Market Overview:
The global high density interconnect PCB market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturized and lightweight electronic devices, such as smartphones, tablets, laptops, and smart wearables. In addition, the growing demand for high-performance electronics in automotive applications is also contributing to the growth of this market. The global high density interconnect PCB market can be segmented on the basis of type into smartphone & tablet, laptop & PC, smart wearables, and others. The smartphone & tablet segment is expected to account for the largest share of this market in 2018 owing to the increasing demand for these devices across all regions. The laptop & PC segment is also expected to grow at a significant rate during the forecast period due to rising sales of these devices across all regions. On the basis of application, consumer electronics accounted for majority share of this market in 2017 and it is projected that it will maintain its dominance duringthe forecast period as well owingto rising adoption ratesof advanced electronic gadgets such as 4K TVsand gaming consoles worldwide .
Product Definition:
High Density Interconnect PCBs are used to connect different electronic components together. They allow for a high level of communication between these components, which is why they are so important in electronic devices.
Smartphone & Tablet:
Smartphone & tablet is a handheld personal computer with features similar to that of a smartphone and larger screen size like a tablet. Smartphones are smaller, smarter, and more powerful than tablets. They have the ability to connect to the internet and access numerous online applications along with supporting multiple users for communication and business purposes.
Laptop & PC:
High-Density Interconnect PCB (HDIPC) is a type of electronic component used in the manufacturing of computer systems and laptops. The major difference between HDIPC and other types of printed circuit boards (PCB) is that HDIPCs have higher density than standard PCBs. This enables more components to be placed on one surface area, which results in lower space requirements for the components as well as devices mounted on it.
Application Insights:
High Density Interconnect PCBs are used in numerous consumer electronics products such as smartphones, tablets, smart wearables and televisions among others. The increasing demand for high technology products in developed economies of North America and Europe is expected to drive the market over the forecast period. In addition, HCI PCBs provide better signal quality owing to advanced interconnection techniques between components resulting in a more reliable product. This factor is anticipated to fuel industry growth over the forecast period particularly during the next eight years when compared with other regions where manufacturing activities have shifted from traditional circuit boards towards newer technologies like flexible circuits and high density interconnect pcb boards.
The military and defense segment accounted for a significant share of 15% on account of growing government expenditure on research & development activities related to electronic systems & equipment for armed forces applications across various regions including Asia Pacific, Middle East countries including Saudi Arabia UAE Oman Qatar Kuwait Jordan South Africa Belgium Russia China etcetera).
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional high density interconnect PCB market over the forecast period. The growth can be attributed to increasing demand for smartphones, laptops, and other electronic products in this region. In addition, rising investments by governments in developing countries such as China and India are anticipated to boost the demand for advanced electronic products which will further propel regional growth.
The European market accounted for a significant share of global revenue in 2017 owing to growing product adoption on account of technological advancements coupled with stringent government regulations regarding environmental protection from toxic materials used during manufacturing high volume consumer electronics devices. Moreover, Europe has been one of the key regions that have witnessed increased spending on military & defense activities which is likely to positively influence industry development over the coming years.
North America occupied a significant share within global HCI PCB market mainly due its presence of major technology players along with well-established telecommunication infrastructure network across U.S.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Proliferation of high-performance and power-sensitive applications
- Growing trend of system-in-package (SiP) and multi-chip module (MCM) assemblies
- Emergence of 3D printing technology for PCB fabrication 5. Rising popularity of Internet of Things (IoT)
Scope Of The Report
Report Attributes
Report Details
Report Title
High Density Interconnect PCB Market Research Report
By Type
Smartphone & Tablet, Laptop & PC, Smart Wearables, Others
By Application
Consumer Electronics, Military And Defense, Telecom And IT, Automotive
By Companies
TTM Technologies (US), PCBCART (China), Millennium Circuits Limited (US), RAYMING (China), Mistral Solutions Pvt. Ltd. (India), SIERRA CIRCUITS INC. (US), Advanced Circuits (US), FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan), FINELINE Ltd. (Israel), Austria Technologie & Systemtechnik Aktiengesellschaft (Austria), TTM Technologies (US)
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
198
Number of Tables & Figures
139
Customization Available
Yes, the report can be customized as per your need.
