Market Overview:
The global electronic grade solder paste market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for miniaturization and higher density in electronic devices, and the growing trend of using lead-free solders. The global electronic grade solder paste market is segmented by type into internal electrode paste and external electrode paste.
Product Definition:
An electronic grade solder paste is a type of solder paste that is specifically designed for use in electronics applications. It has a higher purity than other types of solder paste, and it also has a lower melting point, which makes it ideal for use in microelectronics. Electronic grade solder paste is used to attach small electronic components to each other and to circuit boards. It is also used in the manufacturing of integrated circuits (ICs).
Internal Electrode Paste:
Internal Electrode Paste is also known as Cellulose Powder or Cellulose Nitrate. It's a paste-like material, which is used for increasing the thermal conductivity of solders in high-temperature applications. The product helps to decrease the amount of energy needed for soldering operations and thus reduces the time required for assembling electronic devices.
The internal electrode paste can be easily applied on both large.
External Electrode Paste:
External Electrode Paste is also known as Surface Mount Devices (SMD) paste. It is used in electronic grade solder paste to provide reliable electrical connections between components and it’s mainly used in printed circuit boards (PCB). The external electrode paste provides a stable platform for soldering of surface mount devices and it offers high thermal conductivity which allows heat transfer from the soldering iron to be carried out more effectively.
Application Insights:
LTCC was the largest application segment and accounted for over 40% of the total revenue share in 2017. The growing demand for low cost, high performance and easy to use laminates is expected to drive the product consumption in this application segment over the forecast period.
Electronic grade solder paste is used as an alternative to lead-based solders when space or weight reduction are of primary importance. It offers better thermal resistance, corrosion resistance and fluxing properties which make it highly suitable for LTCC applications.
The chip inductors application segment is projected register a significant CAGR from 2018 to 2030 on account of rising demand from various end-use industries such as telecommunication, electronics & IT, medical equipment & appliances among others will drive growth during this period.
Regional Analysis:
Asia Pacific is expected to be the largest and fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for electronic grade solder pastes from key application sectors such as electronics, automotive, and solar energy. China led the Asia Pacific regional market in 2017 owing to high production of electronic products coupled with low labor cost in that country. Moreover, growing foreign investments coupled with favorable government policies are anticipated to drive product demand over the next eight years.
North America is projected to witness significant growth during the forecast period due to rising product adoption in various end-use industries such as medical devices & components, consumer electronics among others. In addition, presence of major manufacturers including Roebling Holdings Limited; Infineon Technologies Corporation; Maxim Integrated Products Inc.; Texas Instruments Inc.; and Avago Technology Ltd., will fuel industry expansion over next few years North America region).
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive and aerospace industries
- Growing popularity of LED lighting
- Proliferation of smart devices and the Internet of Things (IoT)
- Technological advancements in semiconductor manufacturing
Scope Of The Report
Report Attributes
Report Details
Report Title
Electronic Grade Solder Paste Market Research Report
By Type
Internal Electrode Paste, External Electrode Paste
By Application
LTCC, Chip Inductors, Piezoelectric Ceramic, LEDs, Circuit Board, Other
By Companies
SRA Soldering Products, RadioShack, Noritake, Kester, Tamura, Pulsar Process Measurement, Alpha Assembly Solutions, Heraeus
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
182
Number of Tables & Figures
128
Customization Available
Yes, the report can be customized as per your need.
Global Electronic Grade Solder Paste Market Report Segments:
The global Electronic Grade Solder Paste market is segmented on the basis of:
Types
Internal Electrode Paste, External Electrode Paste
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
LTCC, Chip Inductors, Piezoelectric Ceramic, LEDs, Circuit Board, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- SRA Soldering Products
- RadioShack
- Noritake
- Kester
- Tamura
- Pulsar Process Measurement
- Alpha Assembly Solutions
- Heraeus
Highlights of The Electronic Grade Solder Paste Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Internal Electrode Paste
- External Electrode Paste
- By Application:
- LTCC
- Chip Inductors
- Piezoelectric Ceramic
- LEDs
- Circuit Board
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Electronic Grade Solder Paste Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Electronic grade solder paste is a type of solder that is made to be used with electronic components. It has a higher melting point than traditional lead-based solder, which makes it easier to use in high-temperature applications.
