Market Overview:
The Global Equipment Front End Module (EFEM) Systems Market is expected to grow at a CAGR of xx% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductor devices and rising investments in the semiconductor industry. Based on type, the market is segmented into 2 FOUP wide, 3 FOUP wide, and 4 FOUP wide. The 3 FOUP wide segment is expected to hold the largest share of the market during the forecast period. This can be attributed to its ability to handle a large number of wafers simultaneously and its low cost as compared with other types of EFEM systems. Based on application, the market is segmented into 150 mm wafer, 200 mm wafer, 300 mm wafer, and other applications. The 300 mm wafer segment is expected to hold the largest share ofthe global equipment front end module (EFEM) systems market duringthe forecast period owingtoits high demand from variousapplication segments such as consumer electronics, automotive electronics,, telecommunications,, data centers,, and others).
Product Definition:
The Equipment Front End Module (EFEM) Systems is a system that is used to manage the equipment front end processes. The importance of the EFEM Systems is that it helps to ensure that the equipment front end processes are running smoothly and efficiently.
2 FOUP Wide:
2 FOUP (Two Front-End Modules) is a type of optical module used in the equipment front end module (EFEM) systems. It’s an optical add-drop multiplexer/Multi-Fiber Trunks hybrid solution that provides high capacity and performance for metro network applications.
3 FOUP Wide:
The 3 FOUP (Front End Optical Unit) is a kind of camera used in the EFEM systems. It has an optical lens that can capture high-quality images and videos from various angles. The 3 FOUP cameras are mounted on the front end of EFEM systems, which enable them to capture images with better clarity and resolution. They help in providing quality control for manufacturing equipment by monitoring process parameters such as temperature, pressure, and flow rate during processing operations.
Application Insights:
The 300 mm wafer application segment accounted for the largest revenue share in 2017 and is projected to expand at a CAGR of XX% over the forecast period. The growth can be attributed to an increase in production capacity, particularly in China and Taiwan, which has resulted in increased demand for equipment front end module (EFEM) systems from various manufacturers across the world.
In addition, 300 mm wafer production technology has evolved significantly over the past few years with several advanced stages that are capable of producing high-quality semiconductors on a commercial scale. This development is expected to positively impact industry growth over the coming years as equipment costs decrease while outputting higher quality semiconductors per unit cost.
The 200 mm wafer application segment accounted for a significant market share owing to its increasing use across multiple applications such as smartphones, wearable devices.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing region over the forecast period owing to a large number of semiconductor manufacturing companies in China, Taiwan Semiconductor Manufacturing Company (TSMC), and South Korea. Furthermore, increasing investments by various equipment manufacturers are anticipated to drive regional growth. For instance, in January 2017, Samsung Electronics announced its plans for building a new 300 mm wafer fabrication plant in Vietnam with an investment of USD X billion.
The market for front end modules in Europe was valued at USD X billion in 2016 and is expected to grow at a CAGR of XX% from 2017 to 2030 due high demand from foundry customers such as ASML Netherlands Holdings BV., Siemens AG & Co., KLA-GmbH & Co.
Growth Factors:
- Increasing demand for miniaturization in electronic equipment
- Growing popularity of electric and hybrid vehicles
- Proliferation of next-generation wireless communication technologies
- Rising demand for semiconductor devices and components
- Emergence of the Internet of Things (IoT)
Scope Of The Report
Report Attributes
Report Details
Report Title
Equipment Front End Module (EFEM) Systems Market Research Report
By Type
2 FOUP Wide, 3 FOUP Wide, 4 FOUP Wide
By Application
150 mm Wafer, 200 mm Wafer, 300 mm Wafer, Other
By Companies
Robots and Design, Genmark Automation, Yaskawa Electric, Hirata Corporation, Fala Technologies, Kensington, Milara, Beijing Heqi Precision Technology
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
230
Number of Tables & Figures
161
Customization Available
Yes, the report can be customized as per your need.
Global Equipment Front End Module (EFEM) Systems Market Report Segments:
The global Equipment Front End Module (EFEM) Systems market is segmented on the basis of:
Types
2 FOUP Wide, 3 FOUP Wide, 4 FOUP Wide
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
150 mm Wafer, 200 mm Wafer, 300 mm Wafer, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Robots and Design
- Genmark Automation
- Yaskawa Electric
- Hirata Corporation
- Fala Technologies
- Kensington
- Milara
- Beijing Heqi Precision Technology
Highlights of The Equipment Front End Module (EFEM) Systems Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 2 FOUP Wide
- 3 FOUP Wide
- 4 FOUP Wide
- By Application:
- 150 mm Wafer
- 200 mm Wafer
- 300 mm Wafer
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Equipment Front End Module (EFEM) Systems Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
EFEM is an acronym for Equipment Front End Module. EFEM systems are used in factories to control and monitor industrial machines, such as robots, conveyors, and stamping machines.
Some of the major players in the equipment front end module (efem) systems market are Robots and Design, Genmark Automation, Yaskawa Electric, Hirata Corporation, Fala Technologies, Kensington, Milara, Beijing Heqi Precision Technology.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Equipment Front End Module (EFEM) Systems Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Equipment Front End Module (EFEM) Systems Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Equipment Front End Module (EFEM) Systems Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Equipment Front End Module (EFEM) Systems Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Equipment Front End Module (EFEM) Systems Market Size & Forecast, 2020-2028 4.5.1 Equipment Front End Module (EFEM) Systems Market Size and Y-o-Y Growth 4.5.2 Equipment Front End Module (EFEM) Systems Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 2 FOUP Wide
5.2.2 3 FOUP Wide
5.2.3 4 FOUP Wide
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 150 mm Wafer
6.2.2 200 mm Wafer
6.2.3 300 mm Wafer
6.2.4 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Equipment Front End Module (EFEM) Systems Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Equipment Front End Module (EFEM) Systems Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 2 FOUP Wide
9.6.2 3 FOUP Wide
9.6.3 4 FOUP Wide
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 150 mm Wafer
9.10.2 200 mm Wafer
9.10.3 300 mm Wafer
9.10.4 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 2 FOUP Wide
10.6.2 3 FOUP Wide
10.6.3 4 FOUP Wide
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 150 mm Wafer
10.10.2 200 mm Wafer
10.10.3 300 mm Wafer
10.10.4 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 2 FOUP Wide
11.6.2 3 FOUP Wide
11.6.3 4 FOUP Wide
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 150 mm Wafer
11.10.2 200 mm Wafer
11.10.3 300 mm Wafer
11.10.4 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 2 FOUP Wide
12.6.2 3 FOUP Wide
12.6.3 4 FOUP Wide
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 150 mm Wafer
12.10.2 200 mm Wafer
12.10.3 300 mm Wafer
12.10.4 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 2 FOUP Wide
13.6.2 3 FOUP Wide
13.6.3 4 FOUP Wide
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 150 mm Wafer
13.10.2 200 mm Wafer
13.10.3 300 mm Wafer
13.10.4 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Equipment Front End Module (EFEM) Systems Market: Competitive Dashboard
14.2 Global Equipment Front End Module (EFEM) Systems Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Robots and Design
14.3.2 Genmark Automation
14.3.3 Yaskawa Electric
14.3.4 Hirata Corporation
14.3.5 Fala Technologies
14.3.6 Kensington
14.3.7 Milara
14.3.8 Beijing Heqi Precision Technology