Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global IC Packaging Solder Ball Market by Type (Up to 0.2 mm, 0.2-0.5 mm, Above 0.5 mm), By Application (BGA, CSP and WLCSP, Flip-Chip) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global IC Packaging Solder Ball Market by Type (Up to 0.2 mm, 0.2-0.5 mm, Above 0.5 mm), By Application (BGA, CSP and WLCSP, Flip-Chip) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 247780 4200 Electronics & Semiconductor 377 212 Pages 4.8 (39)
                                          

Industry Growth Insights published a new data on “IC Packaging Solder Ball Market”. The research report is titled “IC Packaging Solder Ball Market research by Types (Up to 0.2 mm, 0.2-0.5 mm, Above 0.5 mm), By Applications (BGA, CSP and WLCSP, Flip-Chip), By Players/Companies Senju Metal, Accurus, DS HiMetal, NMC, MKE, PMTC, Indium Corporation, YCTC, Shenmao Technology, Shanghai hiking solder material, Senju Metal”.

Scope Of The Report

Report Attributes

Report Details

Report Title

IC Packaging Solder Ball Market Research Report

By Type

Up to 0.2 mm, 0.2-0.5 mm, Above 0.5 mm

By Application

BGA, CSP and WLCSP, Flip-Chip

By Companies

Senju Metal, Accurus, DS HiMetal, NMC, MKE, PMTC, Indium Corporation, YCTC, Shenmao Technology, Shanghai hiking solder material, Senju Metal

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

212

Number of Tables & Figures

149

Customization Available

Yes, the report can be customized as per your need.


Global IC Packaging Solder Ball Industry Outlook


Global IC Packaging Solder Ball Market Report Segments:

The global IC Packaging Solder Ball market is segmented on the basis of:

Types

Up to 0.2 mm, 0.2-0.5 mm, Above 0.5 mm

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

BGA, CSP and WLCSP, Flip-Chip

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. Senju Metal
  2. Accurus
  3. DS HiMetal
  4. NMC
  5. MKE
  6. PMTC
  7. Indium Corporation
  8. YCTC
  9. Shenmao Technology
  10. Shanghai hiking solder material
  11. Senju Metal

Global IC Packaging Solder Ball Market Overview


Highlights of The IC Packaging Solder Ball Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. Up to 0.2 mm
    2. 0.2-0.5 mm
    3. Above 0.5 mm
  1. By Application:

    1. BGA
    2. CSP and WLCSP
    3. Flip-Chip
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the IC Packaging Solder Ball Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

How you may use our products:

  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
  • Understanding Competition Scenario
  • Product & Brand Management
  • Channel & Customer Management
  • Identifying Appropriate Advertising Appeals

Global IC Packaging Solder Ball Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?


IC packaging solder ball is a type of electronic component that is used in the manufacturing of semiconductor devices. It is a small, round, solid object made from metal and plastic that has been coated with a layer of solder.

Some of the key players operating in the ic packaging solder ball market are Senju Metal, Accurus, DS HiMetal, NMC, MKE, PMTC, Indium Corporation, YCTC, Shenmao Technology, Shanghai hiking solder material, Senju Metal.

                                            
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 IC Packaging Solder Ball Market Overview    4.1 Introduction       4.1.1 Market Taxonomy       4.1.2 Market Definition       4.1.3 Macro-Economic Factors Impacting the Market Growth    4.2 IC Packaging Solder Ball Market Dynamics       4.2.1 Market Drivers       4.2.2 Market Restraints       4.2.3 Market Opportunity    4.3 IC Packaging Solder Ball Market - Supply Chain Analysis       4.3.1 List of Key Suppliers       4.3.2 List of Key Distributors       4.3.3 List of Key Consumers    4.4 Key Forces Shaping the IC Packaging Solder Ball Market       4.4.1 Bargaining Power of Suppliers       4.4.2 Bargaining Power of Buyers       4.4.3 Threat of Substitution       4.4.4 Threat of New Entrants       4.4.5 Competitive Rivalry    4.5 Global IC Packaging Solder Ball Market Size & Forecast, 2018-2028       4.5.1 IC Packaging Solder Ball Market Size and Y-o-Y Growth       4.5.2 IC Packaging Solder Ball Market Absolute $ Opportunity

