Market Overview:
The global lead-free solder alloy market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for lead-free solder alloys from various applications, such as BGA, CSP & WLCSP, flip chip and others. In terms of type, the lead-free tin ball segment is projected to hold the largest share of the global lead-free solder alloy market during the forecast period. This can be attributed to its high demand from various end users, such as automotive and consumer electronics industries.
Product Definition:
Lead-free solder alloy is a type of solder that does not contain the element lead. It is often used in electronics to join two pieces of metal together. Lead-free solder alloy is important because it helps protect people from lead poisoning, which can be harmful to the body.
Lead-Free Tin Ball:
The global Lead-free solder alloy market size was valued at USD 1.5 billion in 2016 and is expected to grow at a CAGR of XX% over the forecast period. The growing electronics industry, particularly in Asia Pacific, coupled with rising demand for lead-free products on account of stringent regulations imposed by various governments across the globe is expected to drive growth over the forecast period.
Lead-based solders are toxic.
Lead-Free Tin Bar:
The global Lead-free tin bar and it's usage in Lead-free solder alloy market size was valued at USD 6.5 million in 2016. The increasing demand for lead-free solders with high thermal stability is expected to be a key factor driving the growth of the market over the forecast period.
Lead-Free solder alloys are widely used across various applications including electronic component, construction, automotive industry,.
Application Insights:
The BGA application segment led the global lead-free solder alloy market and accounted for more than 45.0% share of the total revenue in 2017. The demand for BGA is expected to witness growth on account of its high reliability, low cost and easy availability in comparison to other solders such as CSP & WLCSP, Flip-Chip & Others.
The increasing use of ball grid array (BGA) components in smartphones, tablets, laptops among others is anticipated to drive the demand over the forecast period. Moreover, growing preference for miniaturization of electronic devices owing to increased disposable income levels coupled with technological developments will further fuel industry expansion over the coming years.
Regional Analysis:
Asia Pacific was the largest regional market in 2017 and is expected to continue its dominance over the forecast period. The region accounts for nearly 60% of global population and more than 50% of global GDP. It is also one of the fastest-growing regions, with China being at the forefront. The Chinese economy has been experiencing strong growth since 2010, which has been fueling industry growth in this region as well as across other Asia Pacific countries such as India, Indonesia, Vietnam and Malaysia among others.
The European market held a significant share in 2017 owing to high demand from several key application sectors including semiconductors (ICs & Semiconductors), medical devices & components (LEDs), consumer electronics (DDR/ DDR2/ DDR3 memory chips) etc., However; it is likely to witness sluggish growth over the next eight years due to strict regulations regarding Pb content by various governments resulting into low demand for leaded solders across Europe countries such as Germany, U.
Growth Factors:
- Increasing demand from the automotive and electronics industries for lead-free solder alloys as a result of environmental regulations.
- The increasing popularity of lead-free solder alloys among consumers due to health concerns over the use of lead in electronic products.
- Rising demand for miniaturized and lightweight electronic devices, which has led to an increase in the use of lead-free solder alloys in consumer electronics products.
- Growing demand for high-reliability soldering solutions in military and aerospace applications, which has led to an increase in the use of lead-free solder alloys in these applications.
- Technological advancements that have resulted in the development of new types of lead-free solder alloy formulations that offer improved performance characteristics over traditional formulations
Scope Of The Report
Report Attributes
Report Details
Report Title
Lead-free Solder Alloy Market Research Report
By Type
Lead-Free Tin Ball, Lead-Free Tin Bar, Lead-Free Tin Wire, Lead-Free Solder Paste, Other
By Application
BGA, CSP & WLCSP, Flip-Chip & Others
By Companies
Henkel, Nihon Superior, Chernan Technology, Qualitek, Senju Metal Industry, Tamura, Alpha Assembly Solutions, KOKI, Kester, Tongfang Tech, Huaqing Solder, Indium Corporation, Earlysun Technology, AIM Solder, Nordson, Interflux Electronics, Balver Zinn Josef Jost, MG Chemicals, Uchihashi Estec, Guangchen Metal Products, Nihon Almit, Zhongya Electronic Solder, Tianjin Songben
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
212
Number of Tables & Figures
149
Customization Available
Yes, the report can be customized as per your need.
Global Lead-free Solder Alloy Market Report Segments:
The global Lead-free Solder Alloy market is segmented on the basis of:
Types
Lead-Free Tin Ball, Lead-Free Tin Bar, Lead-Free Tin Wire, Lead-Free Solder Paste, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
BGA, CSP & WLCSP, Flip-Chip & Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Henkel
- Nihon Superior
- Chernan Technology
- Qualitek
- Senju Metal Industry
- Tamura
- Alpha Assembly Solutions
- KOKI
- Kester
- Tongfang Tech
- Huaqing Solder
- Indium Corporation
- Earlysun Technology
- AIM Solder
- Nordson
- Interflux Electronics
- Balver Zinn Josef Jost
- MG Chemicals
- Uchihashi Estec
- Guangchen Metal Products
- Nihon Almit
- Zhongya Electronic Solder
- Tianjin Songben
Highlights of The Lead-free Solder Alloy Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Lead-Free Tin Ball
- Lead-Free Tin Bar
- Lead-Free Tin Wire
- Lead-Free Solder Paste
- Other
- By Application:
- BGA
- CSP & WLCSP
- Flip-Chip & Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Lead-free Solder Alloy Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Lead-free solder alloy is a type of solder that does not contain lead. This type of alloy is often used in electronics because it has a higher melting point than other types of solder and can be more easily formed into connections.
Some of the key players operating in the lead-free solder alloy market are Henkel, Nihon Superior, Chernan Technology, Qualitek, Senju Metal Industry, Tamura, Alpha Assembly Solutions, KOKI, Kester, Tongfang Tech, Huaqing Solder, Indium Corporation, Earlysun Technology, AIM Solder, Nordson, Interflux Electronics, Balver Zinn