Market Overview:
The global IC advanced packaging market is expected to grow at a CAGR of 9.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for miniaturization and higher performance in electronic devices. In terms of type, the 3D IC advanced packaging segment is expected to grow at a higher CAGR as compared to other segments during the forecast period. This can be attributed to the growing demand for high-performance and miniaturized electronic devices. By application, MEMS/sensors is expected to witness highest growth during the forecast period owing to increasing adoption of these sensors in various end-use applications such as automotive, healthcare, and consumer electronics among others.
Product Definition:
IC Advanced Packaging is the process of assembling and packaging integrated circuits (ICs) into a final product. This can include attaching leads or other connectors, molding the IC into a desired shape, and adding protective coatings. The importance of IC advanced packaging lies in its ability to protect delicate circuitry from damage during shipping and handling, as well as to improve performance by minimizing electrical interference.
3D:
3D is an integrated circuit packaging technique wherein multiple layers of semiconductor materials are stacked on top of each other to form a three-dimensional structure. The technology has been around for more than two decades but has only recently started gaining traction. 3D ICs offer benefits such as increased performance, better efficiency and reduced power consumption over traditional 2D ICs; however, the technology is still in its nascent stage with major challenges looming large.
2.5D:
2.5D technology is used to make a thin-film package of semiconductor devices on an insulating base, which can be further utilized in advanced packaging applications. The key drivers for this technology are the need for reducing the thickness of semiconductor device packages and increasing efficiency in IC manufacturing processes.
The 2.5D process flow includes deposition, laminar growth,.
Application Insights:
The logic application segment accounted for the largest share in 2015 and is projected to witness significant growth over the forecast period. This can be attributed to increasing demand for IC packaging from various end-use industries such as consumer electronics, telecommunication and IT, automotive and transportation, healthcare etc. The imaging and optoelectronics application segment is also expected to register a notable CAGR during the same period owing to high product demand in this industry.
Memory applications are anticipated to witness considerable growth over the forecast period due largelyto growing demand from mobile device manufacturers globally. Increasing use of ICs with higher clock rates has ledto an increase in memory requirements across numerous devices thus drivingthe market growth during the same period. MEMS/sensors applications are expected tomaximize gains on account of rising product penetration across diverse end-use industriessuch as consumer electronics, healthcare etc.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to rising demand from end-use industries such as electronics, automotive, healthcare & life sciences, consumer goods among others. China is projected to remain a key driving country owing to low manufacturing cost coupled with easy availability of labor and capital for new investment.
The U.S., Latin America, and Europe are anticipated to witness significant growth over the next eight years owing to increasing R&D activities by various companies in these regions along with growing adoption of advanced technologies across several industry verticals including imaging & optoelectronics, logic ICs etc.). Moreover, increasing investments by public agencies for developing smart cities are also likely boost regional market growth during the forecast period. For instance; In June 2016; Samsung Electronics Co., Ltd.
Growth Factors:
- Increasing demand for miniaturization and higher performance in electronics products
- Proliferation of smart devices and the Internet of Things (IoT)
- Growing trend of system-in-package (SiP) and 3D IC packaging
- Rising demand for semiconductor packaging services from China and other emerging markets
- Advancements in materials science and nanotechnology
Scope Of The Report
Report Attributes
Report Details
Report Title
IC Advanced Packaging Market Research Report
By Type
3D, 2.5D
By Application
Logic, Imaging and Optoelectronics, Memory, MEMS/Sensors, LED, Power
By Companies
Abel, Samsung, Toshiba, Intel, Amkor, MAK, Optocap, ASE, Changing Electronics Technology, STMicroelectronics, EKSS Microelectronics
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
143
Number of Tables & Figures
101
Customization Available
Yes, the report can be customized as per your need.
Global IC Advanced Packaging Market Report Segments:
The global IC Advanced Packaging market is segmented on the basis of:
Types
3D, 2.5D
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Logic, Imaging and Optoelectronics, Memory, MEMS/Sensors, LED, Power
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Abel
- Samsung
- Toshiba
- Intel
- Amkor
- MAK
- Optocap
- ASE
- Changing Electronics Technology
- STMicroelectronics
- EKSS Microelectronics
Highlights of The IC Advanced Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 3D
- 2.5D
- By Application:
- Logic
- Imaging and Optoelectronics
- Memory
- MEMS/Sensors
- LED
- Power
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the IC Advanced Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
IC Advanced Packaging is a comprehensive, end-to-end packaging solution that helps you design, produce and market high quality products. We provide our clients with the resources they need to create innovative and sustainable packaging solutions that meet the needs of their customers.
