Market Overview:
The global embedded fingerprint module for physical access control market is expected to grow at a CAGR of xx% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for advanced security solutions across various industries and the rising adoption of biometric authentication techniques. Based on type, the global embedded fingerprint module for physical access control market is segmented into nano copper powder and micro copper powder. The nano copper powder segment is expected to account for a larger share of the market during the forecast period owing to its superior performance as compared to other types of materials used in manufacturing fingerprint modules. Based on application, the global embedded fingerprint module for physical access control market is segmented into electronics, chemical, mechanical, pharmaceuticals and others. The electronics sector accounted for a major share of this market in 2017 and is projected to maintain its dominance during the forecast period. This can be attributed to increasing demand from end-use industries such as automotive, consumer electronics and telecommunications sectors across regions worldwide.
Product Definition:
An embedded fingerprint module is a small, self-contained device used to capture and store fingerprints for authentication purposes. These modules are commonly used in physical access control systems, where they are installed into door readers or other devices that control access to a facility or secure area. The embedded fingerprint module allows authorized users to scan their fingerprints instead of using a traditional keycard or password, providing an extra layer of security.
Nano Copper Powder:
Nano copper powder is a new emerging technology in the field of MEMS (Micro Electro Mechanical System) and IC (Integrated Circuit). It has potential application areas in RFID, biometric, smart card & access control systems. Nano copper powder is used as an electrode material for an integrated circuit or a memory chip. The performance of nano-copper powder as an electrode material depends on two key factors namely size and surface area.
Micro Copper Powder:
Micro copper powder is a special type of electronic component which acts as an electrical conductor and helps in the conduction of electricity by providing ions. Micro copper powder is used in embedded fingerprint module for physical access control system, which provides security to private information and property. It offers high resistance to water, oil & solvent, along with low friction coefficient.
Application Insights:
The market is segmented based on application into electronics, mechanical, chemical, and others. The electronic application segment accounted for the largest share in 2017 owing to increasing use of embedded fingerprint modules in smartphones, laptops/notebooks and other electronic devices. Moreover, growing demand for biometric security solutions across various industries such as healthcare & IT are expected to drive the market growth over the forecast period.
The mechanical application segment is expected to witness significant growth over the forecast period due to rising use of embedded fingerprint modules in industrial machinery and consumer durables such as refrigerators and washing machines among others. Growing demand from key end-use industries such as automotive & transportation are also anticipated to contribute towards industry expansion during future years.
Growing awareness regarding biometric access control systems coupled with government initiatives aimed at enhancing physical access control measures within organizations will further propel industry expansion during future years according to Gartner Inc., a U.S.
Regional Analysis:
North America is expected to be the largest regional market over the forecast period owing to early adoption of technologies. The U.S., in particular, has been one of the most innovative countries when it comes to adopting new and emerging technologies, which bodes well for future growth prospects of this market in North America. Europe is also estimated to witness significant growth over the coming years on account of increasing R&D activities by various companies present in this region.
Asia Pacific is anticipated to emerge as a promising destination for industry players looking forward to tapping into lucrative opportunities present across several sectors within this region (mechanical, electronics). Countries such as China and India are among some of the prominent markets currently operating within Asia Pacific; however, they are also amongst those countries with high potentiality for further development given their large population base along with flourishing manufacturing sector - two key factors that can significantly boost product demand at any time.
Growth Factors:
- Increasing demand for biometric authentication in physical access control systems
- Growing popularity of embedded fingerprint modules in smartphones and other portable devices
- Proliferation of Internet of Things (IoT) and connected devices
- Rising concerns over data security and privacy
- Advances in fingerprint scanning technology
Scope Of The Report
Report Attributes
Report Details
Report Title
Embedded Fingerprint Module for Physical Access Control Market Research Report
By Type
Nano Copper Powder, Micro Copper Powder
By Application
Electronics, Chemical, Mechanical, Pharmaceutical, Others
By Companies
Mitsui Kinzoku, GGP Metalpowder, Fukuda Metal Foil & Powder, Gripm, Sumitomo Metal Mining, TongLing Guochuan Electronic Technology, Nippon Atomized Metal Powders, Kunshan Detai Metal Technology, Runze Jinshu Fenmo, DOWA, Mitsui Kinzoku, Ningbo Guangbo Nano Technology, CNPC POWDER, Haotian nano technology, Suzhou CanFuo Nano, Shenzhen Nonfemet, Hefei QQ-NANO
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
192
Number of Tables & Figures
135
Customization Available
Yes, the report can be customized as per your need.
