Market Overview:
The global high-speed interconnects market is expected to grow from USD 9.5 billion in 2018 to USD 17.8 billion by 2030, at a CAGR of 8.7% from 2018 to 2030. The growth of the market can be attributed to the increasing demand for data center and telecom applications, rising trend of miniaturization in consumer electronics, and growing adoption of cloud-based services. However, the high cost associated with active optical cables may restrain the growth of this market during the forecast period. Based on type, direct attach cables are expected to hold a larger share of the global high-speed interconnects market during the forecast period. This can be attributed to their low cost as compared with other types of high-speed interconnects and easy installation process.
Product Definition:
A high-speed interconnect is a type of electrical connector that can handle large amounts of data quickly. They are used in computers, telecommunications equipment, and other devices that require fast communication. High-speed interconnects are important because they allow devices to exchange data quickly and efficiently.
Direct Attach Cables:
Direct attach cables are used in high-speed interconnects to connect two devices, which are located on different printed circuit boards (PCB). They have a smaller form factor and can be installed in smaller spaces. The cable is attached to the device with a metal ferrule that screws into the PCB. It has an insulation layer, which is made of either silicone or fiberglass.
The direct attach cables market size was valued at USD 1,236 million in 2016.
Active Optical Cables:
Active optical cables are high-speed data transmission media that uses light as a carrier for information transfer. It is also known as active cable or optical fiber cable. They are used in high-speed interconnects to connect devices and components at the network level, i.e., between switching systems, routers, servers and storage devices etc., of a local area network (LAN), wide area network (WAN) or metropolitan area network (MAN) etc.
Application Insights:
The networking and computing segment dominated the global high-speed interconnects market in terms of revenue share in 2017. The growth can be attributed to the growing demand for HSI products from networking and computing applications such as data centers, telecom, and consumer electronics. Moreover, with the increasing adoption of cloud services across various industries such as BFSI, IT & telecommunication, government etc., there is a rising need for high-speed interconnection between cloud providers/service providers and their clients which is expected to drive industry growth over the forecast period.
Telecom was another prominent segment that accounted for significant market share in 2017 owing to an increase in demand from mobile operators globally coupled with a rise in investments made by telecom companies into next generation network infrastructure development projects. For instance; AT&T Inc.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing data center construction in countries such as China and India. In addition, rising demand for high-speed internet services is anticipated to drive HSI adoption across this region.
The European market held a significant share of global high-speed interconnects industry in terms of revenue in 2016 owing to early technology adoption by major telecom operators and computing device manufacturers such as Intel Corporation, Hewlett Packard Enterprise Development LP, Cisco Systems Inc., and Dell EMC. However, sluggish growth observed by networking equipment manufacturers may hinder future product demand over the next eight years from 2017 to 2030.
North America accounted for approximately 25% of total industry share in 2016 due its early technology adoption by key players operating within this region along with presence of numerous data centers housing some of the largest networks worldwide including Facebook Inc., Google LLC; Microsoft Corporation; Verizon Communications Inc.
Growth Factors:
- Increasing demand for high-speed data transmission in consumer electronics and telecommunications applications
- Proliferation of cloud-based services and big data analytics
- Growing number of connected devices and the Internet of Things (IoT)
- Development of 5G wireless technology
- Emergence of new applications such as virtual reality (VR) and augmented reality (AR)
Scope Of The Report
Report Attributes
Report Details
Report Title
High-speed Interconnects Market Research Report
By Type
Direct Attach Cables, Active Optical Cables
By Application
Data Centers, Telecom, Consumer Electronics, Networking and Computing
By Companies
Molex Incorporated, Nexans, Leoni, Samtec, CBO GmbH, Cisco Systems, Huawei Technologies, Intel,, The Siemon Company, Broadcom, FS.COM LIMITED, NVIDIA Corporation
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
190
Number of Tables & Figures
133
Customization Available
Yes, the report can be customized as per your need.
