Market Overview:
The global hub dicing blade market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in the market can be attributed to the increasing demand for semiconductor devices and photoelectricity products. Hub dicing blades are used for cutting wafers into small pieces with a high degree of accuracy and precision. They are available in different types such as electroformed hub dicing blade, metal hub dicing blade, resin hub dicing blade, nickel matrices hub dicing blade, and others. These blades are also classified by their applications into semiconductor, ceramics, and others. Region-wise, the global Hub Dicing Blade Market is segmented into North America, Latin America, Europe Asia Pacific (APAC), and Middle East & Africa (MEA).
Product Definition:
Hub dicing blade is an important tool for slicing semiconductor wafers. The blade is mounted on a hub that allows the blade to rotate. This allows the operator to slice the wafer evenly and with precision.
Electroformed Hub Dicing Blade:
The electroformed hub dicing blade is a special type of tool that is used in the plastic industry. It consists of an alloy steel core enclosed by a thin sheet metal shell. The shell has two holes through which electric current can pass, and it shapes the plastic material into chips as per requirement.
This product finds its application in various end-use industries such as automotive, medical devices, consumer goods packaging among others where high precision and low cost are mandatory for success.
Metal Hub Dicing Blade:
Metal hub dicing blade is used in the manufacturing process of semiconductors, electronic components and printed circuit boards. Metal hub dicing blade consists of two metal discs which are rotating at high speed. One of the metal disc has many small holes in it through which a liquid can pass and cut the other metal disc into pieces. The smaller discs fall down to form separate parts while the larger piece remains as a whole semiconductor or component.
Application Insights:
The photoelectricity application segment accounted for the largest market share in 2017 and is projected to expand at a CAGR of XX% over the forecast period. The growth can be attributed to rising demand for hub dicing blades from various end-use industries including semiconductors, optoelectronics, and solar cells among others.
The semiconductor industry is one of the leading users of hub dicing blades as they offer high performance at low costs which eventually benefits both manufacturers and consumers. In addition, technological advancements such as 3D printing are likely to drive down component costs further which will have a positive impact on industry growth in future years.
In terms of revenue, ceramics emerged as one of the prominent segments with a share estimated at 16% in 2017 owing to its growing use across numerous applications including pharmaceuticals.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The region’s growth can be attributed to rapid industrialization, availability of low-cost labor, raw material, and capital investments. China is considered as a key country for hub dicing blade manufacturers owing to easy availability of raw materials and labor at economical costs along with high demand from various end-use industries such as electronics & telecom, automotive & transportation equipment manufacturing.
The Asia Pacific hub dicing blade market was valued at USD X million in 2017 owing to presence of numerous electronic product manufacturers across countries such as India, Japan, South Korea among others which are also involved in strategic initiatives for domestic production capabilities supported by favorable government policies aimed at promoting domestic manufacturing activities within their respective countries thus driving regional growth over the forecast period.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand for advanced semiconductor devices
- Growing popularity of Hub Dicing Blade in the medical device industry
- Proliferation of 3D printing technology
- Technological advancements in the field of Hub Dicing Blade
Scope Of The Report
Report Attributes
Report Details
Report Title
Hub Dicing Blade Market Research Report
By Type
Electroformed Hub Dicing Blade, Metal Hub Dicing Blade, Resin Hub Dicing Blade, Nickel Matrices Hub Dicing Blade, Others
By Application
Photoelectricity, Semiconductor, Ceramics, Others
By Companies
DIsco, Kulicke and Soffa, Advanced Dicing Technologies (ADT), ACCRETECH, Asahi Diamond Industrial, Ceiba Technologies, UKAM, More Superhard Products, Zhengzhou Hongtuo Precision Tools, HENAN E-GRIND Abrasives
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
174
Number of Tables & Figures
122
Customization Available
Yes, the report can be customized as per your need.
