Market Overview:
The global IC socket market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for consumer electronics and automotive applications. Additionally, the rising demand for specialty sockets in medical and defense applications is also contributing to the growth of the market. North America dominates the global IC socket market, followed by Europe and Asia Pacific. However, Asia Pacific is expected to witness highest growth during the forecast period owing to increasing demand from countries such as China and India.
Product Definition:
An IC socket is a connector that holds integrated circuits (ICs) in place, while they are being soldered to a printed circuit board. IC sockets come in two main varieties: through-hole and surface-mount.
Dual-in-line Memory Module Sockets:
The global Dual-in-line Memory Module (DIMM) sockets market size was valued at USD 1.5 billion in 2015 and is expected to grow at a CAGR of XX% over the forecast period. The increasing demand for high capacity memory modules along with the growing popularity of multi-core processors are anticipated to drive industry growth over the next seven years.
Production Sockets:
Production sockets are used to mount electronic components such as IC's,QFP, and QTP. They have a high demand in the electronics industry due to their ability to provide secure mounting and improved handling of fragile electronic parts. Production sockets are available in different types such as plastic, aluminum alloys and steel among others. The material type is selected based on the application for which they are being manufactured.
Application Insights:
The global IC socket market has been segmented on the basis of application into consumer electronics, automotive, defense and medical. The consumer electronics segment accounted for a major share in 2016 owing to increasing demand for semiconductors in smartphones and other gadgets. Moreover, rapid growth of IoT is further expected to drive the demand over the forecast period.
Automotive is another significant application sector where IC sockets are widely used as they offer enhanced heat dissipation capabilities which help keep automobile components cool during extreme summer or winter temperatures respectively. These sockets also ensure reliable connectivity between electronic systems in vehicles ensuring safety & security along with ease of installation & removal which further boosts their usage across various vehicle components such as infotainment systems, HVAC (heating/ventilation/air conditioning), lighting system among others.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to increasing demand for electronic products, such as mobile phones, laptops, personal computers (PC), consumer electronics devices including LED/LCD monitors and digital cameras among others.
The Asia Pacific region is home to several leading semiconductor manufacturers such as Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics Co., Ltd., Micron Technology Inc., Infineon Technologies AG among others. These companies are actively involved in manufacturing high-end integrated circuits (ICs) based on advanced technologies for various applications across different end-use industries thereby driving the regional market growth.
Europe accounted for a significant share of revenue in 2017 owing to growing demand from major application sectors including computing & mobile communication, automotive electronics & lighting controls, industrial automation etc.; especially from countries like Germany and U.K.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Proliferation of portable electronics and wearable devices
- Growing trend of Internet of Things (IoT) and connected devices
- Rising demand for advanced semiconductor packaging technologies
- Emergence of next-generation data centers
Scope Of The Report
Report Attributes
Report Details
Report Title
IC Socket Market Research Report
By Type
Dual-in-line Memory Module Sockets, Production Sockets, Test and Burn-in Sockets, Dual-in-line Package, Specialty Sockets
By Application
Consumer Electronics, Automotive, Defense, Medical, Other
By Companies
M, Aries Electronics, Chupond Precision, Enplas, WinWay, Foxconn Technology, Johnstech, Loranger, Mill-Max, Molex, M, Sensata Technologies, TE Connectivity, Yamaichi Electronics
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
232
Number of Tables & Figures
163
Customization Available
Yes, the report can be customized as per your need.
Global IC Socket Market Report Segments:
The global IC Socket market is segmented on the basis of:
Types
Dual-in-line Memory Module Sockets, Production Sockets, Test and Burn-in Sockets, Dual-in-line Package, Specialty Sockets
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Automotive, Defense, Medical, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- M
- Aries Electronics
- Chupond Precision
- Enplas
- WinWay
- Foxconn Technology
- Johnstech
- Loranger
- Mill-Max
- Molex
- M
- Sensata Technologies
- TE Connectivity
- Yamaichi Electronics
Highlights of The IC Socket Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Dual-in-line Memory Module Sockets
- Production Sockets
- Test and Burn-in Sockets
- Dual-in-line Package
- Specialty Sockets
- By Application:
- Consumer Electronics
- Automotive
- Defense
- Medical
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the IC Socket Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
IC Socket is an interface connector that allows devices to be connected together. It is a type of socket used in electronic equipment, typically for connecting chips on printed circuit boards.
Some of the major companies in the ic socket market are M, Aries Electronics, Chupond Precision, Enplas, WinWay, Foxconn Technology, Johnstech, Loranger, Mill-Max, Molex, M, Sensata Technologies, TE Connectivity, Yamaichi Electronics.
The ic socket market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 IC Socket Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 IC Socket Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 IC Socket Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the IC Socket Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global IC Socket Market Size & Forecast, 2020-2028
4.5.1 IC Socket Market Size and Y-o-Y Growth
4.5.2 IC Socket Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Dual-in-line Memory Module Sockets
5.2.2 Production Sockets
5.2.3 Test and Burn-in Sockets
5.2.4 Dual-in-line Package
5.2.5 Specialty Sockets
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Automotive
6.2.3 Defense
6.2.4 Medical
6.2.5 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global IC Socket Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 IC Socket Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Dual-in-line Memory Module Sockets
9.6.2 Production Sockets
9.6.3 Test and Burn-in Sockets
9.6.4 Dual-in-line Package
9.6.5 Specialty Sockets
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Automotive
9.10.3 Defense
9.10.4 Medical
9.10.5 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Dual-in-line Memory Module Sockets
10.6.2 Production Sockets
10.6.3 Test and Burn-in Sockets
10.6.4 Dual-in-line Package
10.6.5 Specialty Sockets
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Automotive
10.10.3 Defense
10.10.4 Medical
10.10.5 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Dual-in-line Memory Module Sockets
11.6.2 Production Sockets
11.6.3 Test and Burn-in Sockets
11.6.4 Dual-in-line Package
11.6.5 Specialty Sockets
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Automotive
11.10.3 Defense
11.10.4 Medical
11.10.5 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Dual-in-line Memory Module Sockets
12.6.2 Production Sockets
12.6.3 Test and Burn-in Sockets
12.6.4 Dual-in-line Package
12.6.5 Specialty Sockets
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Automotive
12.10.3 Defense
12.10.4 Medical
12.10.5 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Dual-in-line Memory Module Sockets
13.6.2 Production Sockets
13.6.3 Test and Burn-in Sockets
13.6.4 Dual-in-line Package
13.6.5 Specialty Sockets
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Automotive
13.10.3 Defense
13.10.4 Medical
13.10.5 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 IC Socket Market: Competitive Dashboard
14.2 Global IC Socket Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 M
14.3.2 Aries Electronics
14.3.3 Chupond Precision
14.3.4 Enplas
14.3.5 WinWay
14.3.6 Foxconn Technology
14.3.7 Johnstech
14.3.8 Loranger
14.3.9 Mill-Max
14.3.10 Molex
14.3.11 M
14.3.12 Sensata Technologies
14.3.13 TE Connectivity
14.3.14 Yamaichi Electronics
