Market Overview:
The global in-line 3D solder paste inspection equipment market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth of this market can be attributed to the increasing demand for 3D solder paste inspection equipment from the automotive electronics, consumer electronics, and industrial sectors. Additionally, the growing demand for miniaturized and high-density electronic devices is also contributing to the growth of this market. On the basis of type, laser-based 3D solder paste inspection equipment held a major share of the global in-line 3D solder paste inspection equipment market in 2017. This segment is expected to continue its dominance during the forecast period owing to its advantages such as high accuracy and speed over other types of 3D solder paste inspection equipments such as PMP-based systems.
Product Definition:
In-line 3D Solder Paste Inspection Equipment is a type of equipment that is used to inspect the quality of solder paste. This equipment uses lasers or other types of sensors to create a three-dimensional image of the solder paste on a printed circuit board. This image can then be used to determine if there are any defects in the solder paste. In-line 3D Solder Paste Inspection Equipment is important because it can help ensure that all boards have an adequate amount of solder paste and that there are no defects in the solder paste.
Laser-based 3D Solder Paste Inspection Equipment:
The global laser-based 3D solder paste inspection equipment market size was valued at USD 6.5 million in 2016 and is expected to grow at a CAGR of XX% over the forecast period.
PMP-based 3D Solder Paste Inspection Equipment:
The global PMP-based 3D solder paste inspection equipment market size was valued at USD 31.5 million in 2016 and is expected to grow at a CAGR of XX% over the forecast period. The growth can be attributed to the increasing demand for high volume, low-cost manufacturing processes from various end-use industries such as automotive, electronics & semiconductor, construction machinery and heavy equipment manufacturers among others.
Application Insights:
The automotive electronics segment accounted for the largest market share in 2017 and is projected to expand at a CAGR of XX% from 2018 to 2030. The growth can be attributed to the increasing demand for electronic devices in automobiles, which are increasingly using PCB as a substrate owing to its low cost and high durability. In addition, growing concerns regarding product quality coupled with technological advancements are expected to drive the segment further.
3D solder paste inspection equipment is used during manufacturing processes such as component assembly, PCB lamination or coating, wire wrapping & bundling on printed circuit boards (PCB), multi-layer board (MLB) assembly & panel beating for inspecting solder joints before they are packaged or shipped out of production facilities. These machines help eliminate human errors during manufacturing by providing accurate Solder Joint Inspection (SJI).
In addition, these solutions provide efficient inspection results within seconds that enable users make better decisions about finished products quality resulting in improved productivity.
Regional Analysis:
Asia Pacific dominated the global in-line 3D solder paste inspection equipment market in 2016 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing production and consumption of electronic products, especially in China, India, South Korea, Taiwan among other Asian countries. Asia Pacific has been witnessing a significant increase in demand for consumer electronics such as smartphones and laptops among consumers worldwide owing to rising disposable income coupled with growing population particularly in China & India. This trend is projected to drive the regional market further.
The automotive industry is one of the major industries that heavily rely on electronics components for proper functioning of vehicles which are manufactured by various companies including Daimler AG; Ford Motor Company; General Motors Company; Hyundai Motor Company Ltd.; Nissan Motor Corporation etc.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand for high-reliability and high-quality products
- Growing popularity of 3D printing technology
- Proliferation of advanced packaging technologies
- Increasing number of counterfeit components in the supply chain
Scope Of The Report
Report Attributes
Report Details
Report Title
In-line 3D Solder Paste Inspection Equipment Market Research Report
By Type
Laser-based 3D Solder Paste Inspection Equipment, PMP-based 3D Solder Paste Inspection Equipment
By Application
Automotive Electronics, Consumer Electronics, Industrials, Others
By Companies
Koh Young, CyberOptics Corporation, Test Research, Inc (TRI), MirTec Ltd, PARMI Corp, Viscom AG, ViTrox, Vi TECHNOLOGY, Mek (Marantz Electronics), Pemtron, Koh Young, Nordson YESTECH, Omron Corporation, Goepel Electronic, Machine Vision Products (MVP), Caltex Scientific, ASC International, Sinic-Tek Vision Technology, Shenzhen JT Automation Equipment, Jet Technology
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
203
Number of Tables & Figures
143
Customization Available
Yes, the report can be customized as per your need.
Global In-line 3D Solder Paste Inspection Equipment Market Report Segments:
The global In-line 3D Solder Paste Inspection Equipment market is segmented on the basis of:
Types
Laser-based 3D Solder Paste Inspection Equipment, PMP-based 3D Solder Paste Inspection Equipment
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotive Electronics, Consumer Electronics, Industrials, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Koh Young
- CyberOptics Corporation
- Test Research, Inc (TRI)
- MirTec Ltd
- PARMI Corp
- Viscom AG
- ViTrox
- Vi TECHNOLOGY
- Mek (Marantz Electronics)
- Pemtron
- Koh Young
- Nordson YESTECH
- Omron Corporation
- Goepel Electronic
- Machine Vision Products (MVP)
- Caltex Scientific
- ASC International
- Sinic-Tek Vision Technology
- Shenzhen JT Automation Equipment
- Jet Technology
Highlights of The In-line 3D Solder Paste Inspection Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Laser-based 3D Solder Paste Inspection Equipment
- PMP-based 3D Solder Paste Inspection Equipment
- By Application:
- Automotive Electronics
- Consumer Electronics
- Industrials
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the In-line 3D Solder Paste Inspection Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
In-line 3D solder paste inspection equipment is a type of inspection equipment that uses an infrared camera to inspect the surface of a component for defects such as voids, cracks, and warping.
