Market Overview:
The global electronic board level underfill and encapsulation material market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor electronics devices and the growing adoption of advanced packaging technologies. In addition, the increasing demand for aviation & aerospace and medical devices is also contributing to the growth of this market.
Product Definition:
Electronic board level underfill and encapsulation material is a viscous, adhesive material that is applied to the bottom surface of an electronic component or circuit board. The material fills in any gaps between the component or circuit board and the surface on which it sits, providing support and protection from vibration and shock. Additionally, underfill can help to dissipate heat from components, improving their overall performance.
No Flow Underfill:
No Flow Underfill (NUF) is a material used in electronic board level underfill and encapsulation material market. It has no flow characteristics during the filling process, thus it provides better reliability and performance of the finished product. NUF can be utilized for both non-flowable as well as flowable materials; however, it is majorly used for non-flowable materials due to its ease of use.
Capillary Underfill:
Capillary underfill is a low-cost filler material that is added to the electronic component during the manufacturing process. It has high flow rate and viscosity as compared to other conventional fillers such as sand, talc, or ceramic powder. The material flows into all kinds of porous and nonporous substrates due to its unique molecular structure which allows it pass through small openings in the substrate while maintaining its integrity.
Application Insights:
The market is segmented by application into semiconductor electronics device, aviation & aerospace, medical devices, and others. The other applications include consumer electronics and automotive electronic board level packaging. Electronic board level underfill is used in various types of electronic devices including integrated circuits (ICs), digital storage media (DSM), programmable logic controllers (PLCs), microcontrollers (MCUs) and supervisory control & data Acquisition systems (SC&DAS).
Semiconductor electronics accounted for the largest share in terms of revenue as well as volume in 2017 owing to increasing demand for IC over the past few years. The growing demand for high-tech products coupled with a rapid growth rate of semiconductor industry has resulted in an increased use of encapsulation materials to improve fill density which further boosts product demand across this sector.
Regional Analysis:
The Asia Pacific region accounted for the largest market share in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to rising demand from end-use industries such as aerospace & defense, automotive, medical devices, consumer electronics and others.
Rapid industrialization in China and India coupled with favorable government policies aimed at promoting investments in various sectors including semiconductors is anticipated to boost product demand over the forecast period. In addition, increasing foreign direct investments by Japanese companies such as Toyota Industries Corporation; Fujitsu Ltd.; Mitsubishi Electric Factory Automation Ltd.; Hitachi, Ltd., Toshiba Corporation; Panasonic Corporation; Nikon Corp., among many others are anticipated to drive electronic board level underfill and encapsulation material market growth over the next eight years.
In North America electronic board level underfill.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive and aerospace industries
- Growing popularity of LED lighting
- Proliferation of 3D printing technology
- Development of next-generation semiconductor technologies
Scope Of The Report
Report Attributes
Report Details
Report Title
Electronic Board Level Underfill and Encapsulation Material Market Research Report
By Type
No Flow Underfill, Capillary Underfill, Molded Underfill, Wafer level Underfill
By Application
Semiconductor Electronics Device, Aviation & Aerospace, Medical Devices, Others
By Companies
Fuller, Masterbond, Zymet, Namics, Epoxy Technology, Yincae Advanced Materials, Henkel, Fuller
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
190
Number of Tables & Figures
133
Customization Available
Yes, the report can be customized as per your need.
Global Electronic Board Level Underfill and Encapsulation Material Market Report Segments:
The global Electronic Board Level Underfill and Encapsulation Material market is segmented on the basis of:
Types
No Flow Underfill, Capillary Underfill, Molded Underfill, Wafer level Underfill
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Semiconductor Electronics Device, Aviation & Aerospace, Medical Devices, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Fuller
- Masterbond
- Zymet
- Namics
- Epoxy Technology
- Yincae Advanced Materials
- Henkel
- Fuller
Highlights of The Electronic Board Level Underfill and Encapsulation Material Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- No Flow Underfill
- Capillary Underfill
- Molded Underfill
- Wafer level Underfill
- By Application:
- Semiconductor Electronics Device
- Aviation & Aerospace
- Medical Devices
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Electronic Board Level Underfill and Encapsulation Material Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
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- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Electronic board level underfill and encapsulation material is a type of insulation material used in electronic equipment. It is made up of small pieces of plastic or other materials that are placed between the boards on an electronic device to keep them from touching each other and causing electrical interference.