Some of the key players operating in the electronic grade solder paste market are SRA Soldering Products, RadioShack, Noritake, Kester, Tamura, Pulsar Process Measurement, Alpha Assembly Solutions, Heraeus.
The electronic grade solder paste market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Electronic Grade Solder Paste Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Electronic Grade Solder Paste Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Electronic Grade Solder Paste Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Electronic Grade Solder Paste Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Electronic Grade Solder Paste Market Size & Forecast, 2018-2028
4.5.1 Electronic Grade Solder Paste Market Size and Y-o-Y Growth
4.5.2 Electronic Grade Solder Paste Market Absolute $ Opportunity
Chapter 5 Global Electronic Grade Solder Paste Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Electronic Grade Solder Paste Market Size Forecast by Type
5.2.1 Internal Electrode Paste
5.2.2 External Electrode Paste
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Electronic Grade Solder Paste Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Electronic Grade Solder Paste Market Size Forecast by Applications
6.2.1 LTCC
6.2.2 Chip Inductors
6.2.3 Piezoelectric Ceramic
6.2.4 LEDs
6.2.5 Circuit Board
6.2.6 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Electronic Grade Solder Paste Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Electronic Grade Solder Paste Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Electronic Grade Solder Paste Analysis and Forecast
9.1 Introduction
9.2 North America Electronic Grade Solder Paste Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Electronic Grade Solder Paste Market Size Forecast by Type
9.6.1 Internal Electrode Paste
9.6.2 External Electrode Paste
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Electronic Grade Solder Paste Market Size Forecast by Applications
9.10.1 LTCC
9.10.2 Chip Inductors
9.10.3 Piezoelectric Ceramic
9.10.4 LEDs
9.10.5 Circuit Board
9.10.6 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Electronic Grade Solder Paste Analysis and Forecast
10.1 Introduction
10.2 Europe Electronic Grade Solder Paste Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Electronic Grade Solder Paste Market Size Forecast by Type
10.6.1 Internal Electrode Paste
10.6.2 External Electrode Paste
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Electronic Grade Solder Paste Market Size Forecast by Applications
10.10.1 LTCC
10.10.2 Chip Inductors
10.10.3 Piezoelectric Ceramic
10.10.4 LEDs
10.10.5 Circuit Board
10.10.6 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Electronic Grade Solder Paste Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Electronic Grade Solder Paste Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Electronic Grade Solder Paste Market Size Forecast by Type
11.6.1 Internal Electrode Paste
11.6.2 External Electrode Paste
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Electronic Grade Solder Paste Market Size Forecast by Applications
11.10.1 LTCC
11.10.2 Chip Inductors
11.10.3 Piezoelectric Ceramic
11.10.4 LEDs
11.10.5 Circuit Board
11.10.6 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Electronic Grade Solder Paste Analysis and Forecast
12.1 Introduction
12.2 Latin America Electronic Grade Solder Paste Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Electronic Grade Solder Paste Market Size Forecast by Type
12.6.1 Internal Electrode Paste
12.6.2 External Electrode Paste
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Electronic Grade Solder Paste Market Size Forecast by Applications
12.10.1 LTCC
12.10.2 Chip Inductors
12.10.3 Piezoelectric Ceramic
12.10.4 LEDs
12.10.5 Circuit Board
12.10.6 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Electronic Grade Solder Paste Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Electronic Grade Solder Paste Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Electronic Grade Solder Paste Market Size Forecast by Type
13.6.1 Internal Electrode Paste
13.6.2 External Electrode Paste
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Electronic Grade Solder Paste Market Size Forecast by Applications
13.10.1 LTCC
13.10.2 Chip Inductors
13.10.3 Piezoelectric Ceramic
13.10.4 LEDs
13.10.5 Circuit Board
13.10.6 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Electronic Grade Solder Paste Market: Competitive Dashboard
14.2 Global Electronic Grade Solder Paste Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 SRA Soldering Products
14.3.2 RadioShack
14.3.3 Noritake
14.3.4 Kester
14.3.5 Tamura
14.3.6 Pulsar Process Measurement
14.3.7 Alpha Assembly Solutions
14.3.8 Heraeus
