Market Overview:
The global fan-in wafer level packaging market is expected to grow at a CAGR of 9.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for miniaturization and higher integration in semiconductor devices, rising demand for advanced packaging solutions in consumer electronics and automotive applications, and growing investments in R&D by semiconductor companies. Based on type, the global fan-in wafer level packaging market is segmented into 200mm WLP, 300mm WLP, and other types. The 300mm WLP segment is expected to grow at a higher CAGR than other segments during the forecast period due to the increasing demand for advanced packaging solutions in high-end applications such as data centers, smartphones, tablets, laptops/notebooks etc. Based on application, the global fan-in wafer level packaging market is segmented into CMOS image sensor (CIS), wireless connectivity (WC), logic & memory IC (L&MIC), MEMS & sensor (MEMS&S), analog & mixed ICs (A&MICs) and other applications. The CIS application segment is expected to account for a major share of the global fan-in wafer level packaging market during the forecast period owing to rising demand for high resolution cameras in consumer electronics products such as smartphones and tablets.
Product Definition:
Fan-in Wafer Level Packaging is a technology used to increase the number of chips that can be mounted on a single wafer. It is accomplished by creating a series of small trenches between the chip pads, which allows several chips to be placed side-by-side on the wafer. Fan-in WLP greatly reduces the cost per die and increases yields by allowing more defective dies to be salvaged.
200mm Wafer Level Packaging:
200mm Wafer Level Packaging (WLP) is a technology that packages semiconductor devices such as silicon wafers for the purpose of protecting them from external environmental factors. 200mm packaging refers to the size or thickness of a product packaged in terms of millimeters. It is different from 300mm, 400mm and 500 mm packaging levels which refer to the sizes or thicknesses of products packaged in terms of inches, centimeter and yard respectively.
300mm Wafer Level Packaging:
300mm Wafer Level Packaging (WLP) is a technology that packages semiconductor wafers of 300 mm diameter and smaller in single-wafer stack. It enables lower shipping costs, reduces wafer inventory, and improves wafer handling efficiency. The technology has been around for more than 10 years but the market penetration was less than 5% until now owing to high cost associated with the equipment.
Application Insights:
The CMOS image sensor application segment accounted for the largest market share in 2017 and is projected to continue its dominance over the forecast period. This is attributed to increasing demand for cameras in smartphones, security systems, surveillance applications and other end-use segments. The 300mm wafer level packaging offers several advantages including low power consumption, high performance and small size which are likely to propel its demand over the forecast period.
Wireless connectivity was another prominent application segment that accounted for a significant market share in 2017 owing to growing demand from various end-use industries such as healthcare, automotive & transportation among others. The growth of these industries can be attributed to technological advancements coupled with increasing disposable income levels especially in developing regions such as Asia Pacific and Latin America among others will drive industry expansion over the coming years.
Logic & memory ICs are expected register a healthy CAGR during the forecast period on account of rising product usage across different industry verticals including consumer electronics, industrial applications (e.
Regional Analysis:
Asia Pacific dominated the global fan-in wafer level packaging market in 2017 and is expected to continue its dominance over the forecast period. The region has witnessed a surge in demand for consumer electronics, mobile phones, computer monitors, laptops among others owing to growing population and rising disposable income. This trend is projected to continue over the next eight years which will benefit regional growth.
The increasing use of smartphones coupled with rapid development of high performance computing centers across Asian countries such as China and India are anticipated to drive industry expansion over this region. In addition, favorable government initiatives such as “Make in India†campaign by Indian government are expected to create ample growth opportunities for semiconductor manufacturers based within the country thereby driving regional demand during the forecast period.
Europe accounted for more than 20% share of global revenue in 2017 owing both volume (300mm wafer level packaging) and revenue (200mm wafer level packaging).
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Proliferation of 3D printing technology
- Rising demand for advanced packaging solutions in automotive and aerospace industries
- Growing trend of consolidation among semiconductor companies
- Emergence of new packaging materials and technologies
Scope Of The Report
Report Attributes
Report Details
Report Title
Fan-in Wafer Level Packaging Market Research Report
By Type
200mm Wafer Level Packaging, 300mm Wafer Level Packaging, Other
By Application
CMOS Image Sensor, Wireless Connectivity, Logic and Memory IC, MEMS and Sensor, Analog and Mixed IC, Other
By Companies
STATS ChipPAC, STMicroelectronics, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, Veeco/CNT, FlipChip International
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
132
Number of Tables & Figures
93
Customization Available
Yes, the report can be customized as per your need.
Global Fan-in Wafer Level Packaging Market Report Segments:
The global Fan-in Wafer Level Packaging market is segmented on the basis of:
Types
200mm Wafer Level Packaging, 300mm Wafer Level Packaging, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
CMOS Image Sensor, Wireless Connectivity, Logic and Memory IC, MEMS and Sensor, Analog and Mixed IC, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- STATS ChipPAC
- STMicroelectronics
- TSMC
- Texas Instruments
- Rudolph Technologies
- SEMES
- SUSS MicroTec
- Veeco/CNT
- FlipChip International
Highlights of The Fan-in Wafer Level Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 200mm Wafer Level Packaging
- 300mm Wafer Level Packaging
- Other
- By Application:
- CMOS Image Sensor
- Wireless Connectivity
- Logic and Memory IC
- MEMS and Sensor
- Analog and Mixed IC
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Fan-in Wafer Level Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Fan-in Wafer Level Packaging is a packaging technology that allows multiple wafers to be packaged together on a single substrate. This type of packaging can reduce the amount of space that is needed for wafer storage, and it also allows for easier assembly and deployment of the devices.
Some of the major players in the fan-in wafer level packaging market are STATS ChipPAC, STMicroelectronics, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, Veeco/CNT, FlipChip International.
The fan-in wafer level packaging market is expected to grow at a compound annual growth rate of 9.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Fan-in Wafer Level Packaging Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Fan-in Wafer Level Packaging Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Fan-in Wafer Level Packaging Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Fan-in Wafer Level Packaging Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Fan-in Wafer Level Packaging Market Size & Forecast, 2020-2028 4.5.1 Fan-in Wafer Level Packaging Market Size and Y-o-Y Growth 4.5.2 Fan-in Wafer Level Packaging Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 200mm Wafer Level Packaging
5.2.2 300mm Wafer Level Packaging
5.2.3 Other
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 CMOS Image Sensor
6.2.2 Wireless Connectivity
6.2.3 Logic and Memory IC
6.2.4 MEMS and Sensor
6.2.5 Analog and Mixed IC
6.2.6 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Fan-in Wafer Level Packaging Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Fan-in Wafer Level Packaging Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 200mm Wafer Level Packaging
9.6.2 300mm Wafer Level Packaging
9.6.3 Other
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 CMOS Image Sensor
9.10.2 Wireless Connectivity
9.10.3 Logic and Memory IC
9.10.4 MEMS and Sensor
9.10.5 Analog and Mixed IC
9.10.6 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 200mm Wafer Level Packaging
10.6.2 300mm Wafer Level Packaging
10.6.3 Other
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 CMOS Image Sensor
10.10.2 Wireless Connectivity
10.10.3 Logic and Memory IC
10.10.4 MEMS and Sensor
10.10.5 Analog and Mixed IC
10.10.6 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 200mm Wafer Level Packaging
11.6.2 300mm Wafer Level Packaging
11.6.3 Other
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 CMOS Image Sensor
11.10.2 Wireless Connectivity
11.10.3 Logic and Memory IC
11.10.4 MEMS and Sensor
11.10.5 Analog and Mixed IC
11.10.6 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 200mm Wafer Level Packaging
12.6.2 300mm Wafer Level Packaging
12.6.3 Other
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 CMOS Image Sensor
12.10.2 Wireless Connectivity
12.10.3 Logic and Memory IC
12.10.4 MEMS and Sensor
12.10.5 Analog and Mixed IC
12.10.6 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 200mm Wafer Level Packaging
13.6.2 300mm Wafer Level Packaging
13.6.3 Other
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 CMOS Image Sensor
13.10.2 Wireless Connectivity
13.10.3 Logic and Memory IC
13.10.4 MEMS and Sensor
13.10.5 Analog and Mixed IC
13.10.6 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Fan-in Wafer Level Packaging Market: Competitive Dashboard
14.2 Global Fan-in Wafer Level Packaging Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 STATS ChipPAC
14.3.2 STMicroelectronics
14.3.3 TSMC
14.3.4 Texas Instruments
14.3.5 Rudolph Technologies
14.3.6 SEMES
14.3.7 SUSS MicroTec
14.3.8 Veeco/CNT
14.3.9 FlipChip International