Industry Growth Insights published a new data on “Epoxy Encapsulant Material Market”. The research report is titled “Epoxy Encapsulant Material Market research by Types (Normal Epoxy Molding Compound, Green Epoxy Molding Compound), By Applications (Semiconductor Encapsulation, Electronic Components), By Players/Companies Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI, Eternal Materials, Jiangsu Zhongpeng New Material, Shin-Etsu Chemical, Hexion, Nepes, Tianjin Kaihua Insulating Material, HHCK, Scienchem, Beijing Sino-tech Electronic Material”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Epoxy Encapsulant Material Market Research Report
By Type
Normal Epoxy Molding Compound, Green Epoxy Molding Compound
By Application
Semiconductor Encapsulation, Electronic Components
By Companies
Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI, Eternal Materials, Jiangsu Zhongpeng New Material, Shin-Etsu Chemical, Hexion, Nepes, Tianjin Kaihua Insulating Material, HHCK, Scienchem, Beijing Sino-tech Electronic Material
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
246
Number of Tables & Figures
173
Customization Available
Yes, the report can be customized as per your need.
Global Epoxy Encapsulant Material Market Report Segments:
The global Epoxy Encapsulant Material market is segmented on the basis of:
Types
Normal Epoxy Molding Compound, Green Epoxy Molding Compound
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Semiconductor Encapsulation, Electronic Components
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Sumitomo Bakelite
- Hitachi Chemical
- Chang Chun Group
- Hysol Huawei Electronics
- Panasonic
- Kyocera
- KCC
- Samsung SDI
- Eternal Materials
- Jiangsu Zhongpeng New Material
- Shin-Etsu Chemical
- Hexion
- Nepes
- Tianjin Kaihua Insulating Material
- HHCK
- Scienchem
- Beijing Sino-tech Electronic Material
Highlights of The Epoxy Encapsulant Material Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Normal Epoxy Molding Compound
- Green Epoxy Molding Compound
- By Application:
- Semiconductor Encapsulation
- Electronic Components
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Epoxy Encapsulant Material Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Epoxy encapsulant material is a type of sealant that is used to protect the surface of a metal object from corrosion. Epoxy encapsulant material is also known as an epoxy coating, and it consists of small beads or droplets that are mixed with a resin. When the epoxy coating is applied to the metal object, it forms a barrier against moisture and other elements.
Some of the key players operating in the epoxy encapsulant material market are Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI, Eternal Materials, Jiangsu Zhongpeng New Material, Shin-Etsu Chemical, Hexion, Nepes, Tianjin Kaihua Insulating Material, HHCK, Scienchem, Beijing Sino-tech Electronic Material.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Epoxy Encapsulant Material Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Epoxy Encapsulant Material Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Epoxy Encapsulant Material Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Epoxy Encapsulant Material Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Epoxy Encapsulant Material Market Size & Forecast, 2018-2028
4.5.1 Epoxy Encapsulant Material Market Size and Y-o-Y Growth
4.5.2 Epoxy Encapsulant Material Market Absolute $ Opportunity
Chapter 5 Global Epoxy Encapsulant Material Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Epoxy Encapsulant Material Market Size Forecast by Type
5.2.1 Normal Epoxy Molding Compound
5.2.2 Green Epoxy Molding Compound
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Epoxy Encapsulant Material Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Epoxy Encapsulant Material Market Size Forecast by Applications
6.2.1 Semiconductor Encapsulation
6.2.2 Electronic Components
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Epoxy Encapsulant Material Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Epoxy Encapsulant Material Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Epoxy Encapsulant Material Analysis and Forecast
9.1 Introduction
9.2 North America Epoxy Encapsulant Material Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Epoxy Encapsulant Material Market Size Forecast by Type
9.6.1 Normal Epoxy Molding Compound
9.6.2 Green Epoxy Molding Compound
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Epoxy Encapsulant Material Market Size Forecast by Applications
9.10.1 Semiconductor Encapsulation
9.10.2 Electronic Components
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Epoxy Encapsulant Material Analysis and Forecast
10.1 Introduction
10.2 Europe Epoxy Encapsulant Material Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Epoxy Encapsulant Material Market Size Forecast by Type
10.6.1 Normal Epoxy Molding Compound
10.6.2 Green Epoxy Molding Compound
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Epoxy Encapsulant Material Market Size Forecast by Applications
10.10.1 Semiconductor Encapsulation
10.10.2 Electronic Components
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Epoxy Encapsulant Material Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Epoxy Encapsulant Material Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Epoxy Encapsulant Material Market Size Forecast by Type
11.6.1 Normal Epoxy Molding Compound
11.6.2 Green Epoxy Molding Compound
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Epoxy Encapsulant Material Market Size Forecast by Applications
11.10.1 Semiconductor Encapsulation
11.10.2 Electronic Components
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Epoxy Encapsulant Material Analysis and Forecast
12.1 Introduction
12.2 Latin America Epoxy Encapsulant Material Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Epoxy Encapsulant Material Market Size Forecast by Type
12.6.1 Normal Epoxy Molding Compound
12.6.2 Green Epoxy Molding Compound
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Epoxy Encapsulant Material Market Size Forecast by Applications
12.10.1 Semiconductor Encapsulation
12.10.2 Electronic Components
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Epoxy Encapsulant Material Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Epoxy Encapsulant Material Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Epoxy Encapsulant Material Market Size Forecast by Type
13.6.1 Normal Epoxy Molding Compound
13.6.2 Green Epoxy Molding Compound
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Epoxy Encapsulant Material Market Size Forecast by Applications
13.10.1 Semiconductor Encapsulation
13.10.2 Electronic Components
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Epoxy Encapsulant Material Market: Competitive Dashboard
14.2 Global Epoxy Encapsulant Material Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Sumitomo Bakelite
14.3.2 Hitachi Chemical
14.3.3 Chang Chun Group
14.3.4 Hysol Huawei Electronics
14.3.5 Panasonic
14.3.6 Kyocera
14.3.7 KCC
14.3.8 Samsung SDI
14.3.9 Eternal Materials
14.3.10 Jiangsu Zhongpeng New Material
14.3.11 Shin-Etsu Chemical
14.3.12 Hexion
14.3.13 Nepes
14.3.14 Tianjin Kaihua Insulating Material
14.3.15 HHCK
14.3.16 Scienchem
14.3.17 Beijing Sino-tech Electronic Material
