Market Overview:
The global high thermal conductivity ceramic insulated substrate market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for high thermal conductivity ceramic insulated substrates from various applications, such as IGBT modules, chip resistors, wireless modules, and LED. In addition, the growing demand for miniaturization of electronic devices is also contributing to the growth of this market. On the basis of type, alumina (Al2O3) held a major share of the global high thermal conductivity ceramic insulated substrate market in 2017 and is expected to continue its dominance during the forecast period. This can be attributed to its superior properties such as good electrical insulation and low dielectric constant.
Product Definition:
A high thermal conductivity ceramic insulated substrate is a type of substrate that has been designed to have a very high thermal conductivity. This type of substrate is often used in applications where there is a need to transfer heat quickly and efficiently. Some common uses for high thermal conductivity ceramic insulated substrates include semiconductor packaging, LED cooling, and power amplifier cooling.
Alumina (Al2O3):
Alumina is a mineral, belonging to the family of minerals called aluminates. It has high thermal conductivity and is used in making heat insulators or heat spreaders for electronic products such as computer hard drives. The growth factor leading to increased demand for alumina based HTS materials are its properties such as lightweight, low cost & easy availability along with high thermal conductivity.
Aluminum Nitride (AlN):
Aluminum nitride (AlN) is a ceramic material with excellent thermal properties. It has the ability to conduct heat at high speed and low power, making it an ideal material for use in high-temperature insulation applications. Aluminum nitride has been used as an insulating material in various industries including chemical, electrical, and medical. The growing demand for energy efficiency across these sectors is expected to drive the global market over the forecast period.
Application Insights:
The global demand for IGBT module is anticipated to witness a CAGR of XX% from 2018 to 2030 owing to the growing demand for power distribution and control devices in various industries such as data centers, commercial buildings, and transportation. The growth of the aforementioned end-use segments is expected to boost product consumption in IGBT module applications over the forecast period.
Furthermore, increasing use of ceramic substrates in chip resistors due to their high thermal conductivity properties will drive market growth over the forecast period. Ceramic insulated substrate equipped with a metal layer acts as an effective heat spreader which improves overall performance while reducing its size compared with traditional PCBs used for heat dissipation. This factor along with others will help promote industry expansion at a steady rate during the study period.
Other key application areas include wireless modules and LED drivers ICs that are utilized in numerous electronic products such as smartphones.
Regional Analysis:
Europe dominated the global high thermal conductivity ceramic insulated substrate market in 2016 owing to the presence of major manufacturers such as Altran, Infineon, and Siemens. The region is expected to witness moderate growth over the forecast period. Increasing demand for energy-efficient products coupled with growing renewable energy production is expected to drive regional growth.
Asia Pacific accounted for a revenue share of 23% in 2016 owing to increasing product adoption in industrial applications including aerospace & defense, automotive and transportation infrastructure along with consumer electronics manufacturing facilities located in China and Japan.
China has been experiencing strong economic growth since 2015 on account of rapid urbanization resulting into increased construction activities which includes commercial buildings, offices, hospitals etc.
Growth Factors:
- Increasing demand for miniaturization in electronic devices: The growth of the high thermal conductivity ceramic insulated substrate market can be attributed to the increasing demand for miniaturization in electronic devices. Miniaturization helps reduce the size and weight of electronic devices, making them more portable.
- Rising demand for energy-efficient electronics: With the growing concern about climate change and rising energy costs, there is an increasing demand for energy-efficient electronics products. High thermal conductivity ceramic insulated substrates help improve the efficiency of electronic devices by dissipating heat quickly and preventing it from building up inside the device.
- Growing popularity of wearable technology: The global market for wearable technology is expected to grow at a CAGR of over 30% during 2016-2021 [1]. This growth can be attributed to factors such as increasing consumer preference for stylish and functional gadgets, declining prices of components used in wearable technology, and technological advancements that are making these gadgets more powerful and efficient [2]. High thermal conductivity ceramic insulated substrates are ideal materials for use in wearable technology due to their ability to dissipate heat quickly without adding weight or bulkiness to the device.
- Proliferation of 4G LTE networks: 4G LTE networks offer faster data speeds than traditional 3G networks, which is driving their adoption worldwide [3]. This increased network speed is resulting in a surge in data traffic, which is placing greater demands on telecom infrastructure providers [4]. To
Scope Of The Report
Report Attributes
Report Details
Report Title
High Thermal Conductivity Ceramic Insulated Substrate Market Research Report
By Type
Alumina (Al2O3), Aluminum Nitride (AlN), Beryllium Oxide (BeO), Silicon nitride (Si3N4)
By Application
IGBT Module, Chip Resistor, Wireless Module, LED
By Companies
Precision Ceramics Limited, Toshiba Materials Co Ltd, Maruwa, Tong Hsing, Murata, Kyocera, Leatec Fine Ceramics, Nikko, CoorsTek, KOA, NCI, Asahi Glass Co, TA-I Technology, Yokowo, Rogers/Curamik, Ecocera
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
200
Number of Tables & Figures
140
Customization Available
Yes, the report can be customized as per your need.
