Market Overview:
The global high performance insulated substrates for power modules market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth of this market can be attributed to the increasing demand for high-performance power modules in various applications, such as IGBT, high-frequency switching power supply, automotive, aerospace, solar cell component and others. In addition, the growing demand for energy-efficient and reliable systems is also fueling the growth of this market. On the basis of type, the global high performance insulated substrates for power modules market can be segmented into AlN DBC substrate and Al2O3 DBC substrate. The AlN DBC substrate segment is expected to hold a major share in this market during the forecast period owing to its superior thermal conductivity and electrical properties as compared to other materials used in manufacturing these substrates. On the basis of application, this market can be divided into six segments: IGBTs (integrated gate bipolar transistors), high-frequency switching power supplies (HFSPS), automotive electronics components (AECs), aerospace & defense electronics components (A&D ECs), solar cell components and other applications including medical devices & equipment; test & measurement instruments; data centers; telecom infrastructure etc.).
Product Definition:
A high performance insulated substrate for power modules is a material that helps to improve the efficiency and performance of power modules. It does this by providing better thermal conductivity and insulation, which helps to keep the module cooler and prevent it from overheating. This can help to extend the life of the module and improve its overall performance.
AlN DBC Substrate:
AlN DBC substrate is a high-performance, low-cost, and optically transparent material for power modules. It has the potential to be used in any application where high current density needs to be carried by a small package. The AlN layer acts as an excellent heat sink and can maintain its temperature even after the addition of large amounts of heat.
Al2O3 DBC Substrate:
Al2O3 DBC substrate is a high-performance, thermally insulating material that can be used in power modules applications. It has the ability to operate at higher temperatures as compared to other materials such as ceramics and glass. Al2O3 DBC substrates are manufactured by combining silica sand with aluminum powder and boron nitride, which forms an amorphous solid under normal conditions but can be crystallized for use in high-temperature applications.
Application Insights:
The IGBT application segment accounted for the largest revenue share in 2016 and is projected to continue its dominance over the forecast period. The product has been witnessing an increased demand as it offers thermal management benefits along with superior electrical insulation. Furthermore, high-frequency switching power supply application segment is expected to witness significant growth over the forecast period owing to increasing demand from communication and electronics industry segments.
High-performance insulated substrates offer thermal management benefits along with superior electrical insulation properties which are likely to drive their demand in various applications including IGBT, HFSPS and automotive/ aerospace/ defense equipment etcetera. In addition, they also provide protection against EMI & RFI radiation thus augmenting their use in military & aerospace applications at a global level. Power module manufacturers such as ASE Electronics North America Inc.
Regional Analysis:
Europe dominated the global market in terms of revenue share in 2017. The region is expected to continue its dominance over the forecast period owing to increasing demand for high-performance power modules from various end-use industries, such as aerospace and defense, automotive, computing and electronics.
The Asia Pacific regional market is anticipated to witness significant growth over the forecast period owing to rising investments by key industry players in developing countries of this region. For instance, In January 2016; SEGWAY INC., a U.S.-based company invested USD X million for establishing a manufacturing plant in China with an aim of catering to domestic needs along with export opportunities across Asia Pacific region including China and India.
Growth Factors:
- Increasing demand for high performance insulated substrates for power modules from the automotive industry to meet the stringent emission norms.
- Growing demand for high performance insulated substrates for power modules in consumer electronics sector to cater to the increasing demand for portable devices.
- Rising adoption of high performance insulated substrates by leading module manufacturers to improve their product quality and reliability.
- Proliferation of next generation technologies such as electric vehicles and solar energy that require high performance insulated substrates for power modules.
Scope Of The Report
Report Attributes
Report Details
Report Title
High Performance Insulated Substrates for Power Modules Market Research Report
By Type
AlN DBC Substrate, Al2O3 DBC Substrate
By Application
IGBT, High-Frequency Switching Power Supply, Automotive, Aerospace, Solar Cell Component, Power Supply for Telecommunication, Laser Systems
By Companies
Mitsubishi Materials, Tong Hsing Electronic Industries, Rogers, KCC, Ferrotec, Heraeus Electronics, Remtec, Stellar Industries Corp, Nanjing Zhongjiang, Zibo Linzi Yinhe, Mitsubishi Materials, IXYS Corporation
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
149
Number of Tables & Figures
105
Customization Available
Yes, the report can be customized as per your need.
Global High Performance Insulated Substrates for Power Modules Market Report Segments:
The global High Performance Insulated Substrates for Power Modules market is segmented on the basis of:
Types
AlN DBC Substrate, Al2O3 DBC Substrate
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
IGBT, High-Frequency Switching Power Supply, Automotive, Aerospace, Solar Cell Component, Power Supply for Telecommunication, Laser Systems
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Mitsubishi Materials
- Tong Hsing Electronic Industries
- Rogers
- KCC
- Ferrotec
- Heraeus Electronics
- Remtec
- Stellar Industries Corp
- Nanjing Zhongjiang
- Zibo Linzi Yinhe
- Mitsubishi Materials
- IXYS Corporation
Highlights of The High Performance Insulated Substrates for Power Modules Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- AlN DBC Substrate
- Al2O3 DBC Substrate
- By Application:
- IGBT
- High-Frequency Switching Power Supply
- Automotive
- Aerospace
- Solar Cell Component
- Power Supply for Telecommunication
- Laser Systems
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the High Performance Insulated Substrates for Power Modules Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
High performance insulated substrates for power modules are designed to provide superior thermal insulation and electrical performance. These substrates are typically used in applications that require high power density, low weight, and long life.
