The global electronic assembly materials market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for consumer electronics and automotive products. In addition, the growing demand for defense and aerospace applications is also contributing to the growth of this market. The global electronic assembly materials market by type is segmented into adhesives, paste fluxes, electrically conductive materials, and thermal interface materials. The adhesive segment is expected to grow at a CAGR of 6% from 2018 to 2030. This growth can be attributed to the increasing demand for adhesives in consumer electronics and automotive applications.
Product Definition:
Assembly materials are the components used in electronic assemblies. They can be divided into two categories: passive and active. Passive components are resistors, capacitors, and inductors. Active components are transistors, diodes, and integrated circuits.
Adhesives:
Adhesives are used in electronic assembly for interconnecting circuit boards and other substrates. They provide mechanical strength to the assembled product and also help in preventing disassembly. The major application of adhesives is found in the electronics industry, where they are used for securing various components on a printed circuit board (PCB). Other major applications include woodworking, general engineering & construction industries, automotive industry as well as packaging applications.
Paste Fluxes:
Paste fluxes are used in soldering and brazing operations to prevent the adhesion of oxides to the metal surfaces. They also have applications as cleaning agents for removing unwanted oxides from various parts during assembly. Paste fluxes can be either synthetic or natural based on their composition, but they should contain tin (Sn) and/or lead (Pb) as base metals.
Application Insights:
The automotive segment accounted for the largest revenue share in 2016 and is projected to continue its dominance over the forecast period. The growth of this segment can be attributed to increasing demand for electric vehicles from countries, such as China, Germany and Japan. These countries are leading in research & development activities in the automotive sector which is also a key driver for product adoption.
Electronic assembly materials help reduce weight of an automobile by approximately 15% without affecting its performance or durability. This will result into increased production of electric vehicles globally which will further propel market growth over the coming years.
The consumer & industrial application segment was valued at USD 1,000 million in 2016 owing to high usage across consumer electronics products including smartphones and tablets that are increasingly being exported from developed economies such as North America and Europe to developing regions like Asia Pacific.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing region over the forecast period owing to increasing demand from end-use industries, such as consumer appliances and automotive. The presence of a large number of manufacturers in China and Taiwan along with growing investments by foreign players in India is likely to boost market growth. In addition, favorable government regulations for promoting manufacturing activities are anticipated to propel industry expansion over the next eight years.
The European market was valued at USD X million in 2017 and is projected to witness moderate growth over the forecast period owing to stringent environmental regulations that have restricted production volumes of electronic products within Europe itself. However, rising R&D expenditure on product innovation by companies operating within Europe will augment regional demand during the forecast period.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Growing trend of disposable and low-cost electronics
- Proliferation of smart devices and the Internet of Things (IoT)
- Rising demand from automotive and aerospace industries
- Emergence of new materials and technologies
Scope Of The Report
Report Attributes
Report Details
Report Title
Electronic Assembly Materials Market Research Report
By Type
Adhesives, Paste Fluxes, Electrically Conductive Materials, Thermal Interface Materials
By Application
automotive, consumer & industrial, defense & aerospace, Automotive, Consumer & Industrial, Defense & Aerospace
By Companies
Kelly Services Inc., Hisco, Inc., Henkel Corporation, H.B. Fuller, ITW, Kester
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
150
Number of Tables & Figures
105
Customization Available
Yes, the report can be customized as per your need.
Global Electronic Assembly Materials Market Report Segments:
The global Electronic Assembly Materials market is segmented on the basis of:
Types
Adhesives, Paste Fluxes, Electrically Conductive Materials, Thermal Interface Materials
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
automotive, consumer & industrial, defense & aerospace, Automotive, Consumer & Industrial, Defense & Aerospace
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Kelly Services Inc.
- Hisco, Inc.
- Henkel Corporation
- H.B. Fuller
- ITW
- Kester
Highlights of The Electronic Assembly Materials Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Adhesives
- Paste Fluxes
- Electrically Conductive Materials
- Thermal Interface Materials
- By Application:
- automotive, consumer & industrial, defense & aerospace
- Automotive
- Consumer & Industrial
- Defense & Aerospace
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Electronic Assembly Materials Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Electronic Assembly Materials (EAM) is a term used to describe the assembly of electronic components using an automated process. EAM can be used for both small and large-scale assemblies, and it has the potential to reduce costs and improve quality.
