Market Overview:
The global IC packaging and testing equipment market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for advanced packaging solutions, miniaturization of semiconductor devices, and rising demand for MEMS and LED products. In terms of type, the IC packaging equipment segment is expected to hold the largest share of the global IC packaging and testing equipment market during the forecast period. This can be attributed to the increasing demand for advanced packaging solutions that require specialized equipment such as die attach machines, wire bonders, etc.
Product Definition:
IC Packaging and Testing Equipment is a type of equipment that is used to package and test integrated circuits. This type of equipment is important because it helps to ensure that the integrated circuits are packaged correctly and that they function properly.
IC Packaging Equipment:
Industrial packaging equipment is used to enclose and protect electronic devices or components that are sensitive to physical or chemical environments. Industrial packaging includes various types of machines that are used for wrapping, sealing, and box making for transportation of products in the manufacturing industries. The industrial packaging machine can be broadly segmented into two categories on the basis of application areas as well as technology employed.
IC Packaging Testing Equipment:
An Introduction to IC Packaging Testing Equipment and it's usage in the IC packaging market.
The global testing equipment industry is expected to grow at a CAGR of XX% from 2016 to 2024. The growth can be attributed primarily to the growing demand for automated test systems in emerging economies such as China, India, Brazil, and Russia.
Application Insights:
The market is segmented by application into integrated circuit (IC), advanced packaging, MEMS, and LED. The IC packaging segment dominated the overall industry in terms of revenue in 2017. It accounted for a share of over 60% in the same year owing to increasing demand for ICs from various end-use industries such as consumer electronics, telecommunication and ITU sectors among others. Advanced packaging is anticipated to be the fastest-growing application segment during the forecast period due to rising demand from medical equipment manufacturing companies across the globe.
MEMS technology has witnessed tremendous growth over recent years owing to its applications across numerous end-use industries such as automotive & transportation, energy & power distribution devices and storage batteries etc among others.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing region over the forecast period. The growth can be attributed to increasing demand for IC packaging equipment in countries such as China and India. Asia Pacific has been witnessing a rapid increase in electronic products manufacturing, which will drive the market further. In addition, rising investments by foreign players such as Intel Corporation and Samsung Electronics Co., Ltd., are anticipated to fuel regional growth during the forecast period.
The Middle East & Africa is also likely to witness significant growth over the next eight years owing to increasing electronic devices manufacturing capacity in countries such as South Africa and Saudi Arabia on account of low labor costs compared with other regions. Moreover, growing use of solar energy for electricity generation will boost LED lighting production across this region, thereby driving market development over the coming years.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from automotive and semiconductor industries
- Growing popularity of 3D IC packaging technology
- Proliferation of advanced packaging technologies
- Emergence of new applications
Scope Of The Report
Report Attributes
Report Details
Report Title
IC Packaging and Testing Equipment Market Research Report
By Type
IC Packaging Equipment, IC Packaging Testing Equipment
By Application
IC, Advanced Packaging, MEMS, LED
By Companies
Amkor Technology, UTAC Holdings, Nepes, Unisem, JCET Group, Siliconware Precision Industries, KYEC, TongFu Microelectronics, ITEQ Corporation, Powertech Technology Inc. (PTI), TSHT, Chipbond Technology, LCSP
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
222
Number of Tables & Figures
156
Customization Available
Yes, the report can be customized as per your need.
Global IC Packaging and Testing Equipment Market Report Segments:
The global IC Packaging and Testing Equipment market is segmented on the basis of:
Types
IC Packaging Equipment, IC Packaging Testing Equipment
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
IC, Advanced Packaging, MEMS, LED
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Amkor Technology
- UTAC Holdings
- Nepes
- Unisem
- JCET Group
- Siliconware Precision Industries
- KYEC
- TongFu Microelectronics
- ITEQ Corporation
- Powertech Technology Inc. (PTI)
- TSHT
- Chipbond Technology
- LCSP
Highlights of The IC Packaging and Testing Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- IC Packaging Equipment
- IC Packaging Testing Equipment
- By Application:
- IC
- Advanced Packaging
- MEMS
- LED
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the IC Packaging and Testing Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
IC packaging and testing equipment is used to package and test integrated circuits.