Global High Thermal Conductivity Ceramic Insulated Substrate Market Report Segments:
The global High Thermal Conductivity Ceramic Insulated Substrate market is segmented on the basis of:
Types
Alumina (Al2O3), Aluminum Nitride (AlN), Beryllium Oxide (BeO), Silicon nitride (Si3N4)
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
IGBT Module, Chip Resistor, Wireless Module, LED
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Precision Ceramics Limited
- Toshiba Materials Co Ltd
- Maruwa
- Tong Hsing
- Murata
- Kyocera
- Leatec Fine Ceramics
- Nikko
- CoorsTek
- KOA
- NCI
- Asahi Glass Co
- TA-I Technology
- Yokowo
- Rogers/Curamik
- Ecocera
Highlights of The High Thermal Conductivity Ceramic Insulated Substrate Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Alumina (Al2O3)
- Aluminum Nitride (AlN)
- Beryllium Oxide (BeO)
- Silicon nitride (Si3N4)
- By Application:
- IGBT Module
- Chip Resistor
- Wireless Module
- LED
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the High Thermal Conductivity Ceramic Insulated Substrate Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
High thermal conductivity ceramic insulated substrate is a type of insulation material that has high thermal conductivity. This means that it can transfer heat quickly from one area to another, which is important for materials that are used in hot environments.
Some of the major players in the high thermal conductivity ceramic insulated substrate market are Precision Ceramics Limited, Toshiba Materials Co Ltd, Maruwa, Tong Hsing, Murata, Kyocera, Leatec Fine Ceramics, Nikko, CoorsTek, KOA, NCI, Asahi Glass Co, TA-I Technology, Yokowo, Rogers/Curamik, Ecocera.
The high thermal conductivity ceramic insulated substrate market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 High Thermal Conductivity Ceramic Insulated Substrate Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 High Thermal Conductivity Ceramic Insulated Substrate Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 High Thermal Conductivity Ceramic Insulated Substrate Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the High Thermal Conductivity Ceramic Insulated Substrate Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global High Thermal Conductivity Ceramic Insulated Substrate Market Size & Forecast, 2018-2028
4.5.1 High Thermal Conductivity Ceramic Insulated Substrate Market Size and Y-o-Y Growth
4.5.2 High Thermal Conductivity Ceramic Insulated Substrate Market Absolute $ Opportunity
Chapter 5 Global High Thermal Conductivity Ceramic Insulated Substrate Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Type
5.2.1 Alumina (Al2O3)
5.2.2 Aluminum Nitride (AlN)
5.2.3 Beryllium Oxide (BeO)
5.2.4 Silicon nitride (Si3N4)
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global High Thermal Conductivity Ceramic Insulated Substrate Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Applications
6.2.1 IGBT Module
6.2.2 Chip Resistor
6.2.3 Wireless Module
6.2.4 LED
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global High Thermal Conductivity Ceramic Insulated Substrate Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America High Thermal Conductivity Ceramic Insulated Substrate Analysis and Forecast
9.1 Introduction
9.2 North America High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Type
9.6.1 Alumina (Al2O3)
9.6.2 Aluminum Nitride (AlN)
9.6.3 Beryllium Oxide (BeO)
9.6.4 Silicon nitride (Si3N4)
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Applications
9.10.1 IGBT Module
9.10.2 Chip Resistor
9.10.3 Wireless Module
9.10.4 LED
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe High Thermal Conductivity Ceramic Insulated Substrate Analysis and Forecast
10.1 Introduction
10.2 Europe High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Type
10.6.1 Alumina (Al2O3)
10.6.2 Aluminum Nitride (AlN)
10.6.3 Beryllium Oxide (BeO)
10.6.4 Silicon nitride (Si3N4)
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Applications
10.10.1 IGBT Module
10.10.2 Chip Resistor
10.10.3 Wireless Module
10.10.4 LED
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific High Thermal Conductivity Ceramic Insulated Substrate Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Type
11.6.1 Alumina (Al2O3)
11.6.2 Aluminum Nitride (AlN)
11.6.3 Beryllium Oxide (BeO)
11.6.4 Silicon nitride (Si3N4)
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Applications
11.10.1 IGBT Module
11.10.2 Chip Resistor
11.10.3 Wireless Module
11.10.4 LED
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America High Thermal Conductivity Ceramic Insulated Substrate Analysis and Forecast
12.1 Introduction
12.2 Latin America High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Type
12.6.1 Alumina (Al2O3)
12.6.2 Aluminum Nitride (AlN)
12.6.3 Beryllium Oxide (BeO)
12.6.4 Silicon nitride (Si3N4)
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Applications
12.10.1 IGBT Module
12.10.2 Chip Resistor
12.10.3 Wireless Module
12.10.4 LED
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) High Thermal Conductivity Ceramic Insulated Substrate Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Type
13.6.1 Alumina (Al2O3)
13.6.2 Aluminum Nitride (AlN)
13.6.3 Beryllium Oxide (BeO)
13.6.4 Silicon nitride (Si3N4)
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) High Thermal Conductivity Ceramic Insulated Substrate Market Size Forecast by Applications
13.10.1 IGBT Module
13.10.2 Chip Resistor
13.10.3 Wireless Module
13.10.4 LED
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 High Thermal Conductivity Ceramic Insulated Substrate Market: Competitive Dashboard
14.2 Global High Thermal Conductivity Ceramic Insulated Substrate Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Precision Ceramics Limited
14.3.2 Toshiba Materials Co Ltd
14.3.3 Maruwa
14.3.4 Tong Hsing
14.3.5 Murata
14.3.6 Kyocera
14.3.7 Leatec Fine Ceramics
14.3.8 Nikko
14.3.9 CoorsTek
14.3.10 KOA
14.3.11 NCI
14.3.12 Asahi Glass Co
14.3.13 TA-I Technology
14.3.14 Yokowo
14.3.15 Rogers/Curamik
14.3.16 Ecocera
