Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Hub Dicing Blade Market by Type (Electroformed Hub Dicing Blade, Metal Hub Dicing Blade, Resin Hub Dicing Blade, Nickel Matrices Hub Dicing Blade, Others), By Application (Photoelectricity, Semiconductor, Ceramics, Others) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Hub Dicing Blade Market by Type (Electroformed Hub Dicing Blade, Metal Hub Dicing Blade, Resin Hub Dicing Blade, Nickel Matrices Hub Dicing Blade, Others), By Application (Photoelectricity, Semiconductor, Ceramics, Others) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 307078 4200 Electronics & Semiconductor 377 174 Pages 4.8 (33)
                                          

Market Overview:


The global hub dicing blade market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in the market can be attributed to the increasing demand for semiconductor devices and photoelectricity products. Hub dicing blades are used for cutting wafers into small pieces with a high degree of accuracy and precision. They are available in different types such as electroformed hub dicing blade, metal hub dicing blade, resin hub dicing blade, nickel matrices hub dicing blade, and others. These blades are also classified by their applications into semiconductor, ceramics, and others. Region-wise, the global Hub Dicing Blade Market is segmented into North America, Latin America, Europe Asia Pacific (APAC), and Middle East & Africa (MEA).


Global Hub Dicing Blade Industry Outlook


Product Definition:


Hub dicing blade is an important tool for slicing semiconductor wafers. The blade is mounted on a hub that allows the blade to rotate. This allows the operator to slice the wafer evenly and with precision.


Electroformed Hub Dicing Blade:


The electroformed hub dicing blade is a special type of tool that is used in the plastic industry. It consists of an alloy steel core enclosed by a thin sheet metal shell. The shell has two holes through which electric current can pass, and it shapes the plastic material into chips as per requirement.


This product finds its application in various end-use industries such as automotive, medical devices, consumer goods packaging among others where high precision and low cost are mandatory for success.


Metal Hub Dicing Blade:


Metal hub dicing blade is used in the manufacturing process of semiconductors, electronic components and printed circuit boards. Metal hub dicing blade consists of two metal discs which are rotating at high speed. One of the metal disc has many small holes in it through which a liquid can pass and cut the other metal disc into pieces. The smaller discs fall down to form separate parts while the larger piece remains as a whole semiconductor or component.


Application Insights:


The photoelectricity application segment accounted for the largest market share in 2017 and is projected to expand at a CAGR of XX% over the forecast period. The growth can be attributed to rising demand for hub dicing blades from various end-use industries including semiconductors, optoelectronics, and solar cells among others.


The semiconductor industry is one of the leading users of hub dicing blades as they offer high performance at low costs which eventually benefits both manufacturers and consumers. In addition, technological advancements such as 3D printing are likely to drive down component costs further which will have a positive impact on industry growth in future years.


In terms of revenue, ceramics emerged as one of the prominent segments with a share estimated at 16% in 2017 owing to its growing use across numerous applications including pharmaceuticals.


Regional Analysis:


Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The region’s growth can be attributed to rapid industrialization, availability of low-cost labor, raw material, and capital investments. China is considered as a key country for hub dicing blade manufacturers owing to easy availability of raw materials and labor at economical costs along with high demand from various end-use industries such as electronics & telecom, automotive & transportation equipment manufacturing.


The Asia Pacific hub dicing blade market was valued at USD X million in 2017 owing to presence of numerous electronic product manufacturers across countries such as India, Japan, South Korea among others which are also involved in strategic initiatives for domestic production capabilities supported by favorable government policies aimed at promoting domestic manufacturing activities within their respective countries thus driving regional growth over the forecast period.


Growth Factors:


  • Increasing demand for miniaturization in electronic devices
  • Rising demand for advanced semiconductor devices
  • Growing popularity of Hub Dicing Blade in the medical device industry
  • Proliferation of 3D printing technology
  • Technological advancements in the field of Hub Dicing Blade

Scope Of The Report

Report Attributes

Report Details

Report Title

Hub Dicing Blade Market Research Report

By Type

Electroformed Hub Dicing Blade, Metal Hub Dicing Blade, Resin Hub Dicing Blade, Nickel Matrices Hub Dicing Blade, Others

By Application

Photoelectricity, Semiconductor, Ceramics, Others

By Companies

DIsco, Kulicke and Soffa, Advanced Dicing Technologies (ADT), ACCRETECH, Asahi Diamond Industrial, Ceiba Technologies, UKAM, More Superhard Products, Zhengzhou Hongtuo Precision Tools, HENAN E-GRIND Abrasives

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

174

Number of Tables & Figures

122

Customization Available

Yes, the report can be customized as per your need.


