Market Overview:
The global high rigid wafer grinder market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices and rising investments in the semiconductor industry. The type segment of the global high rigid wafer grinder market is divided into two segments, namely, wafer edge grinder and wafer surface grinder. The application segment of this market is also divided into two segments, namely, silicon wafers and compound semiconductors. Among these segments, silicon wafers are expected to account for a larger share of the global high rigid Wafer Grinder Market during the forecast period from 2018 to 2030.
Product Definition:
High Rigid Wafer Grinder is equipment that is used to smooth the surface of a semiconductor wafer. This is important because it helps to ensure that the chip that will be created on the wafer will be of high quality.
Wafer Edge Grinder:
Wafer edge grinder is a type of high-rigid wafer grinder used to grind semiconductor wafers in the production of integrated circuits (IC). The product consists of two main components, namely the base and the arm. The base has fixed or castors to support its weight and can be lowered or elevated by using a lever mechanism.
Wafer Surface Grinder:
Wafer surface grinder is used to grind the wafers in high rigid wafer grinder. The product consists of a number of grinding wheels mounted on a common axis and rotating at constant speed around it. A feed screw is provided at the center for feeding the workpiece, which can be processed simultaneously by all wheels present in the machine.
The product has applications where ultra-fine particle size is required such as aerospace parts manufacturing, semiconductor devices fabrication.
Application Insights:
The global market is segmented by application into silicon wafer, compound semiconductors and others. The compound semiconductor segment held the largest share in 2017 owing to the growing demand for high-performance and high-density devices. The growth of this application segment can be attributed to factors such as rapid industrialization, technological advancements in manufacturing processes and increasing spending on R&D activities within companies operating in this sector.
The silicon wafer segment is projected to grow at a lucrative rate over the forecast period due to its rising demand from various end-use industries including telecommunication, data storage & IT equipment manufacturers among others. Rapidly expanding end-use industries are expected to further fuel product demand over the forecast period with growth anticipated across all regions during the study period.
Regional Analysis:
Asia Pacific dominated the global high rigid wafer grinder market in 2017. The region is expected to witness significant growth over the forecast period owing to increasing demand for electronic products and rapid industrialization. China, India, Japan, South Korea are some of the major countries that are anticipated to drive regional growth during the forecast period.
North America accounted for a significant share in 2017 owing to growing technological advancements and increased adoption of advanced manufacturing techniques by companies operating in this region. Moreover, presence of key players such as Apogee Enterprises Inc.; CXC Wafers; Elcoman Srl; Kester Instruments BV is also estimated to propel regional growth over the next eight years or so.
Growth Factors:
- Increasing demand for semiconductor devices
- Growing number of electronics and electrical products
- Rising trend of miniaturization in electronic devices
- Proliferation of 3D printing technology
- Increasing adoption of High Rigid Wafer Grinder by small- and medium-sized enterprises
Scope Of The Report
Report Attributes
Report Details
Report Title
High Rigid Wafer Grinder Market Research Report
By Type
Wafer Edge Grinder, Wafer Surface Grinder
By Application
Silicon Wafer, Compound Semiconductors
By Companies
Strasbaugh, Disco, G&N Genauigkeits Maschinenbau Nürnberg GmbH, GigaMat, Arnold Gruppe, Hunan Yujing Machine Industrial, WAIDA MFG, SpeedFam, Koyo Machinery, ACCRETECH, Daitron, MAT Inc, Dikema Presicion Machinery, Dynavest, Komatsu NTC
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
129
Number of Tables & Figures
91
Customization Available
Yes, the report can be customized as per your need.
Global High Rigid Wafer Grinder Market Report Segments:
The global High Rigid Wafer Grinder market is segmented on the basis of:
Types
Wafer Edge Grinder, Wafer Surface Grinder
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Silicon Wafer, Compound Semiconductors
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Strasbaugh
- Disco
- G&N Genauigkeits Maschinenbau Nürnberg GmbH
- GigaMat
- Arnold Gruppe
- Hunan Yujing Machine Industrial
- WAIDA MFG
- SpeedFam
- Koyo Machinery
- ACCRETECH
- Daitron
- MAT Inc
- Dikema Presicion Machinery
- Dynavest
- Komatsu NTC
Highlights of The High Rigid Wafer Grinder Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Wafer Edge Grinder
- Wafer Surface Grinder
- By Application:
- Silicon Wafer
- Compound Semiconductors
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the High Rigid Wafer Grinder Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A high rigid wafer grinder is a type of industrial mill that uses a rotating cutting head to grind semiconductor wafers. The rigidity of the head and the precision of its movement result in very smooth surfaces on the finished product.
