Market Overview:
The global IC packaging and packaging testing market is expected to grow at a CAGR of 6.5% from 2018 to 2030. The growth in this market can be attributed to the increasing demand for advanced packaging solutions, miniaturization of electronic devices, and the growing trend of MEMS-based sensors. In terms of type, the IC packaging segment is expected to account for the majority share of the market during the forecast period. This can be attributed to advancements in technology that have led to smaller form factors and higher integration levels in semiconductor devices.
Product Definition:
IC Packaging is the process and technology used to protect and distribute integrated circuits (ICs). IC packaging begins with the wafer fabrication process, in which a large number of silicon dies are created. The individual dies are then cut from the wafer, sorted into packages, and tested. Finally, the packaged chips are shipped to customers or distributors.
Packaging testing is an important part of ensuring that chips function as intended when they leave the manufacturing facility. Chips can be damaged during transport or while in use, so it’s important to test them for reliability prior to release. Tests may include thermal cycling (exposing chips to extreme temperatures), vibration testing (simulating shipping conditions), and electrical testing (checking for shorts and other defects).
IC Packaging:
Integrated Circuit (IC) packaging is a technology that involves the physical and chemical protection of integrated circuits from environmental stress such as heat, vibration, electrostatic discharge (ESD), and moisture. The packaging protects the sensitive electronic components inside by creating an environment that is free of dust particles and external electromagnetic radiations.
The global IC packaging market size was valued at USD 13 billion in 2016 which is anticipated to grow at a CAGR of XX% over the forecast period.
IC Packaging Testing:
The global IC packaging testing market size was valued at USD 1.5 billion in 2016 and is expected to grow at a CAGR of XX% over the forecast period. The growth can be attributed to increasing demand for electronics products such as mobile phones, tablets, laptops, and other consumer electronic devices across the globe.
Application Insights:
The market is segmented by application into integrated circuit packaging, advanced packaging, MEMS, LED and others. The integrated circuit packaging segment dominated the overall industry in terms of revenue share in 2017. It accounted for a revenue share of over 40% that year owing to increasing demand from end-use industries such as telecommunication and IT.
Advanced Packaging segment is expected to grow at a CAGR of XX% from 2018 to 2030 due to rising demand for high-tech products across various end-use industries including medical equipment and appliances among others. Medical equipment was the largest application segment with around 15% market share in 2017 owing to growing R&D activities related ICs for better healthcare services worldwide coupled with strong product innovation by key players such as Samsung Electronics Co., Ltd., Microchip Technology Inc., Atmel Corporation among others driving growth globally over the forecast period.
Regional Analysis:
Asia Pacific dominated the global market in 2017. The region is expected to maintain its dominance over the forecast period owing to increasing IC production and sales in countries, such as China, India, South Korea, Japan and Taiwan. In addition, rising demand for electronic products with low power consumption will drive the regional market growth over the forecast period.
The Asia Pacific has been witnessing strong economic growth on account of rapid industrialization coupled with developing economies like China and India. These factors are anticipated to boost product demand across various applications including medical devices & systems; consumer electronics; lighting & energy saving solutions among others during the forecast period from 2018 to 2030 (calendar year 2018).
Europe accounted for a significant share of revenue in 2017 owing to high product penetration across several industries including automotive; aerospace & defense among others that use semiconductor packaging technology at their core or edge (viz., sensor chips).
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from automotive and medical industries
- Proliferation of smart devices and the Internet of Things (IoT)
- Growing trend of outsourcing packaging services to contract manufacturers
- Advancements in packaging technology
Scope Of The Report
Report Attributes
Report Details
Report Title
IC Packaging and Packaging Testing Market Research Report
By Type
IC Packaging, IC Packaging Testing
By Application
IC, Advanced Packaging, MEMS, LED
By Companies
Amkor Technology, UTAC Holdings, Nepes, Unisem, JCET Group, Siliconware Precision Industries, KYEC, TongFu Microelectronics, ITEQ Corporation, Powertech Technology Inc. (PTI), TSHT, Chipbond Technology, LCSP
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
122
Number of Tables & Figures
86
Customization Available
Yes, the report can be customized as per your need.
