Market Overview:
The global high-density packaging market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for miniaturization and higher performance in electronic devices, rising expenditure on defence and aerospace programmes, and growing medical device industry. In terms of type, MCM packaging techniques are expected to hold the largest share in the global high-density packaging market during the forecast period. This can be attributed to their ability to provide enhanced performance and miniaturization as compared with other types of packaging techniques. In terms of application, consumer electronics is expected to account for the largest share in terms of revenue in 2018 owing to increased demand for advanced electronic devices such as smartphones, tablets, laptops etc.
Product Definition:
High-density packaging is a type of packaging that uses less material than traditional packaging methods to protect and contain the product. This type of packaging is often used for products that are sensitive to damage, such as electronics. The importance of high-density packing is twofold: it can help companies save money on shipping costs by using less material, and it can also help protect the product from being damaged in transit.
MCM Packaging Techniques:
MCM (Macro-Composite Material) packaging techniques are used to construct high-density pouches and bags of various shapes and sizes. These materials have a unique combination of properties which make them suitable for use in various end-use industries such as food & beverages, personal care products, electronics & semiconductors, chemicals among others. The technique is majorly used for constructing rigid as well as flexible packaging solutions that can be customized according to the application requirements.
MCP Packaging Techniques:
MCP Packaging techniques are used in high-density packaging market. MCP stands for Metal Cardboard & Plastic and it is a family of materials consisting of metalized plastic films or sheets, which can be laminated with paperboard and other substrates to form rigid packages. The material offers several advantages such as low weight, recyclability, non-permeability, etc.
Application Insights:
The global high-density packaging market has been segmented into seven applications namely consumer electronics, aerospace & defense, medical devices, IT & telecom, automotive, other and unclassified. The consumer electronics segment accounted for the largest revenue share in 2017 owing to the rising demand for electronic products such as smartphones and tablets among other related products.
The medical devices segment is expected to grow at a significant rate over the forecast period due to increasing investments in advanced healthcare equipment coupled with an increase in R&D activities pertaining to new technological developments. Furthermore, stringent government regulations regarding biohazards are also driving manufacturers towards investing more in designing robust packaging solutions that meet these requirements while protecting sensitive components from damage or contamination during transport or storage. This is further anticipated to drive product demand over the forecast period.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing industrialization and rising living standards of consumers. Rising demand for consumer electronics, such as smartphones and laptops, in emerging economies including China and India has led to increased sales of high-density packaging materials such as corrugated boxes, which are further expected to drive the market in Asia Pacific region.
North America is estimated to account for a significant share owing to early adoption of advanced technologies across various industries including aerospace & defense, medical devices among others. For instance; North American Aerospace Defense Command (ADC) manufactures communication systems used by military aircraft across all USNORTHCOM territories along with providing communication support services worldwide.
Growth Factors:
- Increasing demand for miniaturization in electronic devices is driving the need for high-density packaging.
- The trend of wearable technology is also fueling the growth of high-density packaging, as these devices require smaller and more compact packages.
- Rising demand from the automotive industry for advanced safety features is also contributing to the growth of high-density packaging.
- Growing popularity of 3D printing is enabling manufacturers to create customized high-density packaging solutions for specific applications or products.
- Advances in materials science and manufacturing technologies are making it possible to produce ever smaller and lighter packages, which is further fuelling the growth of this market
Scope Of The Report
Report Attributes
Report Details
Report Title
High-Density Packaging Market Research Report
By Type
MCM Packaging Techniques, MCP Packaging Techniques, SIP Packaging Techniques, 3D - TSV Packaging Techniques
By Application
Consumer Electronics, Aerospace & Defence, Medical Devices, IT & Telecom, Automotive, Other
By Companies
Toshiba, IBM, Amkor Technology, Fujitsu, Siliconware Precision Industries, Hitachi, Samsung Group, Micron Technology, STMicroelectronics, NXP Semiconductors, Mentor - a Siemens Business
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
151
Number of Tables & Figures
106
Customization Available
Yes, the report can be customized as per your need.
Global High-Density Packaging Market Report Segments:
The global High-Density Packaging market is segmented on the basis of:
Types
MCM Packaging Techniques, MCP Packaging Techniques, SIP Packaging Techniques, 3D - TSV Packaging Techniques
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Aerospace & Defence, Medical Devices, IT & Telecom, Automotive, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Toshiba
- IBM
- Amkor Technology
- Fujitsu
- Siliconware Precision Industries
- Hitachi
- Samsung Group
- Micron Technology
- STMicroelectronics
- NXP Semiconductors
- Mentor - a Siemens Business
Highlights of The High-Density Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- MCM Packaging Techniques
- MCP Packaging Techniques
- SIP Packaging Techniques
- 3D - TSV Packaging Techniques
- By Application:
- Consumer Electronics
- Aerospace & Defence
- Medical Devices
- IT & Telecom
- Automotive
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the High-Density Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
High-density packaging is a type of packaging that is designed to contain more product in a smaller space. This type of packaging can be used for products that are sensitive to moisture, such as food products.
Some of the key players operating in the high-density packaging market are Toshiba, IBM, Amkor Technology, Fujitsu, Siliconware Precision Industries, Hitachi, Samsung Group, Micron Technology, STMicroelectronics, NXP Semiconductors, Mentor - a Siemens Business.
The high-density packaging market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 High-Density Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 High-Density Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 High-Density Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the High-Density Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global High-Density Packaging Market Size & Forecast, 2018-2028
4.5.1 High-Density Packaging Market Size and Y-o-Y Growth
4.5.2 High-Density Packaging Market Absolute $ Opportunity
Chapter 5 Global High-Density Packaging Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 High-Density Packaging Market Size Forecast by Type
5.2.1 MCM Packaging Techniques
5.2.2 MCP Packaging Techniques
5.2.3 SIP Packaging Techniques
5.2.4 3D - TSV Packaging Techniques
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global High-Density Packaging Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 High-Density Packaging Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Aerospace & Defence
6.2.3 Medical Devices
6.2.4 IT & Telecom
6.2.5 Automotive
6.2.6 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global High-Density Packaging Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 High-Density Packaging Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America High-Density Packaging Analysis and Forecast
9.1 Introduction
9.2 North America High-Density Packaging Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America High-Density Packaging Market Size Forecast by Type
9.6.1 MCM Packaging Techniques
9.6.2 MCP Packaging Techniques
9.6.3 SIP Packaging Techniques
9.6.4 3D - TSV Packaging Techniques
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America High-Density Packaging Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Aerospace & Defence
9.10.3 Medical Devices
9.10.4 IT & Telecom
9.10.5 Automotive
9.10.6 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe High-Density Packaging Analysis and Forecast
10.1 Introduction
10.2 Europe High-Density Packaging Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe High-Density Packaging Market Size Forecast by Type
10.6.1 MCM Packaging Techniques
10.6.2 MCP Packaging Techniques
10.6.3 SIP Packaging Techniques
10.6.4 3D - TSV Packaging Techniques
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe High-Density Packaging Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Aerospace & Defence
10.10.3 Medical Devices
10.10.4 IT & Telecom
10.10.5 Automotive
10.10.6 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific High-Density Packaging Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific High-Density Packaging Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific High-Density Packaging Market Size Forecast by Type
11.6.1 MCM Packaging Techniques
11.6.2 MCP Packaging Techniques
11.6.3 SIP Packaging Techniques
11.6.4 3D - TSV Packaging Techniques
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific High-Density Packaging Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Aerospace & Defence
11.10.3 Medical Devices
11.10.4 IT & Telecom
11.10.5 Automotive
11.10.6 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America High-Density Packaging Analysis and Forecast
12.1 Introduction
12.2 Latin America High-Density Packaging Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America High-Density Packaging Market Size Forecast by Type
12.6.1 MCM Packaging Techniques
12.6.2 MCP Packaging Techniques
12.6.3 SIP Packaging Techniques
12.6.4 3D - TSV Packaging Techniques
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America High-Density Packaging Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Aerospace & Defence
12.10.3 Medical Devices
12.10.4 IT & Telecom
12.10.5 Automotive
12.10.6 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) High-Density Packaging Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) High-Density Packaging Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) High-Density Packaging Market Size Forecast by Type
13.6.1 MCM Packaging Techniques
13.6.2 MCP Packaging Techniques
13.6.3 SIP Packaging Techniques
13.6.4 3D - TSV Packaging Techniques
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) High-Density Packaging Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Aerospace & Defence
13.10.3 Medical Devices
13.10.4 IT & Telecom
13.10.5 Automotive
13.10.6 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 High-Density Packaging Market: Competitive Dashboard
14.2 Global High-Density Packaging Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Toshiba
14.3.2 IBM
14.3.3 Amkor Technology
14.3.4 Fujitsu
14.3.5 Siliconware Precision Industries
14.3.6 Hitachi
14.3.7 Samsung Group
14.3.8 Micron Technology
14.3.9 STMicroelectronics
14.3.10 NXP Semiconductors
14.3.11 Mentor - a Siemens Business