Some of the major players in the ic packaging and testing equipment market are Amkor Technology, UTAC Holdings, Nepes, Unisem, JCET Group, Siliconware Precision Industries, KYEC, TongFu Microelectronics, ITEQ Corporation, Powertech Technology Inc. (PTI), TSHT, Chipbond Technology, LCSP.
The ic packaging and testing equipment market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 IC Packaging and Testing Equipment Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 IC Packaging and Testing Equipment Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 IC Packaging and Testing Equipment Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the IC Packaging and Testing Equipment Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global IC Packaging and Testing Equipment Market Size & Forecast, 2018-2028
4.5.1 IC Packaging and Testing Equipment Market Size and Y-o-Y Growth
4.5.2 IC Packaging and Testing Equipment Market Absolute $ Opportunity
Chapter 5 Global IC Packaging and Testing Equipment Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 IC Packaging and Testing Equipment Market Size Forecast by Type
5.2.1 IC Packaging Equipment
5.2.2 IC Packaging Testing Equipment
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global IC Packaging and Testing Equipment Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 IC Packaging and Testing Equipment Market Size Forecast by Applications
6.2.1 IC
6.2.2 Advanced Packaging
6.2.3 MEMS
6.2.4 LED
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global IC Packaging and Testing Equipment Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 IC Packaging and Testing Equipment Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America IC Packaging and Testing Equipment Analysis and Forecast
9.1 Introduction
9.2 North America IC Packaging and Testing Equipment Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America IC Packaging and Testing Equipment Market Size Forecast by Type
9.6.1 IC Packaging Equipment
9.6.2 IC Packaging Testing Equipment
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America IC Packaging and Testing Equipment Market Size Forecast by Applications
9.10.1 IC
9.10.2 Advanced Packaging
9.10.3 MEMS
9.10.4 LED
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe IC Packaging and Testing Equipment Analysis and Forecast
10.1 Introduction
10.2 Europe IC Packaging and Testing Equipment Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe IC Packaging and Testing Equipment Market Size Forecast by Type
10.6.1 IC Packaging Equipment
10.6.2 IC Packaging Testing Equipment
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe IC Packaging and Testing Equipment Market Size Forecast by Applications
10.10.1 IC
10.10.2 Advanced Packaging
10.10.3 MEMS
10.10.4 LED
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific IC Packaging and Testing Equipment Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific IC Packaging and Testing Equipment Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific IC Packaging and Testing Equipment Market Size Forecast by Type
11.6.1 IC Packaging Equipment
11.6.2 IC Packaging Testing Equipment
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific IC Packaging and Testing Equipment Market Size Forecast by Applications
11.10.1 IC
11.10.2 Advanced Packaging
11.10.3 MEMS
11.10.4 LED
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America IC Packaging and Testing Equipment Analysis and Forecast
12.1 Introduction
12.2 Latin America IC Packaging and Testing Equipment Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America IC Packaging and Testing Equipment Market Size Forecast by Type
12.6.1 IC Packaging Equipment
12.6.2 IC Packaging Testing Equipment
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America IC Packaging and Testing Equipment Market Size Forecast by Applications
12.10.1 IC
12.10.2 Advanced Packaging
12.10.3 MEMS
12.10.4 LED
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) IC Packaging and Testing Equipment Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) IC Packaging and Testing Equipment Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) IC Packaging and Testing Equipment Market Size Forecast by Type
13.6.1 IC Packaging Equipment
13.6.2 IC Packaging Testing Equipment
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) IC Packaging and Testing Equipment Market Size Forecast by Applications
13.10.1 IC
13.10.2 Advanced Packaging
13.10.3 MEMS
13.10.4 LED
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 IC Packaging and Testing Equipment Market: Competitive Dashboard
14.2 Global IC Packaging and Testing Equipment Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Amkor Technology
14.3.2 UTAC Holdings
14.3.3 Nepes
14.3.4 Unisem
14.3.5 JCET Group
14.3.6 Siliconware Precision Industries
14.3.7 KYEC
14.3.8 TongFu Microelectronics
14.3.9 ITEQ Corporation
14.3.10 Powertech Technology Inc. (PTI)
14.3.11 TSHT
14.3.12 Chipbond Technology
14.3.13 LCSP