Global Embedded Fingerprint Module for Physical Access Control Market Report Segments:
The global Embedded Fingerprint Module for Physical Access Control market is segmented on the basis of:
Types
Nano Copper Powder, Micro Copper Powder
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Electronics, Chemical, Mechanical, Pharmaceutical, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Mitsui Kinzoku
- GGP Metalpowder
- Fukuda Metal Foil & Powder
- Gripm
- Sumitomo Metal Mining
- TongLing Guochuan Electronic Technology
- Nippon Atomized Metal Powders
- Kunshan Detai Metal Technology
- Runze Jinshu Fenmo
- DOWA
- Mitsui Kinzoku
- Ningbo Guangbo Nano Technology
- CNPC POWDER
- Haotian nano technology
- Suzhou CanFuo Nano
- Shenzhen Nonfemet
- Hefei QQ-NANO
Highlights of The Embedded Fingerprint Module for Physical Access Control Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Nano Copper Powder
- Micro Copper Powder
- By Application:
- Electronics
- Chemical
- Mechanical
- Pharmaceutical
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Embedded Fingerprint Module for Physical Access Control Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Embedded fingerprint module for physical access control is a device that can be used to identify individuals by their fingerprints. This module can be installed on doors, gates, or other security devices to allow only authorized individuals access to the area protected by the device.
Some of the key players operating in the embedded fingerprint module for physical access control market are Mitsui Kinzoku, GGP Metalpowder, Fukuda Metal Foil & Powder, Gripm, Sumitomo Metal Mining, TongLing Guochuan Electronic Technology, Nippon Atomized Metal Powders, Kunshan Detai Metal Technology, Runze Jinshu Fenmo, DOWA, Mitsui Kinzoku, Ningbo Guangbo Nano Technology, CNPC POWDER, Haotian nano technology, Suzhou CanFuo Nano, Shenzhen Nonfemet, Hefei QQ-NANO.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Embedded Fingerprint Module for Physical Access Control Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Embedded Fingerprint Module for Physical Access Control Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Embedded Fingerprint Module for Physical Access Control Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Embedded Fingerprint Module for Physical Access Control Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Embedded Fingerprint Module for Physical Access Control Market Size & Forecast, 2020-2028
4.5.1 Embedded Fingerprint Module for Physical Access Control Market Size and Y-o-Y Growth
4.5.2 Embedded Fingerprint Module for Physical Access Control Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Nano Copper Powder
5.2.2 Micro Copper Powder
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Electronics
6.2.2 Chemical
6.2.3 Mechanical
6.2.4 Pharmaceutical
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Embedded Fingerprint Module for Physical Access Control Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Embedded Fingerprint Module for Physical Access Control Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Nano Copper Powder
9.6.2 Micro Copper Powder
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Electronics
9.10.2 Chemical
9.10.3 Mechanical
9.10.4 Pharmaceutical
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Nano Copper Powder
10.6.2 Micro Copper Powder
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Electronics
10.10.2 Chemical
10.10.3 Mechanical
10.10.4 Pharmaceutical
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Nano Copper Powder
11.6.2 Micro Copper Powder
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Electronics
11.10.2 Chemical
11.10.3 Mechanical
11.10.4 Pharmaceutical
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Nano Copper Powder
12.6.2 Micro Copper Powder
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Electronics
12.10.2 Chemical
12.10.3 Mechanical
12.10.4 Pharmaceutical
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Nano Copper Powder
13.6.2 Micro Copper Powder
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Electronics
13.10.2 Chemical
13.10.3 Mechanical
13.10.4 Pharmaceutical
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Embedded Fingerprint Module for Physical Access Control Market: Competitive Dashboard
14.2 Global Embedded Fingerprint Module for Physical Access Control Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Mitsui Kinzoku
14.3.2 GGP Metalpowder
14.3.3 Fukuda Metal Foil & Powder
14.3.4 Gripm
14.3.5 Sumitomo Metal Mining
14.3.6 TongLing Guochuan Electronic Technology
14.3.7 Nippon Atomized Metal Powders
14.3.8 Kunshan Detai Metal Technology
14.3.9 Runze Jinshu Fenmo
14.3.10 DOWA
14.3.11 Mitsui Kinzoku
14.3.12 Ningbo Guangbo Nano Technology
14.3.13 CNPC POWDER
14.3.14 Haotian nano technology
14.3.15 Suzhou CanFuo Nano
14.3.16 Shenzhen Nonfemet
14.3.17 Hefei QQ-NANO
