Market Overview:
The global electronic heat conduction and heat dissipation components market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for thermal pads, thermal gels, and thermal greases in consumer electronics, smart home products, UAV equipment, 5G communication equipment, and other applications. Asia Pacific is expected to be the fastest-growing region during the forecast period owing to the growing demand for electronic devices in countries such as China and India.
Product Definition:
The electronic heat conduction and heat dissipation components are important because they help to keep the electronic devices cool. The electronic devices can overheat without these components, which can cause damage to the device.
Thermal Pad (High K):
The thermal pad (high K) is a heat spreader that utilizes the phase change of matter to provide an efficient means for dissipating heat. The high thermal conductivity of the material coupled with low emissivity and density makes it suitable for use in various applications including electronic components, industrial machinery, automobiles, and building automation systems.
Thermal Pads are widely used in automotive electronics as they help manage heat generated by electrical components such as display units.
Thermal Pad (Insulation):
The thermal pad (insulation) is a low-cost, thin, and flexible material that is used to provide heat dissipation from the electronic components. The pads are made of materials such as glass fiber reinforced plastic composites or natural rubber. They help in increasing the component life by preventing heat damage caused due to overheating and also improve device performance by lowering its temperature during operation.
Application Insights:
The consumer electronics application segment accounted for the largest market share in 2017 and is expected to continue its dominance over the forecast period. The growth of this segment can be attributed to increasing demand for smartphones, tablets, laptops and other related products from various end-use industries such as education, retail and hospitality.
Heat dissipation plays a significant role in electronic devices that are designed for long-term operation at elevated temperatures. Devices such as flat panel TVs, washing machines or air conditioners require maintenance free components that do not generate any heat themselves. Therefore, electronic components requiring low thermal resistance are selected based on their requirements during development of an entire system or device prototype. These prototypes are tested against different environmental conditions such as temperature & humidity levels to check robustness & reliability of the final product design before manufacturing begins.
Regional Analysis:
The market in Asia Pacific and MEA is anticipated to grow at a significant rate over the forecast period. The growth can be attributed to increasing demand for electronic products, such as smartphones, tablets, personal computers (PC), cameras, video games console among others. This has led to an increase in the usage of heat dissipation materials across various applications.
Increasing use of consumer electronics including laptops and mobiles is expected to drive the market further.
Growth Factors:
- Increasing demand for miniaturization in electronic devices: The trend of miniaturization in electronic devices is driving the demand for smaller and more efficient heat conduction and heat dissipation components.
- Growing adoption of advanced cooling technologies: The increasing use of high-performance processors and other advanced components in electronics is leading to the need for better cooling technologies. This is boosting the demand for heat conduction and heat dissipation components.
- Rising popularity of LED lighting: LEDs are becoming increasingly popular due to their energy efficiency and long life span. This is resulting in an increase in the use of LEDs in a variety of applications, including lighting, signage, automotive, etc., which is fueling the growth of the global market for electronic heat conduction and heat dissipation components.
- Proliferation of portable electronics: Portable electronics are becoming increasingly popular due to their portability, convenience, and low cost-to-performance ratio. This is propelling the growth of the global market for electronicheat conductionandheat dissipationcomponents as these devices require efficient cooling mechanisms to prevent overheating issues.. 5) Growing concerns over data security: With data breaches becoming more common, there has been a growing concern over data security among consumers worldwide .This has led to an increased demandfor reliable thermal management solutionsin order toprotect sensitive information from being compromised
Scope Of The Report
Report Attributes
Report Details
Report Title
Electronic Heat Conduction and Heat Dissipation Components Market Research Report
By Type
Thermal Pad (High K), Thermal Pad (Insulation), Thermal Gel, Thermal Grease
By Application
Consumer Electronics, Smart Home Products, UAV Equipment, 5G Communication Equipment, Others
By Companies
Shanghai Alllied Industrial Co.,Ltd, Nolato, Johns Tech PLC, Laird, Parker, Dexerials
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
212
Number of Tables & Figures
149
Customization Available
Yes, the report can be customized as per your need.