Global High Density Interconnect PCB Market Report Segments:
The global High Density Interconnect PCB market is segmented on the basis of:
Types
Smartphone & Tablet, Laptop & PC, Smart Wearables, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Military And Defense, Telecom And IT, Automotive
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- TTM Technologies (US)
- PCBCART (China)
- Millennium Circuits Limited (US)
- RAYMING (China)
- Mistral Solutions Pvt. Ltd. (India)
- SIERRA CIRCUITS INC. (US)
- Advanced Circuits (US)
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan)
- FINELINE Ltd. (Israel)
- Austria Technologie & Systemtechnik Aktiengesellschaft (Austria)
- TTM Technologies (US)
Highlights of The High Density Interconnect PCB Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Smartphone & Tablet
- Laptop & PC
- Smart Wearables
- Others
- By Application:
- Consumer Electronics
- Military And Defense
- Telecom And IT
- Automotive
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the High Density Interconnect PCB Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
High Density Interconnect PCB (HDIP) is a type of printed circuit board that has more than one layer. HDIP boards are used in applications where high-speed data transmission and low power consumption are important, such as industrial control systems, medical equipment, and consumer electronics.
Some of the major players in the high density interconnect pcb market are TTM Technologies (US), PCBCART (China), Millennium Circuits Limited (US), RAYMING (China), Mistral Solutions Pvt. Ltd. (India), SIERRA CIRCUITS INC. (US), Advanced Circuits (US), FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan), FINELINE Ltd. (Israel), Austria Technologie & Systemtechnik Aktiengesellschaft (Austria), TTM Technologies (US).
The high density interconnect pcb market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 High Density Interconnect PCB Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 High Density Interconnect PCB Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 High Density Interconnect PCB Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the High Density Interconnect PCB Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global High Density Interconnect PCB Market Size & Forecast, 2018-2028
4.5.1 High Density Interconnect PCB Market Size and Y-o-Y Growth
4.5.2 High Density Interconnect PCB Market Absolute $ Opportunity
Chapter 5 Global High Density Interconnect PCB Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 High Density Interconnect PCB Market Size Forecast by Type
5.2.1 Smartphone & Tablet
5.2.2 Laptop & PC
5.2.3 Smart Wearables
5.2.4 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global High Density Interconnect PCB Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 High Density Interconnect PCB Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Military And Defense
6.2.3 Telecom And IT
6.2.4 Automotive
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global High Density Interconnect PCB Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 High Density Interconnect PCB Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America High Density Interconnect PCB Analysis and Forecast
9.1 Introduction
9.2 North America High Density Interconnect PCB Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America High Density Interconnect PCB Market Size Forecast by Type
9.6.1 Smartphone & Tablet
9.6.2 Laptop & PC
9.6.3 Smart Wearables
9.6.4 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America High Density Interconnect PCB Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Military And Defense
9.10.3 Telecom And IT
9.10.4 Automotive
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe High Density Interconnect PCB Analysis and Forecast
10.1 Introduction
10.2 Europe High Density Interconnect PCB Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe High Density Interconnect PCB Market Size Forecast by Type
10.6.1 Smartphone & Tablet
10.6.2 Laptop & PC
10.6.3 Smart Wearables
10.6.4 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe High Density Interconnect PCB Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Military And Defense
10.10.3 Telecom And IT
10.10.4 Automotive
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific High Density Interconnect PCB Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific High Density Interconnect PCB Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific High Density Interconnect PCB Market Size Forecast by Type
11.6.1 Smartphone & Tablet
11.6.2 Laptop & PC
11.6.3 Smart Wearables
11.6.4 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific High Density Interconnect PCB Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Military And Defense
11.10.3 Telecom And IT
11.10.4 Automotive
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America High Density Interconnect PCB Analysis and Forecast
12.1 Introduction
12.2 Latin America High Density Interconnect PCB Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America High Density Interconnect PCB Market Size Forecast by Type
12.6.1 Smartphone & Tablet
12.6.2 Laptop & PC
12.6.3 Smart Wearables
12.6.4 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America High Density Interconnect PCB Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Military And Defense
12.10.3 Telecom And IT
12.10.4 Automotive
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) High Density Interconnect PCB Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) High Density Interconnect PCB Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) High Density Interconnect PCB Market Size Forecast by Type
13.6.1 Smartphone & Tablet
13.6.2 Laptop & PC
13.6.3 Smart Wearables
13.6.4 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) High Density Interconnect PCB Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Military And Defense
13.10.3 Telecom And IT
13.10.4 Automotive
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 High Density Interconnect PCB Market: Competitive Dashboard
14.2 Global High Density Interconnect PCB Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 TTM Technologies (US)
14.3.2 PCBCART (China)
14.3.3 Millennium Circuits Limited (US)
14.3.4 RAYMING (China)
14.3.5 Mistral Solutions Pvt. Ltd. (India)
14.3.6 SIERRA CIRCUITS INC. (US)
14.3.7 Advanced Circuits (US)
14.3.8 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan)
14.3.9 FINELINE Ltd. (Israel)
14.3.10 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria)
14.3.11 TTM Technologies (US)
