Market Overview:
The global JEDEC trays market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for electronic chips and other electronic components from various end-use industries. In terms of type, the aluminum JEDEC trays segment is expected to lead the global market during the forecast period, followed by plastic JEDEC trays and others segments. The aluminum JEDEC tray segment is projected to grow at a CAGR of 6% during the forecast period, while that of plastic JEDEC tray segment is projected to grow at a CAGR of 4%. Regionally, North America dominates the global market for jedec trays due with highest share in 2017 and it will continue its dominance throughout 2030 owing continuous demand from semiconductor industry across this region.
Product Definition:
A JEDEC tray is a rectangular piece of plastic, metal, or paperboard that holds electronic components in an organized and accessible manner. JEDEC trays are often used in electro-mechanical assembly and repair to hold ICs, resistors, capacitors, diodes, transistors. They can also be used as a work surface for small hand tools.
Aluminum JEDEC Trays:
Aluminum jedec trays are used for packaging semiconductor devices in JEDEC trays. Aluminum jedec trays have a capacity of holding 1 to 20 semiconductor devices depending on the size and type of device. The aluminum jedec tray is widely accepted as an alternative to plastic or glass containers due to its superior properties such as lightweight, recyclability, non-corrosive nature, etc.
Plastic JEDEC Trays:
Plastic jedec trays are used in packaging of semiconductor devices and electronic components. Plastic jedec trays are made from high-density polyethylene (HDPE) or low-density polyethylene (LDPE). These plastic materials provide excellent barrier properties to moisture, oxygen, and light. Furthermore, these materials also offer excellent thermal insulation properties which help in maintaining the temperature of device contents even after insertion into a heated environment.
Application Insights:
Electronic chips application segment accounted for the largest market share in 2017 and is projected to continue its dominance over the forecast period. The growing electronics industry across the globe is expected to contribute significantly towards product demand. Other electronic components such as power devices, batteries, capacitors and resistors are also anticipated to drive tray demand during the study period.
The global semiconductor industry has witnessed tremendous growth over recent years owing to technological advancements coupled with increasing consumer disposable income levels in developing countries including China India & Brazil etc. This trend is expected to continue over next few years which will benefit product manufacturers significantly during this study period.
Regional Analysis:
Asia Pacific is expected to be the largest regional market over the forecast period. The region’s growth can be attributed to increasing demand for electronic chips and other electronic components in countries, such as China, Japan, South Korea, India and Taiwan. In addition, rising number of data centers in this region is anticipated to fuel industry expansion over the next eight years.
The North America JEDEC trays market accounted for a revenue share of more than 20% in 2017 owing to high production volume of semiconductors and their component manufacturing plants located in U.S., which are some of its major end-users along with computer systems & laptops manufacturers based out of Canada & Mexico. Moreover, growing adoption rate for advanced technology products on account semiconductor packaging solutions offered by vendors has also contributed significantly toward industry growth across this region since last few years resulting into higher sales volumes compared with others offering similar solutions but packaged using cheaper methods such as plastic or metal cans etc.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising trend of using JEDEC trays in automotive and aerospace applications
- Growing popularity of JEDEC trays in medical and laboratory settings
- Proliferation of e-commerce platforms that offer customized tray solutions
- Advances in tray manufacturing technology
Scope Of The Report
Report Attributes
Report Details
Report Title
JEDEC Trays Market Research Report
By Type
Aluminum JEDEC Trays, Plastic JEDEC Trays, Others
By Application
Electronic Chips, Other Electronic Components
By Companies
R H Murphy Company, Adafruit, Texas Technologies, Peak, Hwa Shu, SHINON, ITW ECPS, KOSTAT, ePak, SUNRISE, ASE Group, UBoT, Renesas Electronics
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
141
Number of Tables & Figures
99
Customization Available
Yes, the report can be customized as per your need.
Global JEDEC Trays Market Report Segments:
The global JEDEC Trays market is segmented on the basis of:
Types
Aluminum JEDEC Trays, Plastic JEDEC Trays, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Electronic Chips, Other Electronic Components
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- R H Murphy Company
- Adafruit
- Texas Technologies
- Peak
- Hwa Shu
- SHINON
- ITW ECPS
- KOSTAT
- ePak
- SUNRISE
- ASE Group
- UBoT
- Renesas Electronics
Highlights of The JEDEC Trays Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Aluminum JEDEC Trays
- Plastic JEDEC Trays
- Others
- By Application:
- Electronic Chips
- Other Electronic Components
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the JEDEC Trays Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
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- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
JEDEC Trays are a type of computer memory module that is used in desktop and laptop computers. JEDEC Trays are made up of several small chips that can be inserted into a computer's motherboard to increase the memory capacity.
Some of the major players in the jedec trays market are R H Murphy Company, Adafruit, Texas Technologies, Peak, Hwa Shu, SHINON, ITW ECPS, KOSTAT, ePak, SUNRISE, ASE Group, UBoT, Renesas Electronics.
The jedec trays market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 JEDEC Trays Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 JEDEC Trays Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 JEDEC Trays Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the JEDEC Trays Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global JEDEC Trays Market Size & Forecast, 2020-2028
4.5.1 JEDEC Trays Market Size and Y-o-Y Growth
4.5.2 JEDEC Trays Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Aluminum JEDEC Trays
5.2.2 Plastic JEDEC Trays
5.2.3 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Electronic Chips
6.2.2 Other Electronic Components
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global JEDEC Trays Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 JEDEC Trays Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Aluminum JEDEC Trays
9.6.2 Plastic JEDEC Trays
9.6.3 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Electronic Chips
9.10.2 Other Electronic Components
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Aluminum JEDEC Trays
10.6.2 Plastic JEDEC Trays
10.6.3 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Electronic Chips
10.10.2 Other Electronic Components
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Aluminum JEDEC Trays
11.6.2 Plastic JEDEC Trays
11.6.3 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Electronic Chips
11.10.2 Other Electronic Components
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Aluminum JEDEC Trays
12.6.2 Plastic JEDEC Trays
12.6.3 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Electronic Chips
12.10.2 Other Electronic Components
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Aluminum JEDEC Trays
13.6.2 Plastic JEDEC Trays
13.6.3 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Electronic Chips
13.10.2 Other Electronic Components
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 JEDEC Trays Market: Competitive Dashboard
14.2 Global JEDEC Trays Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 R H Murphy Company
14.3.2 Adafruit
14.3.3 Texas Technologies
14.3.4 Peak
14.3.5 Hwa Shu
14.3.6 SHINON
14.3.7 ITW ECPS
14.3.8 KOSTAT
14.3.9 ePak
14.3.10 SUNRISE
14.3.11 ASE Group
14.3.12 UBoT
14.3.13 Renesas Electronics