Global Electronic Heat Conduction and Heat Dissipation Components Market Report Segments:
The global Electronic Heat Conduction and Heat Dissipation Components market is segmented on the basis of:
Types
Thermal Pad (High K), Thermal Pad (Insulation), Thermal Gel, Thermal Grease
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Smart Home Products, UAV Equipment, 5G Communication Equipment, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Shanghai Alllied Industrial Co.,Ltd
- Nolato
- Johns Tech PLC
- Laird
- Parker
- Dexerials
Highlights of The Electronic Heat Conduction and Heat Dissipation Components Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Thermal Pad (High K)
- Thermal Pad (Insulation)
- Thermal Gel
- Thermal Grease
- By Application:
- Consumer Electronics
- Smart Home Products
- UAV Equipment
- 5G Communication Equipment
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Electronic Heat Conduction and Heat Dissipation Components Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Electronic heat conduction and heat dissipation components are used in electronic equipment to dissipate the thermal energy generated by the electronics.
Some of the major companies in the electronic heat conduction and heat dissipation components market are Shanghai Alllied Industrial Co.,Ltd, Nolato, Johns Tech PLC, Laird, Parker, Dexerials.
The electronic heat conduction and heat dissipation components market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Electronic Heat Conduction and Heat Dissipation Components Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Electronic Heat Conduction and Heat Dissipation Components Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Electronic Heat Conduction and Heat Dissipation Components Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Electronic Heat Conduction and Heat Dissipation Components Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Electronic Heat Conduction and Heat Dissipation Components Market Size & Forecast, 2018-2028
4.5.1 Electronic Heat Conduction and Heat Dissipation Components Market Size and Y-o-Y Growth
4.5.2 Electronic Heat Conduction and Heat Dissipation Components Market Absolute $ Opportunity
Chapter 5 Global Electronic Heat Conduction and Heat Dissipation Components Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Type
5.2.1 Thermal Pad (High K)
5.2.2 Thermal Pad (Insulation)
5.2.3 Thermal Gel
5.2.4 Thermal Grease
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Electronic Heat Conduction and Heat Dissipation Components Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Smart Home Products
6.2.3 UAV Equipment
6.2.4 5G Communication Equipment
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Electronic Heat Conduction and Heat Dissipation Components Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Electronic Heat Conduction and Heat Dissipation Components Analysis and Forecast
9.1 Introduction
9.2 North America Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Type
9.6.1 Thermal Pad (High K)
9.6.2 Thermal Pad (Insulation)
9.6.3 Thermal Gel
9.6.4 Thermal Grease
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Smart Home Products
9.10.3 UAV Equipment
9.10.4 5G Communication Equipment
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Electronic Heat Conduction and Heat Dissipation Components Analysis and Forecast
10.1 Introduction
10.2 Europe Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Type
10.6.1 Thermal Pad (High K)
10.6.2 Thermal Pad (Insulation)
10.6.3 Thermal Gel
10.6.4 Thermal Grease
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Smart Home Products
10.10.3 UAV Equipment
10.10.4 5G Communication Equipment
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Electronic Heat Conduction and Heat Dissipation Components Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Type
11.6.1 Thermal Pad (High K)
11.6.2 Thermal Pad (Insulation)
11.6.3 Thermal Gel
11.6.4 Thermal Grease
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Smart Home Products
11.10.3 UAV Equipment
11.10.4 5G Communication Equipment
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Electronic Heat Conduction and Heat Dissipation Components Analysis and Forecast
12.1 Introduction
12.2 Latin America Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Type
12.6.1 Thermal Pad (High K)
12.6.2 Thermal Pad (Insulation)
12.6.3 Thermal Gel
12.6.4 Thermal Grease
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Smart Home Products
12.10.3 UAV Equipment
12.10.4 5G Communication Equipment
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Electronic Heat Conduction and Heat Dissipation Components Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Type
13.6.1 Thermal Pad (High K)
13.6.2 Thermal Pad (Insulation)
13.6.3 Thermal Gel
13.6.4 Thermal Grease
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Electronic Heat Conduction and Heat Dissipation Components Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Smart Home Products
13.10.3 UAV Equipment
13.10.4 5G Communication Equipment
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Electronic Heat Conduction and Heat Dissipation Components Market: Competitive Dashboard
14.2 Global Electronic Heat Conduction and Heat Dissipation Components Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Shanghai Alllied Industrial Co.,Ltd
14.3.2 Nolato
14.3.3 Johns Tech PLC
14.3.4 Laird
14.3.5 Parker
14.3.6 Dexerials