Global Hub Dicing Blade Market Report Segments:

The global Hub Dicing Blade market is segmented on the basis of:

Types

Electroformed Hub Dicing Blade, Metal Hub Dicing Blade, Resin Hub Dicing Blade, Nickel Matrices Hub Dicing Blade, Others

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

Photoelectricity, Semiconductor, Ceramics, Others

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. DIsco
  2. Kulicke and Soffa
  3. Advanced Dicing Technologies (ADT)
  4. ACCRETECH
  5. Asahi Diamond Industrial
  6. Ceiba Technologies
  7. UKAM
  8. More Superhard Products
  9. Zhengzhou Hongtuo Precision Tools
  10. HENAN E-GRIND Abrasives

Global Hub Dicing Blade Market Overview


Highlights of The Hub Dicing Blade Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. Electroformed Hub Dicing Blade
    2. Metal Hub Dicing Blade
    3. Resin Hub Dicing Blade
    4. Nickel Matrices Hub Dicing Blade
    5. Others
  1. By Application:

    1. Photoelectricity
    2. Semiconductor
    3. Ceramics
    4. Others
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Hub Dicing Blade Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

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Global Hub Dicing Blade Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?


Hub Dicing Blade is a type of blade used in the production of Hubs. It is a sharp, pointed tool that is inserted into the hub to create evenly spaced cuts.

Some of the major companies in the hub dicing blade market are DIsco, Kulicke and Soffa, Advanced Dicing Technologies (ADT), ACCRETECH, Asahi Diamond Industrial, Ceiba Technologies, UKAM, More Superhard Products, Zhengzhou Hongtuo Precision Tools, HENAN E-GRIND Abrasives.

The hub dicing blade market is expected to grow at a compound annual growth rate of 5.5%.

                                            
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Hub Dicing Blade Market Overview    4.1 Introduction       4.1.1 Market Taxonomy       4.1.2 Market Definition       4.1.3 Macro-Economic Factors Impacting the Market Growth    4.2 Hub Dicing Blade Market Dynamics       4.2.1 Market Drivers       4.2.2 Market Restraints       4.2.3 Market Opportunity    4.3 Hub Dicing Blade Market - Supply Chain Analysis       4.3.1 List of Key Suppliers       4.3.2 List of Key Distributors       4.3.3 List of Key Consumers    4.4 Key Forces Shaping the Hub Dicing Blade Market       4.4.1 Bargaining Power of Suppliers       4.4.2 Bargaining Power of Buyers       4.4.3 Threat of Substitution       4.4.4 Threat of New Entrants       4.4.5 Competitive Rivalry    4.5 Global Hub Dicing Blade Market Size & Forecast, 2020-2028       4.5.1 Hub Dicing Blade Market Size and Y-o-Y Growth       4.5.2 Hub Dicing Blade Market Absolute $ Opportunity

Chapter 5 Global  Market Analysis and Forecast by Type
   5.1 Introduction
      5.1.1 Key Market Trends & Growth Opportunities by Type
      5.1.2 Basis Point Share (BPS) Analysis by Type
      5.1.3 Absolute $ Opportunity Assessment by Type
   5.2  Market Size Forecast by Type
      5.2.1 Electroformed Hub Dicing Blade
      5.2.2 Metal Hub Dicing Blade
      5.2.3 Resin Hub Dicing Blade
      5.2.4 Nickel Matrices Hub Dicing Blade
      5.2.5 Others
   5.3 Market Attractiveness Analysis by Type

Chapter 6 Global  Market Analysis and Forecast by Applications
   6.1 Introduction
      6.1.1 Key Market Trends & Growth Opportunities by Applications
      6.1.2 Basis Point Share (BPS) Analysis by Applications
      6.1.3 Absolute $ Opportunity Assessment by Applications
   6.2  Market Size Forecast by Applications
      6.2.1 Photoelectricity
      6.2.2 Semiconductor
      6.2.3 Ceramics
      6.2.4 Others
   6.3 Market Attractiveness Analysis by Applications

