Market Overview:
The global interface modules market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for advanced communication and industrial applications, and the growing trend of miniaturization in consumer electronics products. Based on type, the global interface modules market can be segmented into USB interface ICs, PCI (PCIe) interface ICs, SATA interface ICs, and others. The USB interface IC segment is expected to account for the largest share of the global market in 2018 owing to its widespread use in consumer electronics products such as smartphones and tablets. Based on application, the global market can be divided into communication applications, industrial applications healthcare applications ,consumer electronic applications automotive applications ,and others .
Product Definition:
Interface Modules are used to provide a standard way for different software components to communicate with each other. Interface modules allow different software components to exchange data in a consistent way, regardless of the underlying implementation. This helps make it easier to develop and maintain software applications, as well as allows different developers to work on different parts of an application without having to understand the underlying code.
USB Interface IC:
The USB interface IC is a chip that acts as an intermediary between the host computer and peripheral devices such as external storage devices, printers, flash memory, and others. It also provides functions of mass storage to the portable device. The USB interface IC enables data transfer between a PC and external devices through cable or wireless connection. It also facilitates communication among multiple computers over network via USB connections.
PCI(PCIe) Interface IC:
PCI (Peripheral Component Interconnect) is a high-speed bus architecture that provides an internal connection between devices in a computer system. It was initially developed by Intel for its microprocessors to link the PCI Express slots and ports. The growing demand for high bandwidth communication, storage, and multi-function I/O has led to the development of new standards such as USB 3.0 and Thunderbolt which use PCI Express interface ICs as their main interconnect technology.
Application Insights:
The industrial application segment accounted for the largest revenue share in 2016 and is projected to witness significant growth over the forecast period. The rising demand for automation systems across various industries including oil & gas, manufacturing, healthcare, and transportation is expected to drive the industry growth over the coming years.
The communication segment accounted for a considerable revenue share in 2016 owing to increasing demand from smartphones and other communication devices. The growing need to improve connectivity between vehicles and vehicle-mounted devices is expected to boost product demand in automotive applications over the coming years. In addition, technological advancements such as USB 3.0 will fuel industry expansion further during 2018 - 2030 period as these modules are compatible with newer version of smartphones running on Android OS or iOS platform respectively which provides enhanced data transfer speed compared with previous generation phones supporting USB 2.0 technology allowing users enjoy faster data transfer speeds at an affordable cost per bitumen unit (bu).
Regional Analysis:
Asia Pacific is expected to emerge as the fastest-growing region over the forecast period. The growth can be attributed to increasing demand for communication devices and computer hardware in countries such as China, India, and Japan. Moreover, rising penetration of smartphones along with rapid development of internet infrastructure will drive regional market growth over the next eight years.
The European region dominated global interface modules industry in 2016 owing to high product demand from major application sectors including automotive, healthcare & medical devices among others. However, North America is projected to grow at a lucrative rate due to growing industrial automation sector that requires large scale deployment of interface chipsets for building smart factories across U.S.
The study begins with an introduction of International Electrotechnical Commission (IEC), its scope.
Growth Factors:
- Increasing demand for interface modules in the automotive sector on account of growing vehicle production and electrification.
- Proliferation of interface modules in the industrial sector owing to rising demand for smart factories and automation.
- Growing popularity of interface modules in the medical sector due to increasing adoption of connected health devices and services.
- Rising demand for interface modules from the telecom industry as a result of surging deployment of 4G/5G networks across the globe.
Scope Of The Report
Report Attributes
Report Details
Report Title
Interface Modules Market Research Report
By Type
USB Interface IC, PCI(PCIe) Interface IC, SATA Interface IC, Others
By Application
Communication, Industrial, Healthcare, Consumer Electronic, Automobile, Others
By Companies
FTDI, Silicon Labs, JMicron Technology, Fujitsu, Microchip, Toshiba, NXP, Silicon Motion, TI, ASMedia Technology, Cypress, MaxLinear, Broadcom, Initio Corporation, ASIX, Holtek
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
219
Number of Tables & Figures
154
Customization Available
Yes, the report can be customized as per your need.
