Market Overview:
The global in-based solder preform market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth of the market can be attributed to the increasing demand for miniaturization and higher performance in electronic devices, rising demand for lead-free solders, and growing adoption of solder preforms in medical applications. However, the high cost of solder preforms may restrain the growth of the market during the forecast period. On the basis of type, the global in-based solder preform market is segmented into lead free and leaded. The lead free segment is expected to grow at a CAGR of 6% from 2018 to 2030 due to stringent environmental regulations regarding use of lead-containing materials across various regions worldwide.
Product Definition:
In-based solder preforms are small, disk-shaped pieces of solder that have been placed onto a substrate. They are used to attach electronic components to a circuit board. In-based solder preforms are important because they provide a strong, reliable connection between the component and the circuit board.
Lead Free:
The global lead-free solder preform market size was valued at USD 1.5 billion in 2015 and is expected to grow at a CAGR of XX% over the forecast period on account of its increasing demand from electronics industry for mass production of electronic products such as mobile phones, computers, and tablets. The growing need for environment friendly products is anticipated to drive the market growth over the forecast period.
Leaded:
Leaded solder is one of the major components in electronic devices. It helps in providing reliable electrical connections between two or more printed circuit boards (PCB). The industry is expected to witness significant growth owing to its increasing usage across various applications such as industrial electronics, consumer electronics, and telecommunication equipment.
Application Insights:
The electronics segment accounted for the largest revenue share in 2017 and is anticipated to continue its dominance over the forecast period. The growth can be attributed to increasing demand for electronic devices across the globe. In addition, technological advancements and innovations in solder preforms are expected to drive their demand further. For instance, introduction of advanced materials such as Sn¢â‚¬â„¢Pb solder with superior thermal shock resistance is expected to drive product demand in Electronics application segment over the forecast period.
In terms of revenue, North America market for solder preform was valued at USD 159.5 million in 2017.
Regional Analysis:
Asia Pacific dominated the global in-based solder preform market and accounted for over 45% of the total revenue share in 2017. The region is expected to continue its dominance over the forecast period as well, owing to increasing demand from end-use industries such as electronics, medical and military & aerospace. China is estimated to be one of the major contributors towards regional growth owing to its large population base coupled with a high rate of industrialization and modernization.
The Asia Pacific has been witnessing strong economic growth on account of rising foreign investments along with government initiatives encouraging FDI under automatic route (DRIP). This has resulted in an increase in production activities across various application sectors such as semiconductors, electronics among others which will drive product demand further. In addition, rapid urbanization coupled with growing consumer disposable income levels will also contribute towards regional growth during the forecast period.
Growth Factors:
- Increasing demand from the electronics and semiconductor industry for miniaturization of devices is expected to drive the market growth.
- Rising demand for advanced packaging technologies, such as 3D ICs and 2.5D packaging, is also anticipated to fuel the market growth over the forecast period.
- Growing trend of using lead-free solder alloys is projected to boost the in-based solder preform market over the next few years.
Scope Of The Report
Report Attributes
Report Details
Report Title
In-based Solder Preform Market Research Report
By Type
Lead Free, Leaded
By Application
Military & Aerospace, Medical, Semiconductor, Electronics, Other
By Companies
SMIC, Harris Products, AIM, Nihon Superior, Fromosol, Guangzhou Xianyi, SMIC
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
218
Number of Tables & Figures
153
Customization Available
Yes, the report can be customized as per your need.
Global In-based Solder Preform Market Report Segments:
The global In-based Solder Preform market is segmented on the basis of:
Types
Lead Free, Leaded
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Military & Aerospace, Medical, Semiconductor, Electronics, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- SMIC
- Harris Products
- AIM
- Nihon Superior
- Fromosol
- Guangzhou Xianyi
- SMIC
Highlights of The In-based Solder Preform Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Lead Free
- Leaded
- By Application:
- Military & Aerospace
- Medical
- Semiconductor
- Electronics
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the In-based Solder Preform Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
In-based solder preforms are a type of solder paste that is made from tin and lead. They are often used in electronic assembly because they have a low melting point, which makes them easy to work with.
Some of the major companies in the in-based solder preform market are SMIC, Harris Products, AIM, Nihon Superior, Fromosol, Guangzhou Xianyi, SMIC.
The in-based solder preform market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 In-based Solder Preform Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 In-based Solder Preform Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 In-based Solder Preform Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the In-based Solder Preform Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global In-based Solder Preform Market Size & Forecast, 2018-2028
4.5.1 In-based Solder Preform Market Size and Y-o-Y Growth
4.5.2 In-based Solder Preform Market Absolute $ Opportunity
Chapter 5 Global In-based Solder Preform Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 In-based Solder Preform Market Size Forecast by Type
5.2.1 Lead Free
5.2.2 Leaded
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global In-based Solder Preform Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 In-based Solder Preform Market Size Forecast by Applications
6.2.1 Military & Aerospace
6.2.2 Medical
6.2.3 Semiconductor
6.2.4 Electronics
6.2.5 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global In-based Solder Preform Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 In-based Solder Preform Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America In-based Solder Preform Analysis and Forecast
9.1 Introduction
9.2 North America In-based Solder Preform Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America In-based Solder Preform Market Size Forecast by Type
9.6.1 Lead Free
9.6.2 Leaded
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America In-based Solder Preform Market Size Forecast by Applications
9.10.1 Military & Aerospace
9.10.2 Medical
9.10.3 Semiconductor
9.10.4 Electronics
9.10.5 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe In-based Solder Preform Analysis and Forecast
10.1 Introduction
10.2 Europe In-based Solder Preform Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe In-based Solder Preform Market Size Forecast by Type
10.6.1 Lead Free
10.6.2 Leaded
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe In-based Solder Preform Market Size Forecast by Applications
10.10.1 Military & Aerospace
10.10.2 Medical
10.10.3 Semiconductor
10.10.4 Electronics
10.10.5 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific In-based Solder Preform Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific In-based Solder Preform Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific In-based Solder Preform Market Size Forecast by Type
11.6.1 Lead Free
11.6.2 Leaded
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific In-based Solder Preform Market Size Forecast by Applications
11.10.1 Military & Aerospace
11.10.2 Medical
11.10.3 Semiconductor
11.10.4 Electronics
11.10.5 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America In-based Solder Preform Analysis and Forecast
12.1 Introduction
12.2 Latin America In-based Solder Preform Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America In-based Solder Preform Market Size Forecast by Type
12.6.1 Lead Free
12.6.2 Leaded
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America In-based Solder Preform Market Size Forecast by Applications
12.10.1 Military & Aerospace
12.10.2 Medical
12.10.3 Semiconductor
12.10.4 Electronics
12.10.5 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) In-based Solder Preform Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) In-based Solder Preform Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) In-based Solder Preform Market Size Forecast by Type
13.6.1 Lead Free
13.6.2 Leaded
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) In-based Solder Preform Market Size Forecast by Applications
13.10.1 Military & Aerospace
13.10.2 Medical
13.10.3 Semiconductor
13.10.4 Electronics
13.10.5 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 In-based Solder Preform Market: Competitive Dashboard
14.2 Global In-based Solder Preform Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 SMIC
14.3.2 Harris Products
14.3.3 AIM
14.3.4 Nihon Superior
14.3.5 Fromosol
14.3.6 Guangzhou Xianyi
14.3.7 SMIC
