Market Overview:
The global electronic grade adhesive material market is expected to grow at a CAGR of 5.8% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for electronic grade adhesive materials in various applications, such as automotive electronics, consumer electronics, aerospace and medical. In addition, the growing demand for high performance pressure sensitive adhesives is also contributing to the growth of this market.
Product Definition:
An adhesive material used in electronic applications, typically to attach a component to a printed circuit board. Electronic grade adhesive materials are typically low-viscosity liquids or pastes that provide good electrical and mechanical properties. They are important for ensuring reliable electrical connections and preventing short circuits.
Conductive Adhesive:
Conductive adhesive is a material that can be made from various inorganic compounds and organic materials. The most widely used inorganic compound is silver, which has high electrical conductivity. Silver based conductive adhesives are commonly known as silver bromide or colloidal silver.
Optical Grade Pressure Sensitive Adhesive:
Optical grade pressure sensitive adhesives (OGPSAs) are a special type of pressure sensitive adhesive that is used in electronic grade adhesive materials. Optical grade products have properties such as high bond strength, immediate tack, and good wetting out. These products also offer easy removal from the substrate after curing and do not require any solvents to remove the product from the surface.
Application Insights:
The automotive electronics application segment accounted for the largest revenue share in 2016 and is projected to continue its dominance over the forecast period. The growth of this segment can be attributed to increasing demand for electronic devices in automobiles, which require strong adhesion between components.
Electronic grade adhesive finds applications in various automotive electronics such as infotainment systems, navigation systems, car audio systems and body wiring harnesses among others. Its usage allows easy assembly of these complex devices while ensuring high bond strength and reliability between components. It also helps reduce wastage during production by providing a reliable platform on which automated machines can perform their functions with accuracy thereby reducing human errors during production process. These advantages are expected to drive its demand over the coming years especially during manufacturing stages of highly automated vehicles where reliability is crucial for success chances of project implementation completion dates or financial investors eyesight date regarding return on investment (ROI).
Regional Analysis:
Asia Pacific is expected to be the largest and fastest-growing regional segment over the forecast period. The region has been witnessing strong economic growth on account of rapid industrialization, which in turn is driving product demand across a wide range of industries including automotive, consumer electronics, medical devices and others.
The growing population coupled with rising disposable income levels in emerging economies such as China and India are likely to boost product consumption across various applications. Furthermore, increasing government initiatives for manufacturing vehicles that are environment-friendly will drive industry growth over the coming years.
North America held a significant share in 2017 owing to high investments by key companies towards research & development activities for developing innovative electronic components at their production facilities located throughout U.S., Canada and Mexico for delivery worldwide within tight timelines require high-quality materials with superior performance characteristics such as excellent mechanical strength along with resistance against climatic hazards such as moisture & heat etc.
Growth Factors:
- Increasing demand for electronic products from developing countries
- Rising disposable income of consumers in developing countries
- Growing trend of miniaturization in electronics industry
- Proliferation of smart devices and the Internet of Things (IoT)
- Emergence of new adhesive materials with better performance
Scope Of The Report
Report Attributes
Report Details
Report Title
Electronic Grade Adhesive Material Market Research Report
By Type
Conductive Adhesive, Optical Grade Pressure Sensitive Adhesive, High Performance Pressure Sensitive Adhesive, Other
By Application
Automotive Electronics, Consumer Electronics, Aerospace, Medical
By Companies
3M, Tesa, Nitto, Sidike, Henkel, DuPont, Avery Dennison, ThreeBond, Hitachi, Epoxy, Creative Materials, Rogers Corporation
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
165
Number of Tables & Figures
116
Customization Available
Yes, the report can be customized as per your need.
Global Electronic Grade Adhesive Material Market Report Segments:
The global Electronic Grade Adhesive Material market is segmented on the basis of:
Types
Conductive Adhesive, Optical Grade Pressure Sensitive Adhesive, High Performance Pressure Sensitive Adhesive, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotive Electronics, Consumer Electronics, Aerospace, Medical
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- 3M
- Tesa
- Nitto
- Sidike
- Henkel
- DuPont
- Avery Dennison
- ThreeBond
- Hitachi
- Epoxy
- Creative Materials
- Rogers Corporation
Highlights of The Electronic Grade Adhesive Material Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Conductive Adhesive
- Optical Grade Pressure Sensitive Adhesive
- High Performance Pressure Sensitive Adhesive
- Other
- By Application:
- Automotive Electronics
- Consumer Electronics
- Aerospace
- Medical
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Electronic Grade Adhesive Material Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Electronic grade adhesive material is a type of adhesive that is made up of small electronic devices. These devices are used to create an adhesive that can stick to many different surfaces.