Some of the key players operating in the in-line 3d solder paste inspection equipment market are Koh Young, CyberOptics Corporation, Test Research, Inc (TRI), MirTec Ltd, PARMI Corp, Viscom AG, ViTrox, Vi TECHNOLOGY, Mek (Marantz Electronics), Pemtron, Koh Young, Nordson YESTECH, Omron Corporation, Goepel Electronic, Machine Vision Products (MVP), Caltex Scientific, ASC International, Sinic-Tek Vision Technology, Shenzhen JT Automation Equipment, Jet Technology.
The in-line 3d solder paste inspection equipment market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 In-line 3D Solder Paste Inspection Equipment Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 In-line 3D Solder Paste Inspection Equipment Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 In-line 3D Solder Paste Inspection Equipment Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the In-line 3D Solder Paste Inspection Equipment Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global In-line 3D Solder Paste Inspection Equipment Market Size & Forecast, 2018-2028
4.5.1 In-line 3D Solder Paste Inspection Equipment Market Size and Y-o-Y Growth
4.5.2 In-line 3D Solder Paste Inspection Equipment Market Absolute $ Opportunity
Chapter 5 Global In-line 3D Solder Paste Inspection Equipment Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Type
5.2.1 Laser-based 3D Solder Paste Inspection Equipment
5.2.2 PMP-based 3D Solder Paste Inspection Equipment
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global In-line 3D Solder Paste Inspection Equipment Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Applications
6.2.1 Automotive Electronics
6.2.2 Consumer Electronics
6.2.3 Industrials
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global In-line 3D Solder Paste Inspection Equipment Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America In-line 3D Solder Paste Inspection Equipment Analysis and Forecast
9.1 Introduction
9.2 North America In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Type
9.6.1 Laser-based 3D Solder Paste Inspection Equipment
9.6.2 PMP-based 3D Solder Paste Inspection Equipment
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Applications
9.10.1 Automotive Electronics
9.10.2 Consumer Electronics
9.10.3 Industrials
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe In-line 3D Solder Paste Inspection Equipment Analysis and Forecast
10.1 Introduction
10.2 Europe In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Type
10.6.1 Laser-based 3D Solder Paste Inspection Equipment
10.6.2 PMP-based 3D Solder Paste Inspection Equipment
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Applications
10.10.1 Automotive Electronics
10.10.2 Consumer Electronics
10.10.3 Industrials
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific In-line 3D Solder Paste Inspection Equipment Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Type
11.6.1 Laser-based 3D Solder Paste Inspection Equipment
11.6.2 PMP-based 3D Solder Paste Inspection Equipment
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Applications
11.10.1 Automotive Electronics
11.10.2 Consumer Electronics
11.10.3 Industrials
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America In-line 3D Solder Paste Inspection Equipment Analysis and Forecast
12.1 Introduction
12.2 Latin America In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Type
12.6.1 Laser-based 3D Solder Paste Inspection Equipment
12.6.2 PMP-based 3D Solder Paste Inspection Equipment
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Applications
12.10.1 Automotive Electronics
12.10.2 Consumer Electronics
12.10.3 Industrials
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) In-line 3D Solder Paste Inspection Equipment Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Type
13.6.1 Laser-based 3D Solder Paste Inspection Equipment
13.6.2 PMP-based 3D Solder Paste Inspection Equipment
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) In-line 3D Solder Paste Inspection Equipment Market Size Forecast by Applications
13.10.1 Automotive Electronics
13.10.2 Consumer Electronics
13.10.3 Industrials
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 In-line 3D Solder Paste Inspection Equipment Market: Competitive Dashboard
14.2 Global In-line 3D Solder Paste Inspection Equipment Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Koh Young
14.3.2 CyberOptics Corporation
14.3.3 Test Research, Inc (TRI)
14.3.4 MirTec Ltd
14.3.5 PARMI Corp
14.3.6 Viscom AG
14.3.7 ViTrox
14.3.8 Vi TECHNOLOGY
14.3.9 Mek (Marantz Electronics)
14.3.10 Pemtron
14.3.11 Koh Young
14.3.12 Nordson YESTECH
14.3.13 Omron Corporation
14.3.14 Goepel Electronic
14.3.15 Machine Vision Products (MVP)
14.3.16 Caltex Scientific
14.3.17 ASC International
14.3.18 Sinic-Tek Vision Technology
14.3.19 Shenzhen JT Automation Equipment
14.3.20 Jet Technology