Global IC Packaging and Packaging Testing Market Report Segments:
The global IC Packaging and Packaging Testing market is segmented on the basis of:
Types
IC Packaging, IC Packaging Testing
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
IC, Advanced Packaging, MEMS, LED
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Amkor Technology
- UTAC Holdings
- Nepes
- Unisem
- JCET Group
- Siliconware Precision Industries
- KYEC
- TongFu Microelectronics
- ITEQ Corporation
- Powertech Technology Inc. (PTI)
- TSHT
- Chipbond Technology
- LCSP
Highlights of The IC Packaging and Packaging Testing Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- IC Packaging
- IC Packaging Testing
- By Application:
- IC
- Advanced Packaging
- MEMS
- LED
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the IC Packaging and Packaging Testing Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
IC packaging is a type of packaging that uses integrated circuits. This type of packaging is used to protect electronic devices from damage. Packaging testing is a process used to test the integrity and performance of IC packages.
Some of the key players operating in the ic packaging and packaging testing market are Amkor Technology, UTAC Holdings, Nepes, Unisem, JCET Group, Siliconware Precision Industries, KYEC, TongFu Microelectronics, ITEQ Corporation, Powertech Technology Inc. (PTI), TSHT, Chipbond Technology, LCSP.
The ic packaging and packaging testing market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 IC Packaging and Packaging Testing Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 IC Packaging and Packaging Testing Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 IC Packaging and Packaging Testing Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the IC Packaging and Packaging Testing Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global IC Packaging and Packaging Testing Market Size & Forecast, 2018-2028
4.5.1 IC Packaging and Packaging Testing Market Size and Y-o-Y Growth
4.5.2 IC Packaging and Packaging Testing Market Absolute $ Opportunity
Chapter 5 Global IC Packaging and Packaging Testing Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 IC Packaging and Packaging Testing Market Size Forecast by Type
5.2.1 IC Packaging
5.2.2 IC Packaging Testing
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global IC Packaging and Packaging Testing Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 IC Packaging and Packaging Testing Market Size Forecast by Applications
6.2.1 IC
6.2.2 Advanced Packaging
6.2.3 MEMS
6.2.4 LED
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global IC Packaging and Packaging Testing Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 IC Packaging and Packaging Testing Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America IC Packaging and Packaging Testing Analysis and Forecast
9.1 Introduction
9.2 North America IC Packaging and Packaging Testing Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America IC Packaging and Packaging Testing Market Size Forecast by Type
9.6.1 IC Packaging
9.6.2 IC Packaging Testing
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America IC Packaging and Packaging Testing Market Size Forecast by Applications
9.10.1 IC
9.10.2 Advanced Packaging
9.10.3 MEMS
9.10.4 LED
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe IC Packaging and Packaging Testing Analysis and Forecast
10.1 Introduction
10.2 Europe IC Packaging and Packaging Testing Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe IC Packaging and Packaging Testing Market Size Forecast by Type
10.6.1 IC Packaging
10.6.2 IC Packaging Testing
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe IC Packaging and Packaging Testing Market Size Forecast by Applications
10.10.1 IC
10.10.2 Advanced Packaging
10.10.3 MEMS
10.10.4 LED
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific IC Packaging and Packaging Testing Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific IC Packaging and Packaging Testing Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific IC Packaging and Packaging Testing Market Size Forecast by Type
11.6.1 IC Packaging
11.6.2 IC Packaging Testing
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific IC Packaging and Packaging Testing Market Size Forecast by Applications
11.10.1 IC
11.10.2 Advanced Packaging
11.10.3 MEMS
11.10.4 LED
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America IC Packaging and Packaging Testing Analysis and Forecast
12.1 Introduction
12.2 Latin America IC Packaging and Packaging Testing Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America IC Packaging and Packaging Testing Market Size Forecast by Type
12.6.1 IC Packaging
12.6.2 IC Packaging Testing
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America IC Packaging and Packaging Testing Market Size Forecast by Applications
12.10.1 IC
12.10.2 Advanced Packaging
12.10.3 MEMS
12.10.4 LED
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) IC Packaging and Packaging Testing Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) IC Packaging and Packaging Testing Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) IC Packaging and Packaging Testing Market Size Forecast by Type
13.6.1 IC Packaging
13.6.2 IC Packaging Testing
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) IC Packaging and Packaging Testing Market Size Forecast by Applications
13.10.1 IC
13.10.2 Advanced Packaging
13.10.3 MEMS
13.10.4 LED
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 IC Packaging and Packaging Testing Market: Competitive Dashboard
14.2 Global IC Packaging and Packaging Testing Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Amkor Technology
14.3.2 UTAC Holdings
14.3.3 Nepes
14.3.4 Unisem
14.3.5 JCET Group
14.3.6 Siliconware Precision Industries
14.3.7 KYEC
14.3.8 TongFu Microelectronics
14.3.9 ITEQ Corporation
14.3.10 Powertech Technology Inc. (PTI)
14.3.11 TSHT
14.3.12 Chipbond Technology
14.3.13 LCSP
