Market Overview:
The global epoxy die bonder market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for miniaturization and higher density in electronic devices, rising demand for advanced packaging solutions, and growing trend of 3D integration in semiconductor industry. In terms of type, the multiple chip segment is expected to hold the largest share of the global epoxy die bonder market during the forecast period. This can be attributed to increased adoption of this technology by IDMs and OSATs for advanced packaging applications. In terms of region, North America is expected to hold the largest share of the global epoxy die bonder market duringthe forecast period followed by Asia Pacific.
Product Definition:
Epoxy die bonder is a device that is used to join two or more surfaces together by using an epoxy adhesive. This device is important because it allows for the creation of strong, durable bonds between different surfaces.
Multiple Chips:
Multiple chips are used in epoxy die bander market to reduce the number of bond wires and time consumption during the assembly process. The multiple chip technology is majorly used for high volume manufacturing applications. It helps in reducing production cost, improving yield, and increasing throughput by minimizing human intervention during bonding operations.
The multiple chips enable automated operation which includes detection of wire position and selection, automatic feeding followed by detection of cure time etc.
Single Chips:
Single chips are ICs that are used to replace a group of components in the epoxy die binder market. They help reduce the overall cost of manufacturing by reducing the number of layers in an integrated circuit (IC). The single chip approach reduces process costs and inventory costs, which is expected to drive their demand over the forecast period.
The major driver for this technology is its ability to reduce inventory costs per wafer as well as per lot.
Application Insights:
IDMs were the largest application segment in 2015 and are expected to continue holding a major share over the forecast period. Increasing infrastructure spending in emerging economies of Asia Pacific is anticipated to promote epoxy die bonder market growth over the next eight years. Epoxy die bonders find applications across various industries including electrical, electronics, medical devices and automotive which include semiconductors among other components. The industry has witnessed significant innovations with respect to new product development along with technological advancements that have revolutionized its usage for mass production of electronic devices.
The growing demand for electric vehicles is projected to drive demand from OSATs as they require high-quality electronic components that are produced using bonding techniques such as epoxies on account of their complex manufacturing processes involving multiple layers and parts made from different materials which need strong adhesion between them during assembly operations at both ends i.e.
Regional Analysis:
Asia Pacific dominated the global epoxy die bonder market in 2016 and is expected to continue its dominance over the forecast period. The presence of major players in China, Taiwan, Japan and South Korea has contributed to this dominance. In addition, increasing demand for electronic products such as laptops, mobiles phones along with their accessories is anticipated to drive the regional market growth over the forecast period.
The Asia Pacific region was followed by Europe which accounted for a revenue share of more than 20% in 2016 owing to high product adoption across several end-use industries such as IT & telecommunication equipment manufacturing and automotive industry coupled with growing R&D activities related to microelectronics. Increasing research & development (R&D) expenditure on microelectronics by governments of various countries including Germany, UK and France are some factors that can be attributed for epoxy die bonders’ high demand across this region during the same year.
Growth Factors:
- Increasing demand for miniaturization in electronic devices: The global Epoxy Die Bonder market is expected to grow at a CAGR of 5.5% during the forecast period, owing to the increasing demand for miniaturization in electronic devices. This is because miniaturized devices offer several advantages such as low power consumption, high portability, and easy installation.
- Rising demand from automotive industry: The global Epoxy Die Bonder market is also expected to grow at a CAGR of 5.5% during the forecast period, owing to the rising demand from the automotive industry. This is because epoxy die bonders are used extensively in various applications such as engine control units (ECUs), airbag systems, and anti-lock braking systems (ABSs).
- Growing popularity of 3D printing technology: The global Epoxy Die Bonder market is also expected to grow at a CAGR of 5%, owing to the growing popularity of 3D printing technology across different industries such as medical & healthcare, aerospace & defense, and automotive & transportation sectors .This technology helps reduce manufacturing time and costs by using three-dimensional printers that can create physical objects layer by layer from digital models or designs .
Scope Of The Report
Report Attributes
Report Details
Report Title
Epoxy Die Bonder Market Research Report
By Type
Multiple Chips, Single Chips
By Application
IDMs, OSAT
By Companies
MRSI Systems, Panasonic, Palomar Technologies, TPT Wire Bonder, Kulicke & Soffa, UniTemp, ASM AMICRA Microtechnologies GmbH, Besi, Mycronic
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
191
Number of Tables & Figures
134
Customization Available
Yes, the report can be customized as per your need.
Global Epoxy Die Bonder Market Report Segments:
The global Epoxy Die Bonder market is segmented on the basis of:
Types
Multiple Chips, Single Chips
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
IDMs, OSAT
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- MRSI Systems
- Panasonic
- Palomar Technologies
- TPT Wire Bonder
- Kulicke & Soffa
- UniTemp
- ASM AMICRA Microtechnologies GmbH
- Besi
- Mycronic
Highlights of The Epoxy Die Bonder Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Multiple Chips
- Single Chips
- By Application:
- IDMs
- OSAT
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Epoxy Die Bonder Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Epoxy die bonder is a type of adhesive that is used to join two pieces of wood together. It is a strong and durable adhesive that can hold the pieces together for a long period of time.
Some of the major players in the epoxy die bonder market are MRSI Systems, Panasonic, Palomar Technologies, TPT Wire Bonder, Kulicke & Soffa, UniTemp, ASM AMICRA Microtechnologies GmbH, Besi, Mycronic.
The epoxy die bonder market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Epoxy Die Bonder Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Epoxy Die Bonder Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Epoxy Die Bonder Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Epoxy Die Bonder Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Epoxy Die Bonder Market Size & Forecast, 2020-2028
4.5.1 Epoxy Die Bonder Market Size and Y-o-Y Growth
4.5.2 Epoxy Die Bonder Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Multiple Chips
5.2.2 Single Chips
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 IDMs
6.2.2 OSAT
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Epoxy Die Bonder Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Epoxy Die Bonder Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Multiple Chips
9.6.2 Single Chips
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 IDMs
9.10.2 OSAT
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Multiple Chips
10.6.2 Single Chips
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 IDMs
10.10.2 OSAT
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Multiple Chips
11.6.2 Single Chips
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 IDMs
11.10.2 OSAT
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Multiple Chips
12.6.2 Single Chips
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 IDMs
12.10.2 OSAT
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Multiple Chips
13.6.2 Single Chips
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 IDMs
13.10.2 OSAT
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Epoxy Die Bonder Market: Competitive Dashboard
14.2 Global Epoxy Die Bonder Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 MRSI Systems
14.3.2 Panasonic
14.3.3 Palomar Technologies
14.3.4 TPT Wire Bonder
14.3.5 Kulicke & Soffa
14.3.6 UniTemp
14.3.7 ASM AMICRA Microtechnologies GmbH
14.3.8 Besi
14.3.9 Mycronic
