Market Overview:
The global float zone (FZ) wafer market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for FZ wafers from various applications, such as discrete power devices, high efficiency solar, RF chips, optical products and others. In terms of type, the FZ grinding wafer segment is expected to hold the largest share of the global FZ wafer market during the forecast period. This can be attributed to its growing demand from various applications across different regions.
 Wafer Industry Outlook.svg)
Product Definition:
The Float Zone (FZ) Wafer is a semiconductor wafer that is made from a single crystal of silicon. This type of wafer is used in the manufacture of high-end microprocessors and other advanced semiconductor devices. The Float Zone (FZ) Wafer has many advantages over traditional semiconductor wafers, including higher purity, better uniformity, and improved performance.
FZ Grinding Wafer:
FZ grinding wafer is a type of semiconductor device processing equipment which is used to grind and polish semiconductor materials such as silicon wafers. The FZ grinding system consists of three major components, namely the feeder, the floatation machine and the polish machine. The primary function of this equipment is to separate fine particles from solid material in order to produce high-quality polished surfaces with minimum defects.
FZ Etching wafer:
FZ Etching wafer is a special type of silicon wafer used in the manufacturing process of integrated circuits (IC) for etching and cleaning purposes. The FZ-wafers are manufactured with high purity materials such as silicon, which helps in delivering optimum performance during the processing stage. These products are utilized by major industry players including foundry companies, semiconductor manufacturers, and device fabricators for their product designing & development workstations.
Application Insights:
The discrete power devices segment accounted for the largest market share in 2017 and is projected to expand at a CAGR of XX% over the forecast period. The growth can be attributed to increasing demand for FZ polishing wafers from various industries including telecom, IT, automotive and medical among others.
Flexible electronics is one of the fastest-growing application segments owing to high demand from several applications such as smartphones, wearable devices and tablets among others. The growth can be attributed to increased production of electronic products in Asia Pacific region on account of growing population along with rising per capita income levels coupled with attractive government policies regarding ¢â‚¬Å“Make In India¢â‚¬ initiative by the Government Of India which will further boost product demand over next few years.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The region is home to several key players, which has resulted in high competition in the industry. However, rapid growth of electronics manufacturing sector due to increasing demand for electronic products with low power consumption and cost-effective solutions is anticipated to drive regional growth over the next eight years.
Europe was estimated at USD X million in 2017 owing to presence of a large number of semiconductor manufacturers across Germany, France, U.K.
Growth Factors:
- Increasing demand for semiconductor devices from the consumer electronics sector is expected to drive the growth of Float Zone (FZ) Wafer market over the forecast period.
- Rising demand for miniaturized and energy-efficient electronic devices is also anticipated to propel the growth of Float Zone (FZ) Wafer market in near future.
- Growing penetration of smartphones and tablets across emerging economies is projected to create new opportunities for Float Zone (FZ) Wafer market in coming years.
- Proliferation of 4G technology and increasing adoption of cloud-based services are also expected to boost the demand for semiconductor components, which in turn will fuel the growth of Float Zone (FZ) Wafer market over next few years.
Scope Of The Report
Report Attributes
Report Details
Report Title
Float Zone (FZ) Wafer Market Research Report
By Type
FZ Grinding Wafer, FZ Etching wafer, FZ Polishing wafer
By Application
Discrete Power Devices, High Efficiency Solar, RF Chips, Optical Products, Others
By Companies
Suzhou Sicreat Nanotech, Fine Silicon Manufacturing(FSM), RS Technologies, NOVA Electronic Materials, Zhonghuan Semiconductor
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
232
Number of Tables & Figures
163
Customization Available
Yes, the report can be customized as per your need.
Global Float Zone (FZ) Wafer Market Report Segments:
The global Float Zone (FZ) Wafer market is segmented on the basis of:
Types
FZ Grinding Wafer, FZ Etching wafer, FZ Polishing wafer
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Discrete Power Devices, High Efficiency Solar, RF Chips, Optical Products, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Suzhou Sicreat Nanotech
- Fine Silicon Manufacturing(FSM)
- RS Technologies
- NOVA Electronic Materials
- Zhonghuan Semiconductor
 Wafer Market Overview.svg)
Highlights of The Float Zone (FZ) Wafer Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- FZ Grinding Wafer
- FZ Etching wafer
- FZ Polishing wafer
- By Application:
- Discrete Power Devices
- High Efficiency Solar
- RF Chips
- Optical Products
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Float Zone (FZ) Wafer Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
 Wafer Market Statistics.svg)
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Float Zone Wafer is a new type of semiconductor wafer that can be used in electronic devices. It has a unique feature that allows it to float on water, making it easier to transport and handle.