Global Interface Modules Market Report Segments:
The global Interface Modules market is segmented on the basis of:
Types
USB Interface IC, PCI(PCIe) Interface IC, SATA Interface IC, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Communication, Industrial, Healthcare, Consumer Electronic, Automobile, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- FTDI
- Silicon Labs
- JMicron Technology
- Fujitsu
- Microchip
- Toshiba
- NXP
- Silicon Motion
- TI
- ASMedia Technology
- Cypress
- MaxLinear
- Broadcom
- Initio Corporation
- ASIX
- Holtek
Highlights of The Interface Modules Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- USB Interface IC
- PCI(PCIe) Interface IC
- SATA Interface IC
- Others
- By Application:
- Communication
- Industrial
- Healthcare
- Consumer Electronic
- Automobile
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Interface Modules Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Interface modules are a type of module that allow you to extend the functionality of an existing application. They provide a way for you to add new features or change the behavior of an existing feature without having to modify the source code of the application.
Some of the major players in the interface modules market are FTDI, Silicon Labs, JMicron Technology, Fujitsu, Microchip, Toshiba, NXP, Silicon Motion, TI, ASMedia Technology, Cypress, MaxLinear, Broadcom, Initio Corporation, ASIX, Holtek.
The interface modules market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Interface Modules Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Interface Modules Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Interface Modules Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Interface Modules Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Interface Modules Market Size & Forecast, 2020-2028
4.5.1 Interface Modules Market Size and Y-o-Y Growth
4.5.2 Interface Modules Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 USB Interface IC
5.2.2 PCI(PCIe) Interface IC
5.2.3 SATA Interface IC
5.2.4 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Communication
6.2.2 Industrial
6.2.3 Healthcare
6.2.4 Consumer Electronic
6.2.5 Automobile
6.2.6 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Interface Modules Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Interface Modules Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 USB Interface IC
9.6.2 PCI(PCIe) Interface IC
9.6.3 SATA Interface IC
9.6.4 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Communication
9.10.2 Industrial
9.10.3 Healthcare
9.10.4 Consumer Electronic
9.10.5 Automobile
9.10.6 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 USB Interface IC
10.6.2 PCI(PCIe) Interface IC
10.6.3 SATA Interface IC
10.6.4 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Communication
10.10.2 Industrial
10.10.3 Healthcare
10.10.4 Consumer Electronic
10.10.5 Automobile
10.10.6 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 USB Interface IC
11.6.2 PCI(PCIe) Interface IC
11.6.3 SATA Interface IC
11.6.4 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Communication
11.10.2 Industrial
11.10.3 Healthcare
11.10.4 Consumer Electronic
11.10.5 Automobile
11.10.6 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 USB Interface IC
12.6.2 PCI(PCIe) Interface IC
12.6.3 SATA Interface IC
12.6.4 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Communication
12.10.2 Industrial
12.10.3 Healthcare
12.10.4 Consumer Electronic
12.10.5 Automobile
12.10.6 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 USB Interface IC
13.6.2 PCI(PCIe) Interface IC
13.6.3 SATA Interface IC
13.6.4 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Communication
13.10.2 Industrial
13.10.3 Healthcare
13.10.4 Consumer Electronic
13.10.5 Automobile
13.10.6 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Interface Modules Market: Competitive Dashboard
14.2 Global Interface Modules Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 FTDI
14.3.2 Silicon Labs
14.3.3 JMicron Technology
14.3.4 Fujitsu
14.3.5 Microchip
14.3.6 Toshiba
14.3.7 NXP
14.3.8 Silicon Motion
14.3.9 TI
14.3.10 ASMedia Technology
14.3.11 Cypress
14.3.12 MaxLinear
14.3.13 Broadcom
14.3.14 Initio Corporation
14.3.15 ASIX
14.3.16 Holtek