Global High-speed Interconnects Market Report Segments:
The global High-speed Interconnects market is segmented on the basis of:
Types
Direct Attach Cables, Active Optical Cables
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Data Centers, Telecom, Consumer Electronics, Networking and Computing
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Molex Incorporated
- Nexans
- Leoni
- Samtec
- CBO GmbH
- Cisco Systems
- Huawei Technologies
- Intel,
- The Siemon Company
- Broadcom
- FS.COM LIMITED
- NVIDIA Corporation
Highlights of The High-speed Interconnects Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Direct Attach Cables
- Active Optical Cables
- By Application:
- Data Centers
- Telecom
- Consumer Electronics
- Networking and Computing
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the High-speed Interconnects Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
High-speed interconnects are a type of network that allow devices to communicate with each other quickly. This can be helpful in situations where you need to access data quickly, for example when playing a video game or using the internet.
Some of the major companies in the high-speed interconnects market are Molex Incorporated, Nexans, Leoni, Samtec, CBO GmbH, Cisco Systems, Huawei Technologies, Intel,, The Siemon Company, Broadcom, FS.COM LIMITED, NVIDIA Corporation.
The high-speed interconnects market is expected to register a CAGR of 8.7%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 High-speed Interconnects Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 High-speed Interconnects Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 High-speed Interconnects Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the High-speed Interconnects Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global High-speed Interconnects Market Size & Forecast, 2018-2028
4.5.1 High-speed Interconnects Market Size and Y-o-Y Growth
4.5.2 High-speed Interconnects Market Absolute $ Opportunity
Chapter 5 Global High-speed Interconnects Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 High-speed Interconnects Market Size Forecast by Type
5.2.1 Direct Attach Cables
5.2.2 Active Optical Cables
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global High-speed Interconnects Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 High-speed Interconnects Market Size Forecast by Applications
6.2.1 Data Centers
6.2.2 Telecom
6.2.3 Consumer Electronics
6.2.4 Networking and Computing
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global High-speed Interconnects Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 High-speed Interconnects Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America High-speed Interconnects Analysis and Forecast
9.1 Introduction
9.2 North America High-speed Interconnects Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America High-speed Interconnects Market Size Forecast by Type
9.6.1 Direct Attach Cables
9.6.2 Active Optical Cables
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America High-speed Interconnects Market Size Forecast by Applications
9.10.1 Data Centers
9.10.2 Telecom
9.10.3 Consumer Electronics
9.10.4 Networking and Computing
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe High-speed Interconnects Analysis and Forecast
10.1 Introduction
10.2 Europe High-speed Interconnects Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe High-speed Interconnects Market Size Forecast by Type
10.6.1 Direct Attach Cables
10.6.2 Active Optical Cables
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe High-speed Interconnects Market Size Forecast by Applications
10.10.1 Data Centers
10.10.2 Telecom
10.10.3 Consumer Electronics
10.10.4 Networking and Computing
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific High-speed Interconnects Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific High-speed Interconnects Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific High-speed Interconnects Market Size Forecast by Type
11.6.1 Direct Attach Cables
11.6.2 Active Optical Cables
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific High-speed Interconnects Market Size Forecast by Applications
11.10.1 Data Centers
11.10.2 Telecom
11.10.3 Consumer Electronics
11.10.4 Networking and Computing
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America High-speed Interconnects Analysis and Forecast
12.1 Introduction
12.2 Latin America High-speed Interconnects Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America High-speed Interconnects Market Size Forecast by Type
12.6.1 Direct Attach Cables
12.6.2 Active Optical Cables
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America High-speed Interconnects Market Size Forecast by Applications
12.10.1 Data Centers
12.10.2 Telecom
12.10.3 Consumer Electronics
12.10.4 Networking and Computing
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) High-speed Interconnects Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) High-speed Interconnects Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) High-speed Interconnects Market Size Forecast by Type
13.6.1 Direct Attach Cables
13.6.2 Active Optical Cables
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) High-speed Interconnects Market Size Forecast by Applications
13.10.1 Data Centers
13.10.2 Telecom
13.10.3 Consumer Electronics
13.10.4 Networking and Computing
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 High-speed Interconnects Market: Competitive Dashboard
14.2 Global High-speed Interconnects Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Molex Incorporated
14.3.2 Nexans
14.3.3 Leoni
14.3.4 Samtec
14.3.5 CBO GmbH
14.3.6 Cisco Systems
14.3.7 Huawei Technologies
14.3.8 Intel,
14.3.9 The Siemon Company
14.3.10 Broadcom
14.3.11 FS.COM LIMITED
14.3.12 NVIDIA Corporation
