Market Overview:
The global electronic grade phenolic resin market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for copper clad laminate, IC package, photoresist and other applications from the electronics industry. Asia Pacific is expected to be the fastest growing region during the forecast period.
Product Definition:
An electronic grade phenolic resin is a type of epoxy resin that is used in the manufacturing of electronic components. This type of resin is known for its high thermal and electrical resistance, as well as its ability to withstand high temperatures and harsh environments. Electronic grade phenolic resins are also resistant to moisture and chemicals, making them ideal for use in the manufacture of circuit boards, capacitors, and other electronics components.
Liquid Phenolic Resin:
Liquid phenolic resins are used as a protective coating in electronic grade phenolic resins. Electronic grade phenolic resins are used for manufacturing printed circuit boards and other electrical components. Growth factor in liquid form is added to the base resin during the production process of electronic grade phenolic resin, which results into an increased density and improved performance of coated materials.
Solid Phenolic Resin:
Solid phenolic resins are synthetic or natural resins that can be either cast or pressed into molds. They have high demand in the electronics industry due to their ability to reduce electrical noise and improve signal quality of electronic components. Solid phenolic resins are used for insulating printed circuit boards, protecting against electrostatic discharge, and improving signal quality of electronic components such as capacitors and resistors.
Application Insights:
Copper clad laminate was the largest application segment in 2017 and is expected to continue its dominance over the forecast period. This is attributed to increasing demand for these products from various end-use industries including construction, automotive, electrical & electronics and general industry. In addition, growing preference for green technologies owing to concerns regarding global warming is likely to propel product demand in this application over the coming years.
Electrical & electronics accounted for a significant share of IC package applications on account of high performance requirements coupled with excellent heat resistance properties offered by these resins. They are used as an alternative solution compared to leaded glass due largely in part due their low cost along with other advantages such as higher thermal shock resistance than regular phenolic resins when used within an integrated circuit package.
Regional Analysis:
North America was the largest market for electronic grade phenolic resin in 2016 and accounted for over 35% of the global revenue share. The region is expected to continue its dominance over the forecast period owing to increasing demand from various end-use industries such as electronics, automotive, medical devices, etc. In North America copper clad laminate demand was around 8 kilotons in 2017 and is projected to grow at a CAGR of XX% from 2018 to 2030.
Asia Pacific is anticipated to be one of the fastest growing regions with a CAGR exceeding 6% during the forecast period owing to rapid industrialization along with rising per capita income levels in emerging economies such as China and India are expected drive growth across this region.
Growth Factors:
- Increasing demand for lightweight and durable materials in automotive and aerospace industries
- Growing demand from electrical and electronics industry for insulation, laminates, and composites
- Rising consumption of phenolic resin in construction industry as a sealant, adhesive, or coating agent
- Increasing use of phenolic resin in medical applications as a biocompatible material
- Technological advancements that are resulting in better properties such as thermal stability, flame retardancy, etc., of phenolic resins
Scope Of The Report
Report Attributes
Report Details
Report Title
Electronic Grade Phenolic Resin Market Research Report
By Type
Liquid Phenolic Resin, Solid Phenolic Resin
By Application
Copper Clad Laminate, IC Package, Photoresist, Other
By Companies
Kuenbong Material, Zhejiang Hangmo New Material, Sbhpp, Jinan Shengquan Group, Allnex Belgium, Chang Chun Group, Kolon Industries, Shandong Laiwu Runda, Kangnam Chemical, Kuentek Cashew, Kuenbong Material
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
212
Number of Tables & Figures
149
Customization Available
Yes, the report can be customized as per your need.
Global Electronic Grade Phenolic Resin Market Report Segments:
The global Electronic Grade Phenolic Resin market is segmented on the basis of:
Types
Liquid Phenolic Resin, Solid Phenolic Resin
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Copper Clad Laminate, IC Package, Photoresist, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Kuenbong Material
- Zhejiang Hangmo New Material
- Sbhpp
- Jinan Shengquan Group
- Allnex Belgium
- Chang Chun Group
- Kolon Industries
- Shandong Laiwu Runda
- Kangnam Chemical
- Kuentek Cashew
- Kuenbong Material
Highlights of The Electronic Grade Phenolic Resin Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Liquid Phenolic Resin
- Solid Phenolic Resin
- By Application:
- Copper Clad Laminate
- IC Package
- Photoresist
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Electronic Grade Phenolic Resin Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Electronic grade phenolic resin is a type of plastic that is made from a mixture of phenol and formaldehyde. It is often used in products that need to be resistant to heat, water, and chemicals.