Chapter 7 Global Hub Dicing Blade Market Analysis and Forecast by Region
   7.1 Introduction
      7.1.1 Key Market Trends & Growth Opportunities by Region
      7.1.2 Basis Point Share (BPS) Analysis by Region
      7.1.3 Absolute $ Opportunity Assessment by Region
   7.2 Hub Dicing Blade Market Size Forecast by Region
      7.2.1 North America
      7.2.2 Europe
      7.2.3 Asia Pacific
      7.2.4 Latin America
      7.2.5 Middle East & Africa (MEA)
   7.3 Market Attractiveness Analysis by Region

Chapter 8 Coronavirus Disease (COVID-19) Impact 
   8.1 Introduction 
   8.2 Current & Future Impact Analysis 
   8.3 Economic Impact Analysis 
   8.4 Government Policies 
   8.5 Investment Scenario

Chapter 9 North America  Analysis and Forecast
   9.1 Introduction
   9.2 North America  Market Size Forecast by Country
      9.2.1 U.S.
      9.2.2 Canada
   9.3 Basis Point Share (BPS) Analysis by Country
   9.4 Absolute $ Opportunity Assessment by Country
   9.5 Market Attractiveness Analysis by Country
   9.6 North America  Market Size Forecast by Type
      9.6.1 Electroformed Hub Dicing Blade
      9.6.2 Metal Hub Dicing Blade
      9.6.3 Resin Hub Dicing Blade
      9.6.4 Nickel Matrices Hub Dicing Blade
      9.6.5 Others
   9.7 Basis Point Share (BPS) Analysis by Type 
   9.8 Absolute $ Opportunity Assessment by Type 
   9.9 Market Attractiveness Analysis by Type
   9.10 North America  Market Size Forecast by Applications
      9.10.1 Photoelectricity
      9.10.2 Semiconductor
      9.10.3 Ceramics
      9.10.4 Others
   9.11 Basis Point Share (BPS) Analysis by Applications 
   9.12 Absolute $ Opportunity Assessment by Applications 
   9.13 Market Attractiveness Analysis by Applications

Chapter 10 Europe  Analysis and Forecast
   10.1 Introduction
   10.2 Europe  Market Size Forecast by Country
      10.2.1 Germany
      10.2.2 France
      10.2.3 Italy
      10.2.4 U.K.
      10.2.5 Spain
      10.2.6 Russia
      10.2.7 Rest of Europe
   10.3 Basis Point Share (BPS) Analysis by Country
   10.4 Absolute $ Opportunity Assessment by Country
   10.5 Market Attractiveness Analysis by Country
   10.6 Europe  Market Size Forecast by Type
      10.6.1 Electroformed Hub Dicing Blade
      10.6.2 Metal Hub Dicing Blade
      10.6.3 Resin Hub Dicing Blade
      10.6.4 Nickel Matrices Hub Dicing Blade
      10.6.5 Others
   10.7 Basis Point Share (BPS) Analysis by Type 
   10.8 Absolute $ Opportunity Assessment by Type 
   10.9 Market Attractiveness Analysis by Type
   10.10 Europe  Market Size Forecast by Applications
      10.10.1 Photoelectricity
      10.10.2 Semiconductor
      10.10.3 Ceramics
      10.10.4 Others
   10.11 Basis Point Share (BPS) Analysis by Applications 
   10.12 Absolute $ Opportunity Assessment by Applications 
   10.13 Market Attractiveness Analysis by Applications