Some of the major companies in the electronic assembly materials market are Kelly Services Inc., Hisco, Inc., Henkel Corporation, H.B. Fuller, ITW, Kester.
The electronic assembly materials market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Electronic Assembly Materials Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Electronic Assembly Materials Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Electronic Assembly Materials Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Electronic Assembly Materials Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Electronic Assembly Materials Market Size & Forecast, 2018-2028
4.5.1 Electronic Assembly Materials Market Size and Y-o-Y Growth
4.5.2 Electronic Assembly Materials Market Absolute $ Opportunity
Chapter 5 Global Electronic Assembly Materials Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Electronic Assembly Materials Market Size Forecast by Type
5.2.1 Adhesives
5.2.2 Paste Fluxes
5.2.3 Electrically Conductive Materials
5.2.4 Thermal Interface Materials
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Electronic Assembly Materials Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Electronic Assembly Materials Market Size Forecast by Applications
6.2.1 automotive
6.2.2 consumer & industrial
6.2.3 defense & aerospace
6.2.4 Automotive
6.2.5 Consumer & Industrial
6.2.6 Defense & Aerospace
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Electronic Assembly Materials Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Electronic Assembly Materials Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Electronic Assembly Materials Analysis and Forecast
9.1 Introduction
9.2 North America Electronic Assembly Materials Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Electronic Assembly Materials Market Size Forecast by Type
9.6.1 Adhesives
9.6.2 Paste Fluxes
9.6.3 Electrically Conductive Materials
9.6.4 Thermal Interface Materials
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Electronic Assembly Materials Market Size Forecast by Applications
9.10.1 automotive
9.10.2 consumer & industrial
9.10.3 defense & aerospace
9.10.4 Automotive
9.10.5 Consumer & Industrial
9.10.6 Defense & Aerospace
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Electronic Assembly Materials Analysis and Forecast
10.1 Introduction
10.2 Europe Electronic Assembly Materials Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Electronic Assembly Materials Market Size Forecast by Type
10.6.1 Adhesives
10.6.2 Paste Fluxes
10.6.3 Electrically Conductive Materials
10.6.4 Thermal Interface Materials
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Electronic Assembly Materials Market Size Forecast by Applications
10.10.1 automotive
10.10.2 consumer & industrial
10.10.3 defense & aerospace
10.10.4 Automotive
10.10.5 Consumer & Industrial
10.10.6 Defense & Aerospace
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Electronic Assembly Materials Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Electronic Assembly Materials Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Electronic Assembly Materials Market Size Forecast by Type
11.6.1 Adhesives
11.6.2 Paste Fluxes
11.6.3 Electrically Conductive Materials
11.6.4 Thermal Interface Materials
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Electronic Assembly Materials Market Size Forecast by Applications
11.10.1 automotive
11.10.2 consumer & industrial
11.10.3 defense & aerospace
11.10.4 Automotive
11.10.5 Consumer & Industrial
11.10.6 Defense & Aerospace
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Electronic Assembly Materials Analysis and Forecast
12.1 Introduction
12.2 Latin America Electronic Assembly Materials Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Electronic Assembly Materials Market Size Forecast by Type
12.6.1 Adhesives
12.6.2 Paste Fluxes
12.6.3 Electrically Conductive Materials
12.6.4 Thermal Interface Materials
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Electronic Assembly Materials Market Size Forecast by Applications
12.10.1 automotive
12.10.2 consumer & industrial
12.10.3 defense & aerospace
12.10.4 Automotive
12.10.5 Consumer & Industrial
12.10.6 Defense & Aerospace
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Electronic Assembly Materials Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Electronic Assembly Materials Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Electronic Assembly Materials Market Size Forecast by Type
13.6.1 Adhesives
13.6.2 Paste Fluxes
13.6.3 Electrically Conductive Materials
13.6.4 Thermal Interface Materials
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Electronic Assembly Materials Market Size Forecast by Applications
13.10.1 automotive
13.10.2 consumer & industrial
13.10.3 defense & aerospace
13.10.4 Automotive
13.10.5 Consumer & Industrial
13.10.6 Defense & Aerospace
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Electronic Assembly Materials Market: Competitive Dashboard
14.2 Global Electronic Assembly Materials Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Kelly Services Inc.
14.3.2 Hisco, Inc.
14.3.3 Henkel Corporation
14.3.4 H.B. Fuller
14.3.5 ITW
14.3.6 Kester