Some of the major players in the float zone (fz) wafer market are Suzhou Sicreat Nanotech, Fine Silicon Manufacturing(FSM), RS Technologies, NOVA Electronic Materials, Zhonghuan Semiconductor.
The float zone (fz) wafer market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Float Zone (FZ) Wafer Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Float Zone (FZ) Wafer Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Float Zone (FZ) Wafer Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Float Zone (FZ) Wafer Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Float Zone (FZ) Wafer Market Size & Forecast, 2018-2028
4.5.1 Float Zone (FZ) Wafer Market Size and Y-o-Y Growth
4.5.2 Float Zone (FZ) Wafer Market Absolute $ Opportunity
Chapter 5 Global Float Zone (FZ) Wafer Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Float Zone (FZ) Wafer Market Size Forecast by Type
5.2.1 FZ Grinding Wafer
5.2.2 FZ Etching wafer
5.2.3 FZ Polishing wafer
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Float Zone (FZ) Wafer Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Float Zone (FZ) Wafer Market Size Forecast by Applications
6.2.1 Discrete Power Devices
6.2.2 High Efficiency Solar
6.2.3 RF Chips
6.2.4 Optical Products
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Float Zone (FZ) Wafer Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Float Zone (FZ) Wafer Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Float Zone (FZ) Wafer Analysis and Forecast
9.1 Introduction
9.2 North America Float Zone (FZ) Wafer Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Float Zone (FZ) Wafer Market Size Forecast by Type
9.6.1 FZ Grinding Wafer
9.6.2 FZ Etching wafer
9.6.3 FZ Polishing wafer
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Float Zone (FZ) Wafer Market Size Forecast by Applications
9.10.1 Discrete Power Devices
9.10.2 High Efficiency Solar
9.10.3 RF Chips
9.10.4 Optical Products
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Float Zone (FZ) Wafer Analysis and Forecast
10.1 Introduction
10.2 Europe Float Zone (FZ) Wafer Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Float Zone (FZ) Wafer Market Size Forecast by Type
10.6.1 FZ Grinding Wafer
10.6.2 FZ Etching wafer
10.6.3 FZ Polishing wafer
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Float Zone (FZ) Wafer Market Size Forecast by Applications
10.10.1 Discrete Power Devices
10.10.2 High Efficiency Solar
10.10.3 RF Chips
10.10.4 Optical Products
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Float Zone (FZ) Wafer Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Float Zone (FZ) Wafer Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Float Zone (FZ) Wafer Market Size Forecast by Type
11.6.1 FZ Grinding Wafer
11.6.2 FZ Etching wafer
11.6.3 FZ Polishing wafer
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Float Zone (FZ) Wafer Market Size Forecast by Applications
11.10.1 Discrete Power Devices
11.10.2 High Efficiency Solar
11.10.3 RF Chips
11.10.4 Optical Products
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Float Zone (FZ) Wafer Analysis and Forecast
12.1 Introduction
12.2 Latin America Float Zone (FZ) Wafer Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Float Zone (FZ) Wafer Market Size Forecast by Type
12.6.1 FZ Grinding Wafer
12.6.2 FZ Etching wafer
12.6.3 FZ Polishing wafer
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Float Zone (FZ) Wafer Market Size Forecast by Applications
12.10.1 Discrete Power Devices
12.10.2 High Efficiency Solar
12.10.3 RF Chips
12.10.4 Optical Products
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Float Zone (FZ) Wafer Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Float Zone (FZ) Wafer Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Float Zone (FZ) Wafer Market Size Forecast by Type
13.6.1 FZ Grinding Wafer
13.6.2 FZ Etching wafer
13.6.3 FZ Polishing wafer
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Float Zone (FZ) Wafer Market Size Forecast by Applications
13.10.1 Discrete Power Devices
13.10.2 High Efficiency Solar
13.10.3 RF Chips
13.10.4 Optical Products
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Float Zone (FZ) Wafer Market: Competitive Dashboard
14.2 Global Float Zone (FZ) Wafer Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Suzhou Sicreat Nanotech
14.3.2 Fine Silicon Manufacturing(FSM)
14.3.3 RS Technologies
14.3.4 NOVA Electronic Materials
14.3.5 Zhonghuan Semiconductor
