Market Overview:
The global lead free copper clad laminate market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for lead free copper clad laminates from various end-use industries, such as communication, consumer electronics, automotive electronics, and others. In terms of type, the FR4 board segment is expected to hold the largest share of the global lead free copper clad laminate market during the forecast period. This can be attributed to its high electrical performance and low cost as compared to other types of boards available in the market. In terms of application, communication is expected to hold the largest share of the global lead free copper clad laminate market duringthe forecast period.
Product Definition:
Lead free copper clad laminate is a composite material made of an insulating substrate, such as paper or fiberglass cloth, and a thin layer of copper. The copper layer is bonded to the substrate with an epoxy resin adhesive. Lead free copper clad laminates are used in electronic applications where good electrical conductivity and low weight are important factors.
FR4 Board:
FR4 is a type of board used in the production of laminate flooring. It is also known as fiberglass-reinforced plastic or fiberboard. The material has high durability and strength, which makes it an ideal choice for laminates that are to be used in heavy-duty applications such as industrial floors and shop floors. FR4 boards are available with different surface textures, colors, and sizes; they can be purchased in sheets or by the linear foot.
Halogen-free Board:
The halogen-free board is a type of non-flammable, insulating material that can be used in the production of lead free copperclad laminates. It consists of fine particles and a polymer matrix which are held together by strong mechanical forces. The high strength of the product has led to its usage in various end-use industries such as construction, electrical & electronics and automotive among others.
Application Insights:
The communication segment led the global lead free copper clad laminate market in 2017 and is projected to expand at a CAGR of XX% over the forecast period. The growth can be attributed to increasing demand for high-speed data transfer products from telecommunication and IT industries. In addition, growing digitalization across the developing countries is expected to boost product demand over the next seven years.
The consumer electronics application segment accounted for a significant share in 2017 owing to increasing use of smartphones and other electronic devices among consumers globally. Growing preference for flat panel TVs as well as monitors coupled with rising income levels has driven this industry significantly over recent years, which is likely to continue through 2018 - 2030 period on account of increased consumption of electronics goods worldwide including smartphones, tablets, laptops among others by end users or OEMs (Original Equipment Manufacturers).
Regional Analysis:
Asia Pacific was the largest regional market in 2017 and accounted for a revenue share of over 40%. The region is expected to continue its dominance over the forecast period. This can be attributed to increasing product demand from consumer electronics, communication and automotive industries. China is anticipated to remain a key consumer as well as producer owing to low manufacturing cost coupled with easy availability of land, labor and raw materials.
The European market was valued at USD X million in 2017 owing to high production volume offered by Halogen-free copper clad laminate manufacturers located in Germany, France, UK and Russia. In addition, growing infrastructure activities are likely drive product demand across this region during the forecast period.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive industry
- Growing popularity of LED lighting
- Proliferation of the Internet of Things (IoT)
- Emerging applications in medical and defense sectors
Scope Of The Report
Report Attributes
Report Details
Report Title
Lead Free Copper Clad Laminate Market Research Report
By Type
FR4 Board, Halogen-free Board, Special Board, Others
By Application
Communication, Consumer Electronics, Automotive Electronics, Other
By Companies
Taiwan Union Technology Corporation (TUC), SYTECH, Showa Denko Materials, Nan Ya Plastics Corporation, Rogers Corporation, Kingboard Laminates Group, Nanya New Material Technology Co., Ltd., EMC, Guangdong Goworld Lamination Plant, Panasonic, GDM International Technology Ltd., Isola, Wazam New Materials
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
250
Number of Tables & Figures
175
Customization Available
Yes, the report can be customized as per your need.
Global Lead Free Copper Clad Laminate Market Report Segments:
The global Lead Free Copper Clad Laminate market is segmented on the basis of:
Types
FR4 Board, Halogen-free Board, Special Board, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Communication, Consumer Electronics, Automotive Electronics, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Taiwan Union Technology Corporation (TUC)
- SYTECH
- Showa Denko Materials
- Nan Ya Plastics Corporation
- Rogers Corporation
- Kingboard Laminates Group
- Nanya New Material Technology Co., Ltd.
- EMC
- Guangdong Goworld Lamination Plant
- Panasonic
- GDM International Technology Ltd.
- Isola
- Wazam New Materials
Highlights of The Lead Free Copper Clad Laminate Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- FR4 Board
- Halogen-free Board
- Special Board
- Others
- By Application:
- Communication
- Consumer Electronics
- Automotive Electronics
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Lead Free Copper Clad Laminate Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Lead free copper clad laminate is a type of laminate that does not contain any lead. This type of laminate is often used in products that come into contact with food or water.
Some of the major companies in the lead free copper clad laminate market are Taiwan Union Technology Corporation (TUC), SYTECH, Showa Denko Materials, Nan Ya Plastics Corporation, Rogers Corporation, Kingboard Laminates Group, Nanya New Material Technology Co., Ltd., EMC, Guangdong Goworld Lamination Plant, Panasonic, GDM International Technology Ltd., Isola, Wazam New Materials.
The lead free copper clad laminate market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Lead Free Copper Clad Laminate Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Lead Free Copper Clad Laminate Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Lead Free Copper Clad Laminate Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Lead Free Copper Clad Laminate Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Lead Free Copper Clad Laminate Market Size & Forecast, 2020-2028 4.5.1 Lead Free Copper Clad Laminate Market Size and Y-o-Y Growth 4.5.2 Lead Free Copper Clad Laminate Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 FR4 Board
5.2.2 Halogen-free Board
5.2.3 Special Board
5.2.4 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Communication
6.2.2 Consumer Electronics
6.2.3 Automotive Electronics
6.2.4 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Lead Free Copper Clad Laminate Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Lead Free Copper Clad Laminate Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 FR4 Board
9.6.2 Halogen-free Board
9.6.3 Special Board
9.6.4 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Communication
9.10.2 Consumer Electronics
9.10.3 Automotive Electronics
9.10.4 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 FR4 Board
10.6.2 Halogen-free Board
10.6.3 Special Board
10.6.4 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Communication
10.10.2 Consumer Electronics
10.10.3 Automotive Electronics
10.10.4 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 FR4 Board
11.6.2 Halogen-free Board
11.6.3 Special Board
11.6.4 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Communication
11.10.2 Consumer Electronics
11.10.3 Automotive Electronics
11.10.4 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 FR4 Board
12.6.2 Halogen-free Board
12.6.3 Special Board
12.6.4 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Communication
12.10.2 Consumer Electronics
12.10.3 Automotive Electronics
12.10.4 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 FR4 Board
13.6.2 Halogen-free Board
13.6.3 Special Board
13.6.4 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Communication
13.10.2 Consumer Electronics
13.10.3 Automotive Electronics
13.10.4 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Lead Free Copper Clad Laminate Market: Competitive Dashboard
14.2 Global Lead Free Copper Clad Laminate Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Taiwan Union Technology Corporation (TUC)
14.3.2 SYTECH
14.3.3 Showa Denko Materials
14.3.4 Nan Ya Plastics Corporation
14.3.5 Rogers Corporation
14.3.6 Kingboard Laminates Group
14.3.7 Nanya New Material Technology Co., Ltd.
14.3.8 EMC
14.3.9 Guangdong Goworld Lamination Plant
14.3.10 Panasonic
14.3.11 GDM International Technology Ltd.
14.3.12 Isola
14.3.13 Wazam New Materials