Market Overview:
The global high-speed interconnects products market is expected to grow at a CAGR of 9.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for data and rising need for faster data transmission across different applications such as telecom and datacom. Active optical cables (AOC) are expected to witness the highest growth during the forecast period, owing to their advantages such as low power consumption, high bandwidth capacity, and small form factor. North America is expected to hold the largest share of the global high-speed interconnects products market in 2018, followed by Europe and Asia Pacific.
Product Definition:
A high-speed interconnect is a type of electronic connector that can transmit data at very high speeds. They are used in computers and other devices to connect internal components, such as the central processing unit (CPU) and memory, with each other or with an external device, such as a display or storage drive.
Active Optical Cable (AOC):
Active optical cable (AOC) is a high-speed data transmission medium that uses light as a carrier wave. It's major advantage over electrical cables is the ability to carry both digital and analog signals simultaneously. AOC offers benefits such as increased bandwidth, reduced cost, simplified cabling management and installation, enhanced reliability & serviceability along with easy upgradation facilities at minimal costs which are expected to drive market growth over the forecast period.
Direct Attach Cables (DAC):
Direct attach cables are used in high-speed interconnects products to connect the devices together. They have a smaller form factor and can be easily plugged into any port on the back of a computer chassis. The small form factor allows them to fit easily into confined places such as an optical drive bay or an expansion slot on a computer case, where larger I/O cable would not fit.
Application Insights:
The telecom application segment accounted for the largest revenue share in 2016 and is projected to continue its dominance over the forecast period. The segment growth can be attributed to increasing demand for high-speed data transfer services across the globe. Telecom service providers are investing heavily in order to provide enhanced mobile broadband experience to their customers.
The datacom segment is expected register a significant CAGR of XX% from 2017 to 2030 owingto growing demand from data centers and internet service providers (ISPs)for providing low latency connectivity solutions. Increasing cloud computing activities have created a huge database requiring heavy bandwidth, which has resulted in increased penetration of HSI products across data centers worldwide. Moreover, rising adoption of optical technologies among ISPs for providing faster internet access will boost product demand further.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for high bandwidth in data centers and telecom applications. Europe is also estimated to witness considerable growth over the coming years owing to increased adoption of active optical cables in long haul and metro networks applications. North America region accounted for a significant share of global revenue, on account of presence of major players such as Corning Incorporated; Furukawa Electric Co., Ltd.; Fujikura Limited; Legrand SA; Nexans (Soci©t© Anonyme); Prysmian Group S.p.A.; Schneider Electric SE; and TE Connectivity Ltd.
The U.S dominated this regional segment owing to presence of key industry participants such as Corning Incorporated, Furukawa Electric Co.,Ltd.
Growth Factors:
- Increasing demand for high-speed data transmission in consumer electronics and telecommunications applications
- Proliferation of cloud-based services and big data analytics
- Growing number of connected devices (the Internet of Things)
- Rapid expansion of 5G networks
- Emergence of new technologies such as artificial intelligence, virtual reality, and augmented reality
Scope Of The Report
Report Attributes
Report Details
Report Title
High-speed Interconnects Products Market Research Report
By Type
Active Optical Cable (AOC), Direct Attach Cables (DAC)
By Application
Telecom, Datacom
By Companies
II-VI Incorporated, Broadcom, Sumitomo Electric Industries, Ltd., Molex Incorporated, Samtec, Shenzhen Gigalight Technology Co., Ltd., The Siemon Company, Accelink, Huawei, Leoni AG, Amphenol, CBO GmbH, Mellanox, Foxconn Interconnect Technology, FS, Intel, Juniper Networks, Nexans, Cisco, 3c-Link, Centera Photonics Inc., 10Gtek Transceivers Co., Ltd
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
219
Number of Tables & Figures
154
Customization Available
Yes, the report can be customized as per your need.
Global High-speed Interconnects Products Market Report Segments:
The global High-speed Interconnects Products market is segmented on the basis of:
Types
Active Optical Cable (AOC), Direct Attach Cables (DAC)
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Telecom, Datacom
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- II-VI Incorporated
- Broadcom
- Sumitomo Electric Industries, Ltd.
- Molex Incorporated
- Samtec
- Shenzhen Gigalight Technology Co., Ltd.
- The Siemon Company
- Accelink
- Huawei
- Leoni AG
- Amphenol
- CBO GmbH
- Mellanox
- Foxconn Interconnect Technology
- FS
- Intel
- Juniper Networks
- Nexans
- Cisco
- 3c-Link
- Centera Photonics Inc.
- 10Gtek Transceivers Co., Ltd
Highlights of The High-speed Interconnects Products Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Active Optical Cable (AOC)
- Direct Attach Cables (DAC)
- By Application:
- Telecom
- Datacom
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the High-speed Interconnects Products Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
High-speed interconnects products are a type of electronic component that allow devices to communicate with each other quickly. They are used in a variety of applications, including computer systems, telecommunications networks, and industrial equipment.
Some of the key players operating in the high-speed interconnects products market are II-VI Incorporated, Broadcom, Sumitomo Electric Industries, Ltd., Molex Incorporated, Samtec, Shenzhen Gigalight Technology Co., Ltd., The Siemon Company, Accelink, Huawei, Leoni AG, Amphenol, CBO GmbH, Mellanox, Foxconn Interconnect Technology, FS, Intel, Juniper Networks, Nexans, Cisco, 3c-Link, Centera Photonics Inc., 10Gtek Transceivers Co., Ltd.
The high-speed interconnects products market is expected to grow at a compound annual growth rate of 9.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 High-speed Interconnects Products Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 High-speed Interconnects Products Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 High-speed Interconnects Products Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the High-speed Interconnects Products Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global High-speed Interconnects Products Market Size & Forecast, 2018-2028
4.5.1 High-speed Interconnects Products Market Size and Y-o-Y Growth
4.5.2 High-speed Interconnects Products Market Absolute $ Opportunity
Chapter 5 Global High-speed Interconnects Products Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 High-speed Interconnects Products Market Size Forecast by Type
5.2.1 Active Optical Cable (AOC)
5.2.2 Direct Attach Cables (DAC)
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global High-speed Interconnects Products Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 High-speed Interconnects Products Market Size Forecast by Applications
6.2.1 Telecom
6.2.2 Datacom
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global High-speed Interconnects Products Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 High-speed Interconnects Products Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America High-speed Interconnects Products Analysis and Forecast
9.1 Introduction
9.2 North America High-speed Interconnects Products Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America High-speed Interconnects Products Market Size Forecast by Type
9.6.1 Active Optical Cable (AOC)
9.6.2 Direct Attach Cables (DAC)
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America High-speed Interconnects Products Market Size Forecast by Applications
9.10.1 Telecom
9.10.2 Datacom
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe High-speed Interconnects Products Analysis and Forecast
10.1 Introduction
10.2 Europe High-speed Interconnects Products Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe High-speed Interconnects Products Market Size Forecast by Type
10.6.1 Active Optical Cable (AOC)
10.6.2 Direct Attach Cables (DAC)
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe High-speed Interconnects Products Market Size Forecast by Applications
10.10.1 Telecom
10.10.2 Datacom
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific High-speed Interconnects Products Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific High-speed Interconnects Products Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific High-speed Interconnects Products Market Size Forecast by Type
11.6.1 Active Optical Cable (AOC)
11.6.2 Direct Attach Cables (DAC)
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific High-speed Interconnects Products Market Size Forecast by Applications
11.10.1 Telecom
11.10.2 Datacom
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America High-speed Interconnects Products Analysis and Forecast
12.1 Introduction
12.2 Latin America High-speed Interconnects Products Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America High-speed Interconnects Products Market Size Forecast by Type
12.6.1 Active Optical Cable (AOC)
12.6.2 Direct Attach Cables (DAC)
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America High-speed Interconnects Products Market Size Forecast by Applications
12.10.1 Telecom
12.10.2 Datacom
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) High-speed Interconnects Products Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) High-speed Interconnects Products Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) High-speed Interconnects Products Market Size Forecast by Type
13.6.1 Active Optical Cable (AOC)
13.6.2 Direct Attach Cables (DAC)
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) High-speed Interconnects Products Market Size Forecast by Applications
13.10.1 Telecom
13.10.2 Datacom
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 High-speed Interconnects Products Market: Competitive Dashboard
14.2 Global High-speed Interconnects Products Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 II-VI Incorporated
14.3.2 Broadcom
14.3.3 Sumitomo Electric Industries, Ltd.
14.3.4 Molex Incorporated
14.3.5 Samtec
14.3.6 Shenzhen Gigalight Technology Co., Ltd.
14.3.7 The Siemon Company
14.3.8 Accelink
14.3.9 Huawei
14.3.10 Leoni AG
14.3.11 Amphenol
14.3.12 CBO GmbH
14.3.13 Mellanox
14.3.14 Foxconn Interconnect Technology
14.3.15 FS
14.3.16 Intel
14.3.17 Juniper Networks
14.3.18 Nexans
14.3.19 Cisco
14.3.20 3c-Link
14.3.21 Centera Photonics Inc.
14.3.22 10Gtek Transceivers Co., Ltd
