Market Overview:
The global heat conductive paste market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for miniaturization and higher performance in electronic devices, rising adoption of advanced packaging technologies, and growing demand for semiconductor devices. In terms of type, the silver-based segment is expected to lead the global heat conductive paste market during the forecast period. This can be attributed to its high thermal conductivity and low resistivity as compared with other types of heat conductive pastes. In terms of application, microprocessors are expected to account for the largest share of the global heat conductive paste market during the forecast period.
Product Definition:
A heat conductive paste is a viscous material that is used to improve the heat transfer between two surfaces. The paste fills in any gaps or irregularities between the surfaces and helps to ensure that maximum contact is made. This results in improved thermal performance and can help to prevent overheating or damage to electronic components.
Silver Based:
The global heat conductive paste market size was valued at USD 6.5 billion in 2016 and is expected to grow at a CAGR of XX% over the forecast period on account of rising demand from end-use industries including electronics, automotive, aerospace & defense and building & construction industry. The product offers superior thermal performance as compared to its substitutes which include ceramics and other metal oxides based products; this factor is anticipated to augment growth over the coming years.
Copper Based:
Copper-based heat conductive pastes are used in the electronics industry to improve thermal performance of various devices. Heat conductive paste is a copper based alloy which consists of lead, tin and silver along with other metals such as bismuth, zinc and magnesium.
Application Insights:
The microprocessor application segment led the global heat conductive paste market in 2017 and is projected to expand at a revenue-based CAGR of XX% over the forecast period. The growth can be attributed to increasing demand for high-performance chips from various end-use industries such as consumer electronics, healthcare, and automotive. In addition, factors such as growing electronics industry in China and India on account of cheap labor will drive product demand over the coming years.
Circuit board application segment was valued at USD 89.5 million in 2017 owing to its rising use across diverse end-use industries including electrical & electronics, building & construction, industrial machinery etc., which require thermal resistance for proper functioning of equipment or machine parts carrying hot components or PCBs with them during operation. Circuit boards are also used across several applications areas within electronic devices where heat management is critical; these include power supplies (PSUs), motherboards/PCB assembly/repairing etc.
Regional Analysis:
North America dominated the global industry in 2017. The region is expected to witness a growth rate of 5.6% over the forecast period, owing to increasing demand for electronic products and growing use of electronics in various applications such as medical devices, military & aerospace equipment, consumer appliances among others.
The U.S., being one of the most developed countries in terms of technology has led to an increase in demand for heat conducting paste from microelectronics application segment which dominates North American market space. Europe is also anticipated to be a promising regional market with Germany and France being major contributors towards regional growth owing to high production volume as well as consumption levels across several industries including automotive and transportation among others).
Asia Pacific is projected by International Trade Administration (ITA) at the U.
Growth Factors:
- Increasing demand for heat conductive paste from the electronics and semiconductor industries as a result of the miniaturization of electronic devices and the trend toward higher power densities.
- The increasing use of heat conductive paste in LED lighting to improve thermal management and extend product life.
- Growing demand for high-performance thermal interface materials in automotive applications to meet stringent fuel economy standards.
- Rising popularity of heat pipe cooling systems, which require heat conductive pastes for optimal performance.
Scope Of The Report
Report Attributes
Report Details
Report Title
Heat Conductive Paste Market Research Report
By Type
Silver Based, Copper Based, Aluminum Based
By Application
Microprocessor, Circuit Board, Other
By Companies
Sekisui Chemical, Thermo Electra, Kyocera, Acrolab, AG TermoPasty, MTC, LORD Corp, RESOL, Sekisui Chemical
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
244
Number of Tables & Figures
171
Customization Available
Yes, the report can be customized as per your need.
Global Heat Conductive Paste Market Report Segments:
The global Heat Conductive Paste market is segmented on the basis of:
Types
Silver Based, Copper Based, Aluminum Based
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Microprocessor, Circuit Board, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Sekisui Chemical
- Thermo Electra
- Kyocera
- Acrolab
- AG TermoPasty
- MTC
- LORD Corp
- RESOL
- Sekisui Chemical
Highlights of The Heat Conductive Paste Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Silver Based
- Copper Based
- Aluminum Based
- By Application:
- Microprocessor
- Circuit Board
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Heat Conductive Paste Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Heat conductive paste is a type of adhesive that helps to increase the heat transfer rate between two surfaces. This can be helpful in situations where you need to quickly and easily attach two pieces of material together.
Some of the major companies in the heat conductive paste market are Sekisui Chemical, Thermo Electra, Kyocera, Acrolab, AG TermoPasty, MTC, LORD Corp, RESOL, Sekisui Chemical.
The heat conductive paste market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Heat Conductive Paste Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Heat Conductive Paste Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Heat Conductive Paste Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Heat Conductive Paste Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Heat Conductive Paste Market Size & Forecast, 2020-2028
4.5.1 Heat Conductive Paste Market Size and Y-o-Y Growth
4.5.2 Heat Conductive Paste Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Silver Based
5.2.2 Copper Based
5.2.3 Aluminum Based
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Microprocessor
6.2.2 Circuit Board
6.2.3 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Heat Conductive Paste Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Heat Conductive Paste Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Silver Based
9.6.2 Copper Based
9.6.3 Aluminum Based
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Microprocessor
9.10.2 Circuit Board
9.10.3 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Silver Based
10.6.2 Copper Based
10.6.3 Aluminum Based
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Microprocessor
10.10.2 Circuit Board
10.10.3 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Silver Based
11.6.2 Copper Based
11.6.3 Aluminum Based
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Microprocessor
11.10.2 Circuit Board
11.10.3 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Silver Based
12.6.2 Copper Based
12.6.3 Aluminum Based
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Microprocessor
12.10.2 Circuit Board
12.10.3 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Silver Based
13.6.2 Copper Based
13.6.3 Aluminum Based
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Microprocessor
13.10.2 Circuit Board
13.10.3 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Heat Conductive Paste Market: Competitive Dashboard
14.2 Global Heat Conductive Paste Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Sekisui Chemical
14.3.2 Thermo Electra
14.3.3 Kyocera
14.3.4 Acrolab
14.3.5 AG TermoPasty
14.3.6 MTC
14.3.7 LORD Corp
14.3.8 RESOL
14.3.9 Sekisui Chemical