Chapter 5 Global IC Packaging Solder Ball Market Analysis and Forecast by Type
   5.1 Introduction
      5.1.1 Key Market Trends & Growth Opportunities by Type
      5.1.2 Basis Point Share (BPS) Analysis by Type
      5.1.3 Absolute $ Opportunity Assessment by Type
   5.2 IC Packaging Solder Ball Market Size Forecast by Type
      5.2.1 Up to 0.2 mm
      5.2.2 0.2-0.5 mm
      5.2.3 Above 0.5 mm
   5.3 Market Attractiveness Analysis by Type

Chapter 6 Global IC Packaging Solder Ball Market Analysis and Forecast by Applications
   6.1 Introduction
      6.1.1 Key Market Trends & Growth Opportunities by Applications
      6.1.2 Basis Point Share (BPS) Analysis by Applications
      6.1.3 Absolute $ Opportunity Assessment by Applications
   6.2 IC Packaging Solder Ball Market Size Forecast by Applications
      6.2.1 BGA
      6.2.2 CSP and WLCSP
      6.2.3 Flip-Chip
   6.3 Market Attractiveness Analysis by Applications

Chapter 7 Global IC Packaging Solder Ball Market Analysis and Forecast by Region
   7.1 Introduction
      7.1.1 Key Market Trends & Growth Opportunities by Region
      7.1.2 Basis Point Share (BPS) Analysis by Region
      7.1.3 Absolute $ Opportunity Assessment by Region
   7.2 IC Packaging Solder Ball Market Size Forecast by Region
      7.2.1 North America
      7.2.2 Europe
      7.2.3 Asia Pacific
      7.2.4 Latin America
      7.2.5 Middle East & Africa (MEA)
   7.3 Market Attractiveness Analysis by Region

Chapter 8 Coronavirus Disease (COVID-19) Impact 
   8.1 Introduction 
   8.2 Current & Future Impact Analysis 
   8.3 Economic Impact Analysis 
   8.4 Government Policies 
   8.5 Investment Scenario

Chapter 9 North America IC Packaging Solder Ball Analysis and Forecast
   9.1 Introduction
   9.2 North America IC Packaging Solder Ball Market Size Forecast by Country
      9.2.1 U.S.
      9.2.2 Canada
   9.3 Basis Point Share (BPS) Analysis by Country
   9.4 Absolute $ Opportunity Assessment by Country
   9.5 Market Attractiveness Analysis by Country
   9.6 North America IC Packaging Solder Ball Market Size Forecast by Type
      9.6.1 Up to 0.2 mm
      9.6.2 0.2-0.5 mm
      9.6.3 Above 0.5 mm
   9.7 Basis Point Share (BPS) Analysis by Type 
   9.8 Absolute $ Opportunity Assessment by Type 
   9.9 Market Attractiveness Analysis by Type
   9.10 North America IC Packaging Solder Ball Market Size Forecast by Applications
      9.10.1 BGA
      9.10.2 CSP and WLCSP
      9.10.3 Flip-Chip
   9.11 Basis Point Share (BPS) Analysis by Applications 
   9.12 Absolute $ Opportunity Assessment by Applications 
   9.13 Market Attractiveness Analysis by Applications

Chapter 10 Europe IC Packaging Solder Ball Analysis and Forecast
   10.1 Introduction
   10.2 Europe IC Packaging Solder Ball Market Size Forecast by Country
      10.2.1 Germany
      10.2.2 France
      10.2.3 Italy
      10.2.4 U.K.
      10.2.5 Spain
      10.2.6 Russia
      10.2.7 Rest of Europe
   10.3 Basis Point Share (BPS) Analysis by Country
   10.4 Absolute $ Opportunity Assessment by Country
   10.5 Market Attractiveness Analysis by Country
   10.6 Europe IC Packaging Solder Ball Market Size Forecast by Type
      10.6.1 Up to 0.2 mm
      10.6.2 0.2-0.5 mm
      10.6.3 Above 0.5 mm
   10.7 Basis Point Share (BPS) Analysis by Type 
   10.8 Absolute $ Opportunity Assessment by Type 
   10.9 Market Attractiveness Analysis by Type
   10.10 Europe IC Packaging Solder Ball Market Size Forecast by Applications
      10.10.1 BGA
      10.10.2 CSP and WLCSP
      10.10.3 Flip-Chip
   10.11 Basis Point Share (BPS) Analysis by Applications 
   10.12 Absolute $ Opportunity Assessment by Applications 
   10.13 Market Attractiveness Analysis by Applications