Some of the major players in the electronic grade adhesive material market are 3M, Tesa, Nitto, Sidike, Henkel, DuPont, Avery Dennison, ThreeBond, Hitachi, Epoxy, Creative Materials, Rogers Corporation.
The electronic grade adhesive material market is expected to register a CAGR of 5.8%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Electronic Grade Adhesive Material Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Electronic Grade Adhesive Material Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Electronic Grade Adhesive Material Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Electronic Grade Adhesive Material Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Electronic Grade Adhesive Material Market Size & Forecast, 2018-2028
4.5.1 Electronic Grade Adhesive Material Market Size and Y-o-Y Growth
4.5.2 Electronic Grade Adhesive Material Market Absolute $ Opportunity
Chapter 5 Global Electronic Grade Adhesive Material Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Electronic Grade Adhesive Material Market Size Forecast by Type
5.2.1 Conductive Adhesive
5.2.2 Optical Grade Pressure Sensitive Adhesive
5.2.3 High Performance Pressure Sensitive Adhesive
5.2.4 Other
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Electronic Grade Adhesive Material Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Electronic Grade Adhesive Material Market Size Forecast by Applications
6.2.1 Automotive Electronics
6.2.2 Consumer Electronics
6.2.3 Aerospace
6.2.4 Medical
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Electronic Grade Adhesive Material Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Electronic Grade Adhesive Material Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Electronic Grade Adhesive Material Analysis and Forecast
9.1 Introduction
9.2 North America Electronic Grade Adhesive Material Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Electronic Grade Adhesive Material Market Size Forecast by Type
9.6.1 Conductive Adhesive
9.6.2 Optical Grade Pressure Sensitive Adhesive
9.6.3 High Performance Pressure Sensitive Adhesive
9.6.4 Other
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Electronic Grade Adhesive Material Market Size Forecast by Applications
9.10.1 Automotive Electronics
9.10.2 Consumer Electronics
9.10.3 Aerospace
9.10.4 Medical
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Electronic Grade Adhesive Material Analysis and Forecast
10.1 Introduction
10.2 Europe Electronic Grade Adhesive Material Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Electronic Grade Adhesive Material Market Size Forecast by Type
10.6.1 Conductive Adhesive
10.6.2 Optical Grade Pressure Sensitive Adhesive
10.6.3 High Performance Pressure Sensitive Adhesive
10.6.4 Other
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Electronic Grade Adhesive Material Market Size Forecast by Applications
10.10.1 Automotive Electronics
10.10.2 Consumer Electronics
10.10.3 Aerospace
10.10.4 Medical
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Electronic Grade Adhesive Material Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Electronic Grade Adhesive Material Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Electronic Grade Adhesive Material Market Size Forecast by Type
11.6.1 Conductive Adhesive
11.6.2 Optical Grade Pressure Sensitive Adhesive
11.6.3 High Performance Pressure Sensitive Adhesive
11.6.4 Other
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Electronic Grade Adhesive Material Market Size Forecast by Applications
11.10.1 Automotive Electronics
11.10.2 Consumer Electronics
11.10.3 Aerospace
11.10.4 Medical
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Electronic Grade Adhesive Material Analysis and Forecast
12.1 Introduction
12.2 Latin America Electronic Grade Adhesive Material Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Electronic Grade Adhesive Material Market Size Forecast by Type
12.6.1 Conductive Adhesive
12.6.2 Optical Grade Pressure Sensitive Adhesive
12.6.3 High Performance Pressure Sensitive Adhesive
12.6.4 Other
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Electronic Grade Adhesive Material Market Size Forecast by Applications
12.10.1 Automotive Electronics
12.10.2 Consumer Electronics
12.10.3 Aerospace
12.10.4 Medical
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Electronic Grade Adhesive Material Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Electronic Grade Adhesive Material Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Electronic Grade Adhesive Material Market Size Forecast by Type
13.6.1 Conductive Adhesive
13.6.2 Optical Grade Pressure Sensitive Adhesive
13.6.3 High Performance Pressure Sensitive Adhesive
13.6.4 Other
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Electronic Grade Adhesive Material Market Size Forecast by Applications
13.10.1 Automotive Electronics
13.10.2 Consumer Electronics
13.10.3 Aerospace
13.10.4 Medical
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Electronic Grade Adhesive Material Market: Competitive Dashboard
14.2 Global Electronic Grade Adhesive Material Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 3M
14.3.2 Tesa
14.3.3 Nitto
14.3.4 Sidike
14.3.5 Henkel
14.3.6 DuPont
14.3.7 Avery Dennison
14.3.8 ThreeBond
14.3.9 Hitachi
14.3.10 Epoxy
14.3.11 Creative Materials
14.3.12 Rogers Corporation