Some of the major companies in the electronic grade phenolic resin market are Kuenbong Material, Zhejiang Hangmo New Material, Sbhpp, Jinan Shengquan Group, Allnex Belgium, Chang Chun Group, Kolon Industries, Shandong Laiwu Runda, Kangnam Chemical, Kuentek Cashew, Kuenbong Material.
The electronic grade phenolic resin market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Electronic Grade Phenolic Resin Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Electronic Grade Phenolic Resin Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Electronic Grade Phenolic Resin Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Electronic Grade Phenolic Resin Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Electronic Grade Phenolic Resin Market Size & Forecast, 2018-2028 4.5.1 Electronic Grade Phenolic Resin Market Size and Y-o-Y Growth 4.5.2 Electronic Grade Phenolic Resin Market Absolute $ Opportunity
Chapter 5 Global Electronic Grade Phenolic Resin Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Electronic Grade Phenolic Resin Market Size Forecast by Type
5.2.1 Liquid Phenolic Resin
5.2.2 Solid Phenolic Resin
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Electronic Grade Phenolic Resin Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Electronic Grade Phenolic Resin Market Size Forecast by Applications
6.2.1 Copper Clad Laminate
6.2.2 IC Package
6.2.3 Photoresist
6.2.4 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Electronic Grade Phenolic Resin Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Electronic Grade Phenolic Resin Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Electronic Grade Phenolic Resin Analysis and Forecast
9.1 Introduction
9.2 North America Electronic Grade Phenolic Resin Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Electronic Grade Phenolic Resin Market Size Forecast by Type
9.6.1 Liquid Phenolic Resin
9.6.2 Solid Phenolic Resin
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Electronic Grade Phenolic Resin Market Size Forecast by Applications
9.10.1 Copper Clad Laminate
9.10.2 IC Package
9.10.3 Photoresist
9.10.4 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Electronic Grade Phenolic Resin Analysis and Forecast
10.1 Introduction
10.2 Europe Electronic Grade Phenolic Resin Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Electronic Grade Phenolic Resin Market Size Forecast by Type
10.6.1 Liquid Phenolic Resin
10.6.2 Solid Phenolic Resin
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Electronic Grade Phenolic Resin Market Size Forecast by Applications
10.10.1 Copper Clad Laminate
10.10.2 IC Package
10.10.3 Photoresist
10.10.4 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Electronic Grade Phenolic Resin Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Electronic Grade Phenolic Resin Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Electronic Grade Phenolic Resin Market Size Forecast by Type
11.6.1 Liquid Phenolic Resin
11.6.2 Solid Phenolic Resin
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Electronic Grade Phenolic Resin Market Size Forecast by Applications
11.10.1 Copper Clad Laminate
11.10.2 IC Package
11.10.3 Photoresist
11.10.4 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Electronic Grade Phenolic Resin Analysis and Forecast
12.1 Introduction
12.2 Latin America Electronic Grade Phenolic Resin Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Electronic Grade Phenolic Resin Market Size Forecast by Type
12.6.1 Liquid Phenolic Resin
12.6.2 Solid Phenolic Resin
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Electronic Grade Phenolic Resin Market Size Forecast by Applications
12.10.1 Copper Clad Laminate
12.10.2 IC Package
12.10.3 Photoresist
12.10.4 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Electronic Grade Phenolic Resin Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Electronic Grade Phenolic Resin Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Electronic Grade Phenolic Resin Market Size Forecast by Type
13.6.1 Liquid Phenolic Resin
13.6.2 Solid Phenolic Resin
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Electronic Grade Phenolic Resin Market Size Forecast by Applications
13.10.1 Copper Clad Laminate
13.10.2 IC Package
13.10.3 Photoresist
13.10.4 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Electronic Grade Phenolic Resin Market: Competitive Dashboard
14.2 Global Electronic Grade Phenolic Resin Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Kuenbong Material
14.3.2 Zhejiang Hangmo New Material
14.3.3 Sbhpp
14.3.4 Jinan Shengquan Group
14.3.5 Allnex Belgium
14.3.6 Chang Chun Group
14.3.7 Kolon Industries
14.3.8 Shandong Laiwu Runda
14.3.9 Kangnam Chemical
14.3.10 Kuentek Cashew
14.3.11 Kuenbong Material