Market Overview:
The global hubless dicing blade market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductors and other electronic devices, and the growing trend of miniaturization in these devices. In addition, the increasing demand for optical instruments is also contributing to the growth of this market. The global hubless dicing blade market can be segmented on the basis of type into metal bond, resin bond, ceramic bonding, and electroplating combination blades. The metal bond blades segment is expected to account for a major share of the global hubless dicing blade market during the forecast period owing to their high durability and longer life span as compared to other types of blades. On the basis of application,the global hubless dicing blademarket can be divided into semiconductor applicationsand optical instrument applications.
Product Definition:
A Hubless Dicing Blade is a semiconductor dicing blade without a center hub. It can be used for dicing wafers with diameters up to 200mm. The importance of a Hubless Dicing Blade is that it allows for more accurate and consistent dicing of semiconductor wafers.
Metal Bond:
Metal bond is a process in which metal is bound to the core of the tool by melting. The metal used for bonding can be any type such as stainless steel, copper, brass or aluminum. Bonding increases strength and durability of tools and also helps in improving its overall performance.
The global hubless dicing blade market size was valued at USD 1,37,500 thousand in 2016 and is expected to grow at a CAGR of XX% from 2017 to 2024.
Resin Bond:
Resin bond is a type of adhesion agent that forms an invisible bond between the base material and the surface to be joined. It can be either natural or synthetic in nature, however, it should have similar molecular weight as that of the base material. The most commonly used resin bonds are polyester resin and epoxy resin owing to their high strength along with excellent mechanical properties.
Application Insights:
The semiconductor application segment accounted for the largest share of over 30.0% in 2017. The demand for hubless dicing blades is expected to increase as a result of their use in various semiconductor components such as integrated circuits, capacitors and resistors on account of their small size and high precision. Moreover, the growing demand for smart devices is likely to propel growth over the forecast period.
The optical instrumentation application segment is projected to witness significant growth owing to its rising use in medical equipment, spectacles and goggles manufacturing industry across the globe due to its ability to produce ultra-fine particles with less power consumption which results in lower operational cost while increasing productivity at an increased rate.
Other applications include industrial machinery & equipment manufacturing where hubless dicing blade finds application across numerous processes including metal cutting; drilling; grinding & polishing; sanding & profiling etc.
Regional Analysis:
Asia Pacific dominated the global hubless dicing blade market in 2016 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand from end-use industries such as electronics, automotive, aerospace & defense, and others. In addition, rising foreign investments coupled with favorable government policies are anticipated to drive regional market growth over the forecast period.
The Asia Pacific hubless dicing blade market is also characterized by rapidly growing economies such as China and India that present lucrative opportunities for industry players owing to their large population base along with increasing industrialization levels in these countries. Moreover, rapid urbanization has resulted in an increased need for construction materials including steel products which will further propel product demand over the next eight years.
Growth Factors:
- Increasing demand for miniaturization in semiconductor and electronics industry
- Rising demand for advanced packaging technology in semiconductor and electronics industry
- Growing trend of using Hubless Dicing Blade in 3D ICs and TSV applications
- Proliferation of MEMS devices
- Increasing demand from the medical device industry
Scope Of The Report
Report Attributes
Report Details
Report Title
Hubless Dicing Blade Market Research Report
By Type
Metal Bond, Resin Bond, Ceramic Bonding, Electroplating Combination
By Application
Semiconductor, Optical Instruments, Other
By Companies
DISCO, Kulicke & Soffa, ADT, Asahi Diamond Industrial, UKAM, Ceiba
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
163
Number of Tables & Figures
115
Customization Available
Yes, the report can be customized as per your need.
Global Hubless Dicing Blade Market Report Segments:
The global Hubless Dicing Blade market is segmented on the basis of:
Types
Metal Bond, Resin Bond, Ceramic Bonding, Electroplating Combination
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Semiconductor, Optical Instruments, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- DISCO
- Kulicke & Soffa
- ADT
- Asahi Diamond Industrial
- UKAM
- Ceiba
Highlights of The Hubless Dicing Blade Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Metal Bond
- Resin Bond
- Ceramic Bonding
- Electroplating Combination
- By Application:
- Semiconductor
- Optical Instruments
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Hubless Dicing Blade Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
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- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A hubless cutting blade is a type of knife that does not have a traditional center-hub. This design allows the blade to spin more freely, which makes it easier to maneuver and cut through materials.
Some of the major companies in the hubless dicing blade market are DISCO, Kulicke & Soffa, ADT, Asahi Diamond Industrial, UKAM, Ceiba.
The hubless dicing blade market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Hubless Dicing Blade Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Hubless Dicing Blade Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Hubless Dicing Blade Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Hubless Dicing Blade Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Hubless Dicing Blade Market Size & Forecast, 2020-2028
4.5.1 Hubless Dicing Blade Market Size and Y-o-Y Growth
4.5.2 Hubless Dicing Blade Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Metal Bond
5.2.2 Resin Bond
5.2.3 Ceramic Bonding
5.2.4 Electroplating Combination
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Semiconductor
6.2.2 Optical Instruments
6.2.3 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Hubless Dicing Blade Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Hubless Dicing Blade Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Metal Bond
9.6.2 Resin Bond
9.6.3 Ceramic Bonding
9.6.4 Electroplating Combination
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Semiconductor
9.10.2 Optical Instruments
9.10.3 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Metal Bond
10.6.2 Resin Bond
10.6.3 Ceramic Bonding
10.6.4 Electroplating Combination
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Semiconductor
10.10.2 Optical Instruments
10.10.3 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Metal Bond
11.6.2 Resin Bond
11.6.3 Ceramic Bonding
11.6.4 Electroplating Combination
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Semiconductor
11.10.2 Optical Instruments
11.10.3 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Metal Bond
12.6.2 Resin Bond
12.6.3 Ceramic Bonding
12.6.4 Electroplating Combination
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Semiconductor
12.10.2 Optical Instruments
12.10.3 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Metal Bond
13.6.2 Resin Bond
13.6.3 Ceramic Bonding
13.6.4 Electroplating Combination
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Semiconductor
13.10.2 Optical Instruments
13.10.3 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Hubless Dicing Blade Market: Competitive Dashboard
14.2 Global Hubless Dicing Blade Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 DISCO
14.3.2 Kulicke & Soffa
14.3.3 ADT
14.3.4 Asahi Diamond Industrial
14.3.5 UKAM
14.3.6 Ceiba