Global Hub Dicing Blade Market Report Segments:
The global Hub Dicing Blade market is segmented on the basis of:
Types
Electroformed Hub Dicing Blade, Metal Hub Dicing Blade, Resin Hub Dicing Blade, Nickel Matrices Hub Dicing Blade, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Photoelectricity, Semiconductor, Ceramics, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- DIsco
- Kulicke and Soffa
- Advanced Dicing Technologies (ADT)
- ACCRETECH
- Asahi Diamond Industrial
- Ceiba Technologies
- UKAM
- More Superhard Products
- Zhengzhou Hongtuo Precision Tools
- HENAN E-GRIND Abrasives
Highlights of The Hub Dicing Blade Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Electroformed Hub Dicing Blade
- Metal Hub Dicing Blade
- Resin Hub Dicing Blade
- Nickel Matrices Hub Dicing Blade
- Others
- By Application:
- Photoelectricity
- Semiconductor
- Ceramics
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Hub Dicing Blade Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Hub Dicing Blade is a type of blade used in the production of Hubs. It is a sharp, pointed tool that is inserted into the hub to create evenly spaced cuts.
Some of the major companies in the hub dicing blade market are DIsco, Kulicke and Soffa, Advanced Dicing Technologies (ADT), ACCRETECH, Asahi Diamond Industrial, Ceiba Technologies, UKAM, More Superhard Products, Zhengzhou Hongtuo Precision Tools, HENAN E-GRIND Abrasives.
The hub dicing blade market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Hub Dicing Blade Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Hub Dicing Blade Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Hub Dicing Blade Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Hub Dicing Blade Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Hub Dicing Blade Market Size & Forecast, 2020-2028 4.5.1 Hub Dicing Blade Market Size and Y-o-Y Growth 4.5.2 Hub Dicing Blade Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Electroformed Hub Dicing Blade
5.2.2 Metal Hub Dicing Blade
5.2.3 Resin Hub Dicing Blade
5.2.4 Nickel Matrices Hub Dicing Blade
5.2.5 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Photoelectricity
6.2.2 Semiconductor
6.2.3 Ceramics
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Hub Dicing Blade Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Hub Dicing Blade Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Electroformed Hub Dicing Blade
9.6.2 Metal Hub Dicing Blade
9.6.3 Resin Hub Dicing Blade
9.6.4 Nickel Matrices Hub Dicing Blade
9.6.5 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Photoelectricity
9.10.2 Semiconductor
9.10.3 Ceramics
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Electroformed Hub Dicing Blade
10.6.2 Metal Hub Dicing Blade
10.6.3 Resin Hub Dicing Blade
10.6.4 Nickel Matrices Hub Dicing Blade
10.6.5 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Photoelectricity
10.10.2 Semiconductor
10.10.3 Ceramics
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Electroformed Hub Dicing Blade
11.6.2 Metal Hub Dicing Blade
11.6.3 Resin Hub Dicing Blade
11.6.4 Nickel Matrices Hub Dicing Blade
11.6.5 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Photoelectricity
11.10.2 Semiconductor
11.10.3 Ceramics
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Electroformed Hub Dicing Blade
12.6.2 Metal Hub Dicing Blade
12.6.3 Resin Hub Dicing Blade
12.6.4 Nickel Matrices Hub Dicing Blade
12.6.5 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Photoelectricity
12.10.2 Semiconductor
12.10.3 Ceramics
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Electroformed Hub Dicing Blade
13.6.2 Metal Hub Dicing Blade
13.6.3 Resin Hub Dicing Blade
13.6.4 Nickel Matrices Hub Dicing Blade
13.6.5 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Photoelectricity
13.10.2 Semiconductor
13.10.3 Ceramics
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Hub Dicing Blade Market: Competitive Dashboard
14.2 Global Hub Dicing Blade Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 DIsco
14.3.2 Kulicke and Soffa
14.3.3 Advanced Dicing Technologies (ADT)
14.3.4 ACCRETECH
14.3.5 Asahi Diamond Industrial
14.3.6 Ceiba Technologies
14.3.7 UKAM
14.3.8 More Superhard Products
14.3.9 Zhengzhou Hongtuo Precision Tools
14.3.10 HENAN E-GRIND Abrasives