Some of the major companies in the electronic board level underfill and encapsulation material market are Fuller, Masterbond, Zymet, Namics, Epoxy Technology, Yincae Advanced Materials, Henkel, Fuller.
The electronic board level underfill and encapsulation material market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Electronic Board Level Underfill and Encapsulation Material Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Electronic Board Level Underfill and Encapsulation Material Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Electronic Board Level Underfill and Encapsulation Material Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Electronic Board Level Underfill and Encapsulation Material Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Electronic Board Level Underfill and Encapsulation Material Market Size & Forecast, 2018-2028
4.5.1 Electronic Board Level Underfill and Encapsulation Material Market Size and Y-o-Y Growth
4.5.2 Electronic Board Level Underfill and Encapsulation Material Market Absolute $ Opportunity
Chapter 5 Global Electronic Board Level Underfill and Encapsulation Material Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Type
5.2.1 No Flow Underfill
5.2.2 Capillary Underfill
5.2.3 Molded Underfill
5.2.4 Wafer level Underfill
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Electronic Board Level Underfill and Encapsulation Material Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Applications
6.2.1 Semiconductor Electronics Device
6.2.2 Aviation & Aerospace
6.2.3 Medical Devices
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Electronic Board Level Underfill and Encapsulation Material Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Electronic Board Level Underfill and Encapsulation Material Analysis and Forecast
9.1 Introduction
9.2 North America Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Type
9.6.1 No Flow Underfill
9.6.2 Capillary Underfill
9.6.3 Molded Underfill
9.6.4 Wafer level Underfill
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Applications
9.10.1 Semiconductor Electronics Device
9.10.2 Aviation & Aerospace
9.10.3 Medical Devices
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Electronic Board Level Underfill and Encapsulation Material Analysis and Forecast
10.1 Introduction
10.2 Europe Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Type
10.6.1 No Flow Underfill
10.6.2 Capillary Underfill
10.6.3 Molded Underfill
10.6.4 Wafer level Underfill
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Applications
10.10.1 Semiconductor Electronics Device
10.10.2 Aviation & Aerospace
10.10.3 Medical Devices
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Electronic Board Level Underfill and Encapsulation Material Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Type
11.6.1 No Flow Underfill
11.6.2 Capillary Underfill
11.6.3 Molded Underfill
11.6.4 Wafer level Underfill
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Applications
11.10.1 Semiconductor Electronics Device
11.10.2 Aviation & Aerospace
11.10.3 Medical Devices
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Electronic Board Level Underfill and Encapsulation Material Analysis and Forecast
12.1 Introduction
12.2 Latin America Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Type
12.6.1 No Flow Underfill
12.6.2 Capillary Underfill
12.6.3 Molded Underfill
12.6.4 Wafer level Underfill
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Applications
12.10.1 Semiconductor Electronics Device
12.10.2 Aviation & Aerospace
12.10.3 Medical Devices
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Electronic Board Level Underfill and Encapsulation Material Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Type
13.6.1 No Flow Underfill
13.6.2 Capillary Underfill
13.6.3 Molded Underfill
13.6.4 Wafer level Underfill
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Applications
13.10.1 Semiconductor Electronics Device
13.10.2 Aviation & Aerospace
13.10.3 Medical Devices
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Electronic Board Level Underfill and Encapsulation Material Market: Competitive Dashboard
14.2 Global Electronic Board Level Underfill and Encapsulation Material Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Fuller
14.3.2 Masterbond
14.3.3 Zymet
14.3.4 Namics
14.3.5 Epoxy Technology
14.3.6 Yincae Advanced Materials
14.3.7 Henkel
14.3.8 Fuller