Chapter 11 Asia Pacific IC Packaging Solder Ball Analysis and Forecast
   11.1 Introduction
   11.2 Asia Pacific IC Packaging Solder Ball Market Size Forecast by Country
      11.2.1 China
      11.2.2 Japan
      11.2.3 South Korea
      11.2.4 India
      11.2.5 Australia
      11.2.6 South East Asia (SEA)
      11.2.7 Rest of Asia Pacific (APAC)
   11.3 Basis Point Share (BPS) Analysis by Country
   11.4 Absolute $ Opportunity Assessment by Country
   11.5 Market Attractiveness Analysis by Country
   11.6 Asia Pacific IC Packaging Solder Ball Market Size Forecast by Type
      11.6.1 Up to 0.2 mm
      11.6.2 0.2-0.5 mm
      11.6.3 Above 0.5 mm
   11.7 Basis Point Share (BPS) Analysis by Type 
   11.8 Absolute $ Opportunity Assessment by Type 
   11.9 Market Attractiveness Analysis by Type
   11.10 Asia Pacific IC Packaging Solder Ball Market Size Forecast by Applications
      11.10.1 BGA
      11.10.2 CSP and WLCSP
      11.10.3 Flip-Chip
   11.11 Basis Point Share (BPS) Analysis by Applications 
   11.12 Absolute $ Opportunity Assessment by Applications 
   11.13 Market Attractiveness Analysis by Applications

Chapter 12 Latin America IC Packaging Solder Ball Analysis and Forecast
   12.1 Introduction
   12.2 Latin America IC Packaging Solder Ball Market Size Forecast by Country
      12.2.1 Brazil
      12.2.2 Mexico
      12.2.3 Rest of Latin America (LATAM)
   12.3 Basis Point Share (BPS) Analysis by Country
   12.4 Absolute $ Opportunity Assessment by Country
   12.5 Market Attractiveness Analysis by Country
   12.6 Latin America IC Packaging Solder Ball Market Size Forecast by Type
      12.6.1 Up to 0.2 mm
      12.6.2 0.2-0.5 mm
      12.6.3 Above 0.5 mm
   12.7 Basis Point Share (BPS) Analysis by Type 
   12.8 Absolute $ Opportunity Assessment by Type 
   12.9 Market Attractiveness Analysis by Type
   12.10 Latin America IC Packaging Solder Ball Market Size Forecast by Applications
      12.10.1 BGA
      12.10.2 CSP and WLCSP
      12.10.3 Flip-Chip
   12.11 Basis Point Share (BPS) Analysis by Applications 
   12.12 Absolute $ Opportunity Assessment by Applications 
   12.13 Market Attractiveness Analysis by Applications

Chapter 13 Middle East & Africa (MEA) IC Packaging Solder Ball Analysis and Forecast
   13.1 Introduction
   13.2 Middle East & Africa (MEA) IC Packaging Solder Ball Market Size Forecast by Country
      13.2.1 Saudi Arabia
      13.2.2 South Africa
      13.2.3 UAE
      13.2.4 Rest of Middle East & Africa (MEA)
   13.3 Basis Point Share (BPS) Analysis by Country
   13.4 Absolute $ Opportunity Assessment by Country
   13.5 Market Attractiveness Analysis by Country
   13.6 Middle East & Africa (MEA) IC Packaging Solder Ball Market Size Forecast by Type
      13.6.1 Up to 0.2 mm
      13.6.2 0.2-0.5 mm
      13.6.3 Above 0.5 mm
   13.7 Basis Point Share (BPS) Analysis by Type 
   13.8 Absolute $ Opportunity Assessment by Type 
   13.9 Market Attractiveness Analysis by Type
   13.10 Middle East & Africa (MEA) IC Packaging Solder Ball Market Size Forecast by Applications
      13.10.1 BGA
      13.10.2 CSP and WLCSP
      13.10.3 Flip-Chip
   13.11 Basis Point Share (BPS) Analysis by Applications 
   13.12 Absolute $ Opportunity Assessment by Applications 
   13.13 Market Attractiveness Analysis by Applications

Chapter 14 Competition Landscape 
   14.1 IC Packaging Solder Ball Market: Competitive Dashboard
   14.2 Global IC Packaging Solder Ball Market: Market Share Analysis, 2019
   14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.3.1 Senju Metal
      14.3.2 Accurus
      14.3.3 DS HiMetal
      14.3.4 NMC
      14.3.5 MKE
      14.3.6 PMTC
      14.3.7 Indium Corporation
      14.3.8 YCTC
      14.3.9 Shenmao Technology
      14.3.10 Shanghai hiking solder material
      14.3.11 Senju Metal

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