Market Overview:
The global IGBT module packages market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for electric and hybrid electric vehicles, rising investments in renewable energy sources, and growing adoption of smart grid technologies. Based on type, the global IGBT module packages market is segmented into 4 500V segments.
Product Definition:
An IGBT module package is a collection of one or more IGBTs, together with the necessary insulation, terminals, and other components, assembled and tested as a unit. The package provides an easy means of incorporating multiple IGBTs into a larger system.
400 V is the maximum voltage that can be sustained by a silicon-based semiconductor device. The IGBT modules are used in high power electronic devices such as electric vehicles (EV), utility scale power plants, and data centers among others. High power electronics require short switching times, low noise levels, and efficient heat dissipation.
IGBT modules are specially designed to meet these requirements owing to their enhanced thermal management capabilities.
600–650 V:
600-650V IGBT module packages are designed for use in high voltage power supplies. They provide higher efficiency, reliability and lower cost of ownership as compared to other switching power supply solutions. 600- 650V IGBT modules are used in wide range of applications such as data centers, electric vehicles (EV), utility transmission and distribution systems etc.
Application Insights:
The track traction system segment is projected to account for the highest market share over the forecast period owing to its increasing use in railway systems, such as rapid transit and light rail. The motion transfer system segment is also expected to witness significant growth during the study period owing to its rising adoption in industrial applications, such as machine tools and assembly lines.
The power system application segment accounted for a considerable market share of more than 20% in 2017. IGBT modules are widely used across various power systems applications, including utility grade HVAC & UPS; renewable energy; large scale wind turbines; small scale hydroelectricity; large-scale solar PV & thermal storage.; medium-scale nuclear fission & fusion reactors.; consumer electronics products., Other applications include medical equipment., etc.
Regional Analysis:
Asia Pacific region accounted for the largest market share in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to increasing demand from emerging economies, such as China and India. Increasing investments by governments of developing countries are also contributing towards market growth. For instance, in 2015, China announced a USD X billion investment plan for power generation through renewable energy sources by 2020.
Europe is projected to witness significant growth during the forecast years on account of rising adoption of IGBTs across industries including consumer electronics products, industrial applications such as traction systems.
Growth Factors:
- Increasing demand for energy-efficient electrical equipment
- Growing popularity of electric vehicles
- Proliferation of smart grids and renewable energy sources
- Rising investment in industrial automation
- Growing trend of miniaturization in electronics
Scope Of The Report
Report Attributes
Report Details
Report Title
IGBT Module Packages Market Research Report
By Type
<400 V, 600–650 V, 1,200–1,700 V, 2,500–3,300 V, >4,500 V
By Application
Motion Transfer System, Power System, Track Traction System, Electric and Hybrid Electric Vehicles, Consumer Electronics Products, Other
By Companies
Infineon Technologies AG, Fuji Electric, ON Semiconductor, Mitsubishi Electric Corporation, STMicroelectronics, Renesas Electronics Corporation, Vishay Intertechnology, ABB Ltd
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
228
Number of Tables & Figures
160
Customization Available
Yes, the report can be customized as per your need.
Global IGBT Module Packages Market Report Segments:
The global IGBT Module Packages market is segmented on the basis of:
Types
<400 V, 600–650 V, 1,200–1,700 V, 2,500–3,300 V, >4,500 V
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Motion Transfer System, Power System, Track Traction System, Electric and Hybrid Electric Vehicles, Consumer Electronics Products, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Infineon Technologies AG
- Fuji Electric
- ON Semiconductor
- Mitsubishi Electric Corporation
- STMicroelectronics
- Renesas Electronics Corporation
- Vishay Intertechnology
- ABB Ltd
Highlights of The IGBT Module Packages Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- <400 V
- 600–650 V
- 1,200–1,700 V
- 2,500–3,300 V
- >4,500 V
- By Application:
- Motion Transfer System
- Power System
- Track Traction System
- Electric and Hybrid Electric Vehicles
- Consumer Electronics Products
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the IGBT Module Packages Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
IGBT module packages are a way to bundle together multiple IGBTs into a single package. This allows for easier installation and better thermal management.
Some of the key players operating in the igbt module packages market are Infineon Technologies AG, Fuji Electric, ON Semiconductor, Mitsubishi Electric Corporation, STMicroelectronics, Renesas Electronics Corporation, Vishay Intertechnology, ABB Ltd.
The igbt module packages market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 IGBT Module Packages Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 IGBT Module Packages Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 IGBT Module Packages Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the IGBT Module Packages Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global IGBT Module Packages Market Size & Forecast, 2020-2028
4.5.1 IGBT Module Packages Market Size and Y-o-Y Growth
4.5.2 IGBT Module Packages Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 <400 V
5.2.2 600–650 V
5.2.3 1
5.2.4 200–1
5.2.5 700 V
5.2.6 2
5.2.7 500–3
5.2.8 300 V
5.2.9 >4
5.2.10 500 V
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Motion Transfer System
6.2.2 Power System
6.2.3 Track Traction System
6.2.4 Electric and Hybrid Electric Vehicles
6.2.5 Consumer Electronics Products
6.2.6 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global IGBT Module Packages Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 IGBT Module Packages Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 <400 V
9.6.2 600–650 V
9.6.3 1
9.6.4 200–1
9.6.5 700 V
9.6.6 2
9.6.7 500–3
9.6.8 300 V
9.6.9 >4
9.6.10 500 V
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Motion Transfer System
9.10.2 Power System
9.10.3 Track Traction System
9.10.4 Electric and Hybrid Electric Vehicles
9.10.5 Consumer Electronics Products
9.10.6 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 <400 V
10.6.2 600–650 V
10.6.3 1
10.6.4 200–1
10.6.5 700 V
10.6.6 2
10.6.7 500–3
10.6.8 300 V
10.6.9 >4
10.6.10 500 V
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Motion Transfer System
10.10.2 Power System
10.10.3 Track Traction System
10.10.4 Electric and Hybrid Electric Vehicles
10.10.5 Consumer Electronics Products
10.10.6 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 <400 V
11.6.2 600–650 V
11.6.3 1
11.6.4 200–1
11.6.5 700 V
11.6.6 2
11.6.7 500–3
11.6.8 300 V
11.6.9 >4
11.6.10 500 V
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Motion Transfer System
11.10.2 Power System
11.10.3 Track Traction System
11.10.4 Electric and Hybrid Electric Vehicles
11.10.5 Consumer Electronics Products
11.10.6 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 <400 V
12.6.2 600–650 V
12.6.3 1
12.6.4 200–1
12.6.5 700 V
12.6.6 2
12.6.7 500–3
12.6.8 300 V
12.6.9 >4
12.6.10 500 V
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Motion Transfer System
12.10.2 Power System
12.10.3 Track Traction System
12.10.4 Electric and Hybrid Electric Vehicles
12.10.5 Consumer Electronics Products
12.10.6 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 <400 V
13.6.2 600–650 V
13.6.3 1
13.6.4 200–1
13.6.5 700 V
13.6.6 2
13.6.7 500–3
13.6.8 300 V
13.6.9 >4
13.6.10 500 V
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Motion Transfer System
13.10.2 Power System
13.10.3 Track Traction System
13.10.4 Electric and Hybrid Electric Vehicles
13.10.5 Consumer Electronics Products
13.10.6 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 IGBT Module Packages Market: Competitive Dashboard
14.2 Global IGBT Module Packages Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Infineon Technologies AG
14.3.2 Fuji Electric
14.3.3 ON Semiconductor
14.3.4 Mitsubishi Electric Corporation
14.3.5 STMicroelectronics
14.3.6 Renesas Electronics Corporation
14.3.7 Vishay Intertechnology
14.3.8 ABB Ltd