Some of the key players operating in the high rigid wafer grinder market are Strasbaugh, Disco, G&N Genauigkeits Maschinenbau N¼rnberg GmbH, GigaMat, Arnold Gruppe, Hunan Yujing Machine Industrial, WAIDA MFG, SpeedFam, Koyo Machinery, ACCRETECH, Daitron, MAT Inc, Dikema Presicion Machinery, Dynavest, Komatsu NTC.
The high rigid wafer grinder market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 High Rigid Wafer Grinder Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 High Rigid Wafer Grinder Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 High Rigid Wafer Grinder Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the High Rigid Wafer Grinder Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global High Rigid Wafer Grinder Market Size & Forecast, 2018-2028
4.5.1 High Rigid Wafer Grinder Market Size and Y-o-Y Growth
4.5.2 High Rigid Wafer Grinder Market Absolute $ Opportunity
Chapter 5 Global High Rigid Wafer Grinder Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 High Rigid Wafer Grinder Market Size Forecast by Type
5.2.1 Wafer Edge Grinder
5.2.2 Wafer Surface Grinder
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global High Rigid Wafer Grinder Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 High Rigid Wafer Grinder Market Size Forecast by Applications
6.2.1 Silicon Wafer
6.2.2 Compound Semiconductors
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global High Rigid Wafer Grinder Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 High Rigid Wafer Grinder Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America High Rigid Wafer Grinder Analysis and Forecast
9.1 Introduction
9.2 North America High Rigid Wafer Grinder Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America High Rigid Wafer Grinder Market Size Forecast by Type
9.6.1 Wafer Edge Grinder
9.6.2 Wafer Surface Grinder
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America High Rigid Wafer Grinder Market Size Forecast by Applications
9.10.1 Silicon Wafer
9.10.2 Compound Semiconductors
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe High Rigid Wafer Grinder Analysis and Forecast
10.1 Introduction
10.2 Europe High Rigid Wafer Grinder Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe High Rigid Wafer Grinder Market Size Forecast by Type
10.6.1 Wafer Edge Grinder
10.6.2 Wafer Surface Grinder
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe High Rigid Wafer Grinder Market Size Forecast by Applications
10.10.1 Silicon Wafer
10.10.2 Compound Semiconductors
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific High Rigid Wafer Grinder Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific High Rigid Wafer Grinder Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific High Rigid Wafer Grinder Market Size Forecast by Type
11.6.1 Wafer Edge Grinder
11.6.2 Wafer Surface Grinder
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific High Rigid Wafer Grinder Market Size Forecast by Applications
11.10.1 Silicon Wafer
11.10.2 Compound Semiconductors
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America High Rigid Wafer Grinder Analysis and Forecast
12.1 Introduction
12.2 Latin America High Rigid Wafer Grinder Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America High Rigid Wafer Grinder Market Size Forecast by Type
12.6.1 Wafer Edge Grinder
12.6.2 Wafer Surface Grinder
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America High Rigid Wafer Grinder Market Size Forecast by Applications
12.10.1 Silicon Wafer
12.10.2 Compound Semiconductors
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) High Rigid Wafer Grinder Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) High Rigid Wafer Grinder Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) High Rigid Wafer Grinder Market Size Forecast by Type
13.6.1 Wafer Edge Grinder
13.6.2 Wafer Surface Grinder
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) High Rigid Wafer Grinder Market Size Forecast by Applications
13.10.1 Silicon Wafer
13.10.2 Compound Semiconductors
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 High Rigid Wafer Grinder Market: Competitive Dashboard
14.2 Global High Rigid Wafer Grinder Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Strasbaugh
14.3.2 Disco
14.3.3 G&N Genauigkeits Maschinenbau Nürnberg GmbH
14.3.4 GigaMat
14.3.5 Arnold Gruppe
14.3.6 Hunan Yujing Machine Industrial
14.3.7 WAIDA MFG
14.3.8 SpeedFam
14.3.9 Koyo Machinery
14.3.10 ACCRETECH
14.3.11 Daitron
14.3.12 MAT Inc
14.3.13 Dikema Presicion Machinery
14.3.14 Dynavest
14.3.15 Komatsu NTC