Some of the key players operating in the ic advanced packaging market are Abel, Samsung, Toshiba, Intel, Amkor, MAK, Optocap, ASE, Changing Electronics Technology, STMicroelectronics, EKSS Microelectronics.
The ic advanced packaging market is expected to register a CAGR of 9.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 IC Advanced Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 IC Advanced Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 IC Advanced Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the IC Advanced Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global IC Advanced Packaging Market Size & Forecast, 2018-2028
4.5.1 IC Advanced Packaging Market Size and Y-o-Y Growth
4.5.2 IC Advanced Packaging Market Absolute $ Opportunity
Chapter 5 Global IC Advanced Packaging Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 IC Advanced Packaging Market Size Forecast by Type
5.2.1 3D
5.2.2 2.5D
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global IC Advanced Packaging Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 IC Advanced Packaging Market Size Forecast by Applications
6.2.1 Logic
6.2.2 Imaging and Optoelectronics
6.2.3 Memory
6.2.4 MEMS/Sensors
6.2.5 LED
6.2.6 Power
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global IC Advanced Packaging Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 IC Advanced Packaging Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America IC Advanced Packaging Analysis and Forecast
9.1 Introduction
9.2 North America IC Advanced Packaging Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America IC Advanced Packaging Market Size Forecast by Type
9.6.1 3D
9.6.2 2.5D
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America IC Advanced Packaging Market Size Forecast by Applications
9.10.1 Logic
9.10.2 Imaging and Optoelectronics
9.10.3 Memory
9.10.4 MEMS/Sensors
9.10.5 LED
9.10.6 Power
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe IC Advanced Packaging Analysis and Forecast
10.1 Introduction
10.2 Europe IC Advanced Packaging Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe IC Advanced Packaging Market Size Forecast by Type
10.6.1 3D
10.6.2 2.5D
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe IC Advanced Packaging Market Size Forecast by Applications
10.10.1 Logic
10.10.2 Imaging and Optoelectronics
10.10.3 Memory
10.10.4 MEMS/Sensors
10.10.5 LED
10.10.6 Power
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific IC Advanced Packaging Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific IC Advanced Packaging Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific IC Advanced Packaging Market Size Forecast by Type
11.6.1 3D
11.6.2 2.5D
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific IC Advanced Packaging Market Size Forecast by Applications
11.10.1 Logic
11.10.2 Imaging and Optoelectronics
11.10.3 Memory
11.10.4 MEMS/Sensors
11.10.5 LED
11.10.6 Power
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America IC Advanced Packaging Analysis and Forecast
12.1 Introduction
12.2 Latin America IC Advanced Packaging Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America IC Advanced Packaging Market Size Forecast by Type
12.6.1 3D
12.6.2 2.5D
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America IC Advanced Packaging Market Size Forecast by Applications
12.10.1 Logic
12.10.2 Imaging and Optoelectronics
12.10.3 Memory
12.10.4 MEMS/Sensors
12.10.5 LED
12.10.6 Power
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) IC Advanced Packaging Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) IC Advanced Packaging Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) IC Advanced Packaging Market Size Forecast by Type
13.6.1 3D
13.6.2 2.5D
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) IC Advanced Packaging Market Size Forecast by Applications
13.10.1 Logic
13.10.2 Imaging and Optoelectronics
13.10.3 Memory
13.10.4 MEMS/Sensors
13.10.5 LED
13.10.6 Power
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 IC Advanced Packaging Market: Competitive Dashboard
14.2 Global IC Advanced Packaging Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Abel
14.3.2 Samsung
14.3.3 Toshiba
14.3.4 Intel
14.3.5 Amkor
14.3.6 MAK
14.3.7 Optocap
14.3.8 ASE
14.3.9 Changing Electronics Technology
14.3.10 STMicroelectronics
14.3.11 EKSS Microelectronics