Chapter 11 Asia Pacific  Analysis and Forecast
   11.1 Introduction
   11.2 Asia Pacific  Market Size Forecast by Country
      11.2.1 China
      11.2.2 Japan
      11.2.3 South Korea
      11.2.4 India
      11.2.5 Australia
      11.2.6 South East Asia (SEA)
      11.2.7 Rest of Asia Pacific (APAC)
   11.3 Basis Point Share (BPS) Analysis by Country
   11.4 Absolute $ Opportunity Assessment by Country
   11.5 Market Attractiveness Analysis by Country
   11.6 Asia Pacific  Market Size Forecast by Type
      11.6.1 Electroformed Hub Dicing Blade
      11.6.2 Metal Hub Dicing Blade
      11.6.3 Resin Hub Dicing Blade
      11.6.4 Nickel Matrices Hub Dicing Blade
      11.6.5 Others
   11.7 Basis Point Share (BPS) Analysis by Type 
   11.8 Absolute $ Opportunity Assessment by Type 
   11.9 Market Attractiveness Analysis by Type
   11.10 Asia Pacific  Market Size Forecast by Applications
      11.10.1 Photoelectricity
      11.10.2 Semiconductor
      11.10.3 Ceramics
      11.10.4 Others
   11.11 Basis Point Share (BPS) Analysis by Applications 
   11.12 Absolute $ Opportunity Assessment by Applications 
   11.13 Market Attractiveness Analysis by Applications

Chapter 12 Latin America  Analysis and Forecast
   12.1 Introduction
   12.2 Latin America  Market Size Forecast by Country
      12.2.1 Brazil
      12.2.2 Mexico
      12.2.3 Rest of Latin America (LATAM)
   12.3 Basis Point Share (BPS) Analysis by Country
   12.4 Absolute $ Opportunity Assessment by Country
   12.5 Market Attractiveness Analysis by Country
   12.6 Latin America  Market Size Forecast by Type
      12.6.1 Electroformed Hub Dicing Blade
      12.6.2 Metal Hub Dicing Blade
      12.6.3 Resin Hub Dicing Blade
      12.6.4 Nickel Matrices Hub Dicing Blade
      12.6.5 Others
   12.7 Basis Point Share (BPS) Analysis by Type 
   12.8 Absolute $ Opportunity Assessment by Type 
   12.9 Market Attractiveness Analysis by Type
   12.10 Latin America  Market Size Forecast by Applications
      12.10.1 Photoelectricity
      12.10.2 Semiconductor
      12.10.3 Ceramics
      12.10.4 Others
   12.11 Basis Point Share (BPS) Analysis by Applications 
   12.12 Absolute $ Opportunity Assessment by Applications 
   12.13 Market Attractiveness Analysis by Applications

Chapter 13 Middle East & Africa (MEA)  Analysis and Forecast
   13.1 Introduction
   13.2 Middle East & Africa (MEA)  Market Size Forecast by Country
      13.2.1 Saudi Arabia
      13.2.2 South Africa
      13.2.3 UAE
      13.2.4 Rest of Middle East & Africa (MEA)
   13.3 Basis Point Share (BPS) Analysis by Country
   13.4 Absolute $ Opportunity Assessment by Country
   13.5 Market Attractiveness Analysis by Country
   13.6 Middle East & Africa (MEA)  Market Size Forecast by Type
      13.6.1 Electroformed Hub Dicing Blade
      13.6.2 Metal Hub Dicing Blade
      13.6.3 Resin Hub Dicing Blade
      13.6.4 Nickel Matrices Hub Dicing Blade
      13.6.5 Others
   13.7 Basis Point Share (BPS) Analysis by Type 
   13.8 Absolute $ Opportunity Assessment by Type 
   13.9 Market Attractiveness Analysis by Type
   13.10 Middle East & Africa (MEA)  Market Size Forecast by Applications
      13.10.1 Photoelectricity
      13.10.2 Semiconductor
      13.10.3 Ceramics
      13.10.4 Others
   13.11 Basis Point Share (BPS) Analysis by Applications 
   13.12 Absolute $ Opportunity Assessment by Applications 
   13.13 Market Attractiveness Analysis by Applications

Chapter 14 Competition Landscape 
   14.1 Hub Dicing Blade Market: Competitive Dashboard
   14.2 Global Hub Dicing Blade Market: Market Share Analysis, 2019
   14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.3.1 DIsco
      14.3.2 Kulicke and Soffa
      14.3.3 Advanced Dicing Technologies (ADT)
      14.3.4 ACCRETECH
      14.3.5 Asahi Diamond Industrial
      14.3.6 Ceiba Technologies
      14.3.7 UKAM
      14.3.8 More Superhard Products
      14.3.9 Zhengzhou Hongtuo Precision Tools
      14.3.10 HENAN E-GRIND Abrasives

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