Market Overview:
The global fan-out packaging market is expected to grow at a CAGR of 9.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturization and higher density in electronic devices, rising demand for advanced packaging solutions in the automotive industry, and growing adoption of fan-out packaging in telecom applications. Based on type, the global fan-out packaging market can be segmented into core fan-out packaging and high-density fan-out packaging. Core fan- out packages are witnessing higher demand due to their low cost and easy manufacturability as compared to high density packages. However, with advancements being made in technology that enable miniaturization of components packed within a limited area, high density packages are expected to witness faster growth during the forecast period. Based on application, the global Fan Out Packaging Market can be segmented into consumer electronics, automotive industry, aerospace and defense industry,, telecom industry,,and other applications such as medical implants etcetera). Among these segments,.smartphones,.tabletsetc.
Product Definition:
Fan-out packaging is a type of package in which the package substrate is narrower than the die or chips mounted on it. The chips are "fan-out" from the edges of the substrate to its corners, allowing more dies to be mounted on a given surface area. Fan-out packaging is used for integrated circuits (ICs) and other semiconductor devices. One advantage of fan-out packaging is that it allows more dies to be mounted on a given surface area, thus reducing manufacturing costs.
Core Fan-Out Packaging:
Core fan-out packaging is a type of packaging in which the individual units or components are packed in an outer box with fan-outs. The primary benefit of core fan-out packaging is that it allows for easy stacking and handling while offering high levels of protection to individual components. It also aids in reducing shipping costs as well as weight, which further helps companies lower their carbon footprint during product delivery.
High-Density Fan-Out Packaging:
High-Density Fan-Out Packaging (HDFP) is a high performance packaging technique that uses multiple fan-out structures to distribute the heat load more uniformly. The key benefit of HDFP is that it allows the use of smaller, thinner and lighter packages with higher density as compared to conventional bulkhead or sideband solutions.
Application Insights:
The consumer electronics industry accounted for the largest revenue share in 2016 and is expected to continue its dominance over the forecast period. The telecom industry is also expected to witness significant growth during the same period owing to increasing demand for high-speed internet services. Other applications include automobile industry, food and beverages packaging, medical devices packaging as well as aerospace and defense.
Automobile manufacturers are increasingly using FOP systems due to their ability of reducing vehicle weight while increasing passenger capacity thereby improving fuel efficiency and overall performance of vehicles. In addition, these systems help reduce carbon emissions by up to 15% when compared with conventional ramp loading techniques at airports which further supports its adoption in this sector.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for consumer electronics and automobiles in China, India, Japan, South Korea, and Taiwan. In addition, rising disposable income of consumers coupled with rapid urbanization in these countries will drive product sales further.
The European region accounted for a significant share of revenue generation owing to early adoption of technologies by companies such as Amphenol Corporation; Airbus S.A.; Avago Technologies; Calsonic Kansei Corporation; Infineon Technologies AG; Linear Technology Corp.; Mitsubishi Electric Factory Automation Ltd.; Molex Inc.; Panasonic Electronic Devices & Components Co., Ltd.; Renesas Electronics Corporation; Samsung Electro-Mechanics Co., Ltd.; Shindengen Electric Manufacturing Company Limited (SEMCO); Skyworks Solutions Incorporated; Texas Instruments Incorporated (TI).
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Proliferation of advanced packaging technologies
- Growing trend of system-in-package (SiP) and 3D chip stacking
- Rising need for high reliability and low failure rates in electronics products
- Growing popularity of fan-out wafer level packaging (FOWLP) technology
Scope Of The Report
Report Attributes
Report Details
Report Title
Fan-Out Packaging Market Research Report
By Type
Core Fan-Out Packaging, High-Density Fan-Out Packaging
By Application
Consumer Electronics, Automobile Industry, Aerospace and Defense, Telecom Industry, Other
By Companies
ASE Group, YoleDeveloppement, Atotech, NXP, Camtek, STATS ChipPAC, Deca Technologies, INTEVAC, Onto Innovation, Amkor Technology Inc., Samsung Electro-Mechanics, Powertech Technology Inc.
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
184
Number of Tables & Figures
129
Customization Available
Yes, the report can be customized as per your need.