Some of the key players operating in the high performance insulated substrates for power modules market are Mitsubishi Materials, Tong Hsing Electronic Industries, Rogers, KCC, Ferrotec, Heraeus Electronics, Remtec, Stellar Industries Corp, Nanjing Zhongjiang, Zibo Linzi Yinhe, Mitsubishi Materials, IXYS Corporation.
The high performance insulated substrates for power modules market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 High Performance Insulated Substrates for Power Modules Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 High Performance Insulated Substrates for Power Modules Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 High Performance Insulated Substrates for Power Modules Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the High Performance Insulated Substrates for Power Modules Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global High Performance Insulated Substrates for Power Modules Market Size & Forecast, 2018-2028 4.5.1 High Performance Insulated Substrates for Power Modules Market Size and Y-o-Y Growth 4.5.2 High Performance Insulated Substrates for Power Modules Market Absolute $ Opportunity
Chapter 5 Global High Performance Insulated Substrates for Power Modules Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 High Performance Insulated Substrates for Power Modules Market Size Forecast by Type
5.2.1 AlN DBC Substrate
5.2.2 Al2O3 DBC Substrate
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global High Performance Insulated Substrates for Power Modules Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 High Performance Insulated Substrates for Power Modules Market Size Forecast by Applications
6.2.1 IGBT
6.2.2 High-Frequency Switching Power Supply
6.2.3 Automotive
6.2.4 Aerospace
6.2.5 Solar Cell Component
6.2.6 Power Supply for Telecommunication
6.2.7 Laser Systems
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global High Performance Insulated Substrates for Power Modules Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 High Performance Insulated Substrates for Power Modules Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America High Performance Insulated Substrates for Power Modules Analysis and Forecast
9.1 Introduction
9.2 North America High Performance Insulated Substrates for Power Modules Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America High Performance Insulated Substrates for Power Modules Market Size Forecast by Type
9.6.1 AlN DBC Substrate
9.6.2 Al2O3 DBC Substrate
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America High Performance Insulated Substrates for Power Modules Market Size Forecast by Applications
9.10.1 IGBT
9.10.2 High-Frequency Switching Power Supply
9.10.3 Automotive
9.10.4 Aerospace
9.10.5 Solar Cell Component
9.10.6 Power Supply for Telecommunication
9.10.7 Laser Systems
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe High Performance Insulated Substrates for Power Modules Analysis and Forecast
10.1 Introduction
10.2 Europe High Performance Insulated Substrates for Power Modules Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe High Performance Insulated Substrates for Power Modules Market Size Forecast by Type
10.6.1 AlN DBC Substrate
10.6.2 Al2O3 DBC Substrate
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe High Performance Insulated Substrates for Power Modules Market Size Forecast by Applications
10.10.1 IGBT
10.10.2 High-Frequency Switching Power Supply
10.10.3 Automotive
10.10.4 Aerospace
10.10.5 Solar Cell Component
10.10.6 Power Supply for Telecommunication
10.10.7 Laser Systems
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific High Performance Insulated Substrates for Power Modules Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific High Performance Insulated Substrates for Power Modules Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific High Performance Insulated Substrates for Power Modules Market Size Forecast by Type
11.6.1 AlN DBC Substrate
11.6.2 Al2O3 DBC Substrate
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific High Performance Insulated Substrates for Power Modules Market Size Forecast by Applications
11.10.1 IGBT
11.10.2 High-Frequency Switching Power Supply
11.10.3 Automotive
11.10.4 Aerospace
11.10.5 Solar Cell Component
11.10.6 Power Supply for Telecommunication
11.10.7 Laser Systems
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America High Performance Insulated Substrates for Power Modules Analysis and Forecast
12.1 Introduction
12.2 Latin America High Performance Insulated Substrates for Power Modules Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America High Performance Insulated Substrates for Power Modules Market Size Forecast by Type
12.6.1 AlN DBC Substrate
12.6.2 Al2O3 DBC Substrate
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America High Performance Insulated Substrates for Power Modules Market Size Forecast by Applications
12.10.1 IGBT
12.10.2 High-Frequency Switching Power Supply
12.10.3 Automotive
12.10.4 Aerospace
12.10.5 Solar Cell Component
12.10.6 Power Supply for Telecommunication
12.10.7 Laser Systems
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) High Performance Insulated Substrates for Power Modules Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) High Performance Insulated Substrates for Power Modules Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) High Performance Insulated Substrates for Power Modules Market Size Forecast by Type
13.6.1 AlN DBC Substrate
13.6.2 Al2O3 DBC Substrate
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) High Performance Insulated Substrates for Power Modules Market Size Forecast by Applications
13.10.1 IGBT
13.10.2 High-Frequency Switching Power Supply
13.10.3 Automotive
13.10.4 Aerospace
13.10.5 Solar Cell Component
13.10.6 Power Supply for Telecommunication
13.10.7 Laser Systems
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 High Performance Insulated Substrates for Power Modules Market: Competitive Dashboard
14.2 Global High Performance Insulated Substrates for Power Modules Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Mitsubishi Materials
14.3.2 Tong Hsing Electronic Industries
14.3.3 Rogers
14.3.4 KCC
14.3.5 Ferrotec
14.3.6 Heraeus Electronics
14.3.7 Remtec
14.3.8 Stellar Industries Corp
14.3.9 Nanjing Zhongjiang
14.3.10 Zibo Linzi Yinhe
14.3.11 Mitsubishi Materials
14.3.12 IXYS Corporation