Market Overview:
The global ESD packaging materials market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for ESD packaging materials in various applications, such as communication network infrastructure, consumer electronics, computer peripherals, aerospace and defense, healthcare and instrumentation, automotive and others. In terms of type, the primary packing material segment is expected to hold the largest share of the global ESD packaging materials market during the forecast period. This can be attributed to its ability to protect electronic components from electrostatic discharge (ESD) damage.
Product Definition:
ESD packaging materials are designed to protect electronic devices from electrostatic discharge (ESD). ESD can cause damage to electronic components, so it is important to use packaging that will dissipate any static electricity.
Primary Packing Material:
Primary packing material is the first material that comes in contact with an electronic device or product during its packaging. It protects the device from physical damage and Electrostatic Dissipation (ESD) during transportation and storage. The primary packing materials are made of different types of materials such as foam, bubble wrap, paper & paperboard, plastic foams among others.
Approaching Packaging Material:
Approaching packaging material is a new term that refers to the part of packaging that is in contact with the product being packed. It can be either loose or in a box, and it helps protect products during shipping and storage. Approaching packaging material has several advantages over traditional materials such as foam, corrugated cardboard, etc., which are mainly due to its lightweight properties.
Application Insights:
The network infrastructure application segment accounted for the largest revenue share in 2017 and is projected to continue its dominance over the forecast period. The growing demand for electronic devices and communication networks is anticipated to drive product demand over the coming years. Furthermore, stringent regulations regarding electrostatic discharge protection for communication network infrastructure are expected to augment market growth during the forecast period.
Communication network infrastructure was followed by consumer electronics as a major application segment of e-packaging materials in 2017. Consumer electronics include smartphones, wearable devices, home appliances (such as refrigerators or washing machines), etc., which are manufactured with conductive packaging materials that help prevent damage due to electrostatic discharge (ESD). These products attract a lot of attention from consumers owing to their features such as touch screen technology and smart functions which increase their popularity among other applications such as automotive interior components or aerospace & defense equipment maintenance kits.
Regional Analysis:
Asia Pacific dominated the global market in 2017. The region is expected to witness significant growth over the forecast period owing to increasing electronic products consumption and development of communication network infrastructure, consumer electronics, computer peripheral manufacturing industry.
The presence of major electronic product manufacturers such as Samsung Electronics Co., Ltd., Foxconn Technology Group, Wistron Corporation has fueled the demand for e-packaging materials in Asia Pacific. Furthermore, rising disposable income coupled with growing adoption of advanced technologies such as smartphones and tablets is anticipated to drive demand for these approaching packaging materials over the forecast period.
Europe accounted for a significant share in terms of revenue due to high penetration rate.
Growth Factors:
- Increasing demand for miniaturization in electronic devices: The global market for electronic devices is expected to grow at a CAGR of 6.5% from 2016 to 2020. This growth is primarily driven by the increasing demand for miniaturized and lightweight devices, such as smartphones, tablets, and wearable electronics. This growing demand is fueling the need for smaller and lighter ESD packaging materials that can protect sensitive components from electrostatic discharge (ESD).
- Rising popularity of e-commerce: The global e-commerce market is expected to grow at a CAGR of 20% from 2016 to 2020. This growth is being driven by the increasing penetration of internet access, rising smartphone usage, and growing preference for online shopping over traditional retail channels. ESD packaging materials are essential components in protecting electronic goods during transit through e-commerce channels.
- Proliferation of 3D printing technology: 3D printing technology has gained immense popularity in recent years due to its ability to produce customized products with high accuracy and speed. It is estimated that the global market for 3D printing will grow at a CAGR of 30% from 2016 to 2020 In order to capitalize on this growth potential, many leading players in the ESD packaging materials market are investing heavily in R&D activities aimed at developing innovative 3D printing technologies specifically designed for use with ESD packaging materials products 4 Emerging markets offer significant growth potential: The Asia Pacific region offers significant potential for future growth
Scope Of The Report
Report Attributes
Report Details
Report Title
ESD Packaging Materials Market Research Report
By Type
Primary Packing Material, Approaching Packaging Material, Secondary Packaging Material
By Application
Communication Network Infrastructure, Consumer Electronics, Computer Peripherals, Aerospace and Defense, Healthcare and Instrumentation, Automotive, Other
By Companies
BASF, Desco Industries, Dow Chemical Company, PPG Industries, AkzoNobel, DaklaPack Group, Dou Yee, GWP Group, Kao-Chia Plastics, Miller Supply, BASF, TIP Corporation, Uline
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
216
Number of Tables & Figures
152
Customization Available
Yes, the report can be customized as per your need.
Global ESD Packaging Materials Market Report Segments:
The global ESD Packaging Materials market is segmented on the basis of:
Types
Primary Packing Material, Approaching Packaging Material, Secondary Packaging Material
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Communication Network Infrastructure, Consumer Electronics, Computer Peripherals, Aerospace and Defense, Healthcare and Instrumentation, Automotive, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- BASF
- Desco Industries
- Dow Chemical Company
- PPG Industries
- AkzoNobel
- DaklaPack Group
- Dou Yee
- GWP Group
- Kao-Chia Plastics
- Miller Supply
- BASF
- TIP Corporation
- Uline
Highlights of The ESD Packaging Materials Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Primary Packing Material
- Approaching Packaging Material
- Secondary Packaging Material
- By Application:
- Communication Network Infrastructure
- Consumer Electronics
- Computer Peripherals
- Aerospace and Defense
- Healthcare and Instrumentation
- Automotive
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the ESD Packaging Materials Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
ESD packaging materials are used to protect electronic equipment from electrostatic discharge (ESD). ESD can cause damage to electronic equipment, and can also create a safety hazard. ESD packaging materials help prevent ESD from damaging the equipment, and they also help keep the equipment safe.
Some of the major companies in the esd packaging materials market are BASF, Desco Industries, Dow Chemical Company, PPG Industries, AkzoNobel, DaklaPack Group, Dou Yee, GWP Group, Kao-Chia Plastics, Miller Supply, BASF, TIP Corporation, Uline.
The esd packaging materials market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 ESD Packaging Materials Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 ESD Packaging Materials Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 ESD Packaging Materials Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the ESD Packaging Materials Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global ESD Packaging Materials Market Size & Forecast, 2020-2028
4.5.1 ESD Packaging Materials Market Size and Y-o-Y Growth
4.5.2 ESD Packaging Materials Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Primary Packing Material
5.2.2 Approaching Packaging Material
5.2.3 Secondary Packaging Material
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Communication Network Infrastructure
6.2.2 Consumer Electronics
6.2.3 Computer Peripherals
6.2.4 Aerospace and Defense
6.2.5 Healthcare and Instrumentation
6.2.6 Automotive
6.2.7 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global ESD Packaging Materials Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 ESD Packaging Materials Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Primary Packing Material
9.6.2 Approaching Packaging Material
9.6.3 Secondary Packaging Material
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Communication Network Infrastructure
9.10.2 Consumer Electronics
9.10.3 Computer Peripherals
9.10.4 Aerospace and Defense
9.10.5 Healthcare and Instrumentation
9.10.6 Automotive
9.10.7 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Primary Packing Material
10.6.2 Approaching Packaging Material
10.6.3 Secondary Packaging Material
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Communication Network Infrastructure
10.10.2 Consumer Electronics
10.10.3 Computer Peripherals
10.10.4 Aerospace and Defense
10.10.5 Healthcare and Instrumentation
10.10.6 Automotive
10.10.7 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Primary Packing Material
11.6.2 Approaching Packaging Material
11.6.3 Secondary Packaging Material
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Communication Network Infrastructure
11.10.2 Consumer Electronics
11.10.3 Computer Peripherals
11.10.4 Aerospace and Defense
11.10.5 Healthcare and Instrumentation
11.10.6 Automotive
11.10.7 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Primary Packing Material
12.6.2 Approaching Packaging Material
12.6.3 Secondary Packaging Material
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Communication Network Infrastructure
12.10.2 Consumer Electronics
12.10.3 Computer Peripherals
12.10.4 Aerospace and Defense
12.10.5 Healthcare and Instrumentation
12.10.6 Automotive
12.10.7 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Primary Packing Material
13.6.2 Approaching Packaging Material
13.6.3 Secondary Packaging Material
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Communication Network Infrastructure
13.10.2 Consumer Electronics
13.10.3 Computer Peripherals
13.10.4 Aerospace and Defense
13.10.5 Healthcare and Instrumentation
13.10.6 Automotive
13.10.7 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 ESD Packaging Materials Market: Competitive Dashboard
14.2 Global ESD Packaging Materials Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 BASF
14.3.2 Desco Industries
14.3.3 Dow Chemical Company
14.3.4 PPG Industries
14.3.5 AkzoNobel
14.3.6 DaklaPack Group
14.3.7 Dou Yee
14.3.8 GWP Group
14.3.9 Kao-Chia Plastics
14.3.10 Miller Supply
14.3.11 BASF
14.3.12 TIP Corporation
14.3.13 Uline
