Market Overview:
The global LCP flexible printed circuit market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturization and lightweighting in electronic devices, rising demand for advanced electronics in automotive applications, and growing adoption of flexible circuits in medical devices. The global LCP flexible printed circuit market is segmented on the basis of type, application, and region. On the basis of type, the market is segmented into single-sided circuits, double-sided circuits, and multi-layer circuits. Single-sided circuits are expected to account for a major share of the global LCP flexible printed circuit market during the forecast period owing to their low cost and easy manufacturing process as compared to other types of flex PCBs. By application, industrial applications are expected to account for a major share of the global LCP flexible printed circuit market duringthe forecast period owingto their high demand from end users such as automotive manufacturers and consumer electronics companies.
Product Definition:
LCP Flexible Printed Circuit is a laminated film with copper traces that can be used as an electronic component. It is important for its flexibility, durability, and heat resistance.
Single-sided Circuit:
Single-sided circuit or SS Circuit is a printed circuit board (PCB) that has only one side of the electrical components such as resistors, capacitors, inductors and all other electronic items. The single-sided PCB do not have any components on the reverse side; it is usually used for experimental purposes by inventing new devices or circuits.
Double-sided Circuit:
Double-sided circuit is a printed circuit board which consists of two layers of copper and one layer of insulation between them. On the surface where there is no copper, there are many options for soldering but on the contrary, on the side with copper there are very few options for soldering due to its proximity to other components. Therefore, in order to avoid damage during assembly or wire short circuits we use double-sided circuit boards.
Application Insights:
LCP flexible printed circuit is used in a wide range of applications including industrial, consumer electronics, automotive and other sectors. The growing adoption of LCP flexible circuits in various applications is expected to drive the global market growth over the forecast period.
The use of LCP for manufacturing complex electronic devices with high reliability and low power consumption has led to an increased demand from various end-use industries such as consumer electronics, automotive and others. In addition, increasing R&D activities by major industry players are further anticipated to propel market growth over the coming years.
LCP offers several advantages including high flexibility which allows manufacturers to design complex shapes while maintaining electrical connectivity without soldering or welding; this property also makes it ideal for use in electronic appliances where heat dissipation is a concern (such as smartphones).
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for flexible printed circuit boards from various end-use industries such as consumer electronics, automotive, and industrial. China is one of the largest producers of flexible printed circuit board owing to availability of raw materials at cheaper rates as compared to other countries.
The Asia Pacific has been witnessing strong economic growth on account rising disposable income coupled with growing population especially in India & China which has led towards an increase in demand for consumer electronics including smartphones, tablets, cameras among others. This factor is anticipated to fuel product adoption across these economies thereby driving regional market growth over the forecast period.
North America accounted for a significant share due to presence major companies such as Intel Corporation; Texas Instruments Inc.; Avago Technologies Ltd.; Broadcom Inc.; Qualcomm Inc.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive industry
- Growing popularity of wearable electronics
- Proliferation of Internet of Things (IoT) devices
- Emerging applications in medical and healthcare sector
Scope Of The Report
Report Attributes
Report Details
Report Title
LCP Flexible Printed Circuit Market Research Report
By Type
Single-sided Circuit, Double-sided Circuit, Multi-layer Circuit
By Application
Industrial, Consumer Electronics, Automotive, Other
By Companies
Murata, Sumitomo, Fujikura, Holitech, Avary Holding, Flexium Interconnect, Suzhou Dongshan Precision, Career Technology, Mektron, Kinwong
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
235
Number of Tables & Figures
165
Customization Available
Yes, the report can be customized as per your need.
Global LCP Flexible Printed Circuit Market Report Segments:
The global LCP Flexible Printed Circuit market is segmented on the basis of:
Types
Single-sided Circuit, Double-sided Circuit, Multi-layer Circuit
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Industrial, Consumer Electronics, Automotive, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Murata
- Sumitomo
- Fujikura
- Holitech
- Avary Holding
- Flexium Interconnect
- Suzhou Dongshan Precision
- Career Technology
- Mektron
- Kinwong
Highlights of The LCP Flexible Printed Circuit Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Single-sided Circuit
- Double-sided Circuit
- Multi-layer Circuit
- By Application:
- Industrial
- Consumer Electronics
- Automotive
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the LCP Flexible Printed Circuit Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
LCP Flexible Printed Circuit is a flexible printed circuit board that can be bent, shaped and folded to form various shapes. This type of PCB is often used in wearable devices, such as smart watches and fitness trackers, because it allows for a more compact design.
Some of the major players in the lcp flexible printed circuit market are Murata, Sumitomo, Fujikura, Holitech, Avary Holding, Flexium Interconnect, Suzhou Dongshan Precision, Career Technology, Mektron, Kinwong.
The lcp flexible printed circuit market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 LCP Flexible Printed Circuit Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 LCP Flexible Printed Circuit Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 LCP Flexible Printed Circuit Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the LCP Flexible Printed Circuit Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global LCP Flexible Printed Circuit Market Size & Forecast, 2020-2028
4.5.1 LCP Flexible Printed Circuit Market Size and Y-o-Y Growth
4.5.2 LCP Flexible Printed Circuit Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Single-sided Circuit
5.2.2 Double-sided Circuit
5.2.3 Multi-layer Circuit
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Industrial
6.2.2 Consumer Electronics
6.2.3 Automotive
6.2.4 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global LCP Flexible Printed Circuit Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 LCP Flexible Printed Circuit Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Single-sided Circuit
9.6.2 Double-sided Circuit
9.6.3 Multi-layer Circuit
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Industrial
9.10.2 Consumer Electronics
9.10.3 Automotive
9.10.4 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Single-sided Circuit
10.6.2 Double-sided Circuit
10.6.3 Multi-layer Circuit
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Industrial
10.10.2 Consumer Electronics
10.10.3 Automotive
10.10.4 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Single-sided Circuit
11.6.2 Double-sided Circuit
11.6.3 Multi-layer Circuit
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Industrial
11.10.2 Consumer Electronics
11.10.3 Automotive
11.10.4 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Single-sided Circuit
12.6.2 Double-sided Circuit
12.6.3 Multi-layer Circuit
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Industrial
12.10.2 Consumer Electronics
12.10.3 Automotive
12.10.4 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Single-sided Circuit
13.6.2 Double-sided Circuit
13.6.3 Multi-layer Circuit
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Industrial
13.10.2 Consumer Electronics
13.10.3 Automotive
13.10.4 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 LCP Flexible Printed Circuit Market: Competitive Dashboard
14.2 Global LCP Flexible Printed Circuit Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Murata
14.3.2 Sumitomo
14.3.3 Fujikura
14.3.4 Holitech
14.3.5 Avary Holding
14.3.6 Flexium Interconnect
14.3.7 Suzhou Dongshan Precision
14.3.8 Career Technology
14.3.9 Mektron
14.3.10 Kinwong