Global Fan-Out Packaging Market Report Segments:
The global Fan-Out Packaging market is segmented on the basis of:
Types
Core Fan-Out Packaging, High-Density Fan-Out Packaging
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Automobile Industry, Aerospace and Defense, Telecom Industry, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ASE Group
- YoleDeveloppement
- Atotech
- NXP
- Camtek
- STATS ChipPAC
- Deca Technologies
- INTEVAC
- Onto Innovation
- Amkor Technology Inc.
- Samsung Electro-Mechanics
- Powertech Technology Inc.
Highlights of The Fan-Out Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Core Fan-Out Packaging
- High-Density Fan-Out Packaging
- By Application:
- Consumer Electronics
- Automobile Industry
- Aerospace and Defense
- Telecom Industry
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Fan-Out Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Fan-Out packaging is a type of packaging in which products are packaged in individual boxes that are then packed into larger boxes. This type of packaging allows for more product to be packaged per box, which can lead to lower shipping costs and increased sales.
Some of the major players in the fan-out packaging market are ASE Group, YoleDeveloppement, Atotech, NXP, Camtek, STATS ChipPAC, Deca Technologies, INTEVAC, Onto Innovation, Amkor Technology Inc., Samsung Electro-Mechanics, Powertech Technology Inc..
The fan-out packaging market is expected to register a CAGR of 9.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Fan-Out Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Fan-Out Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Fan-Out Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Fan-Out Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Fan-Out Packaging Market Size & Forecast, 2018-2028
4.5.1 Fan-Out Packaging Market Size and Y-o-Y Growth
4.5.2 Fan-Out Packaging Market Absolute $ Opportunity
Chapter 5 Global Fan-Out Packaging Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Fan-Out Packaging Market Size Forecast by Type
5.2.1 Core Fan-Out Packaging
5.2.2 High-Density Fan-Out Packaging
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Fan-Out Packaging Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Fan-Out Packaging Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Automobile Industry
6.2.3 Aerospace and Defense
6.2.4 Telecom Industry
6.2.5 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Fan-Out Packaging Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Fan-Out Packaging Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Fan-Out Packaging Analysis and Forecast
9.1 Introduction
9.2 North America Fan-Out Packaging Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Fan-Out Packaging Market Size Forecast by Type
9.6.1 Core Fan-Out Packaging
9.6.2 High-Density Fan-Out Packaging
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Fan-Out Packaging Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Automobile Industry
9.10.3 Aerospace and Defense
9.10.4 Telecom Industry
9.10.5 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Fan-Out Packaging Analysis and Forecast
10.1 Introduction
10.2 Europe Fan-Out Packaging Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Fan-Out Packaging Market Size Forecast by Type
10.6.1 Core Fan-Out Packaging
10.6.2 High-Density Fan-Out Packaging
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Fan-Out Packaging Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Automobile Industry
10.10.3 Aerospace and Defense
10.10.4 Telecom Industry
10.10.5 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Fan-Out Packaging Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Fan-Out Packaging Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Fan-Out Packaging Market Size Forecast by Type
11.6.1 Core Fan-Out Packaging
11.6.2 High-Density Fan-Out Packaging
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Fan-Out Packaging Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Automobile Industry
11.10.3 Aerospace and Defense
11.10.4 Telecom Industry
11.10.5 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Fan-Out Packaging Analysis and Forecast
12.1 Introduction
12.2 Latin America Fan-Out Packaging Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Fan-Out Packaging Market Size Forecast by Type
12.6.1 Core Fan-Out Packaging
12.6.2 High-Density Fan-Out Packaging
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Fan-Out Packaging Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Automobile Industry
12.10.3 Aerospace and Defense
12.10.4 Telecom Industry
12.10.5 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Fan-Out Packaging Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Fan-Out Packaging Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Fan-Out Packaging Market Size Forecast by Type
13.6.1 Core Fan-Out Packaging
13.6.2 High-Density Fan-Out Packaging
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Fan-Out Packaging Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Automobile Industry
13.10.3 Aerospace and Defense
13.10.4 Telecom Industry
13.10.5 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Fan-Out Packaging Market: Competitive Dashboard
14.2 Global Fan-Out Packaging Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 ASE Group
14.3.2 YoleDeveloppement
14.3.3 Atotech
14.3.4 NXP
14.3.5 Camtek
14.3.6 STATS ChipPAC
14.3.7 Deca Technologies
14.3.8 INTEVAC
14.3.9 Onto Innovation
14.3.10 Amkor Technology Inc.
14.3.11 Samsung Electro-Mechanics
14.3.12 Powertech Technology Inc.
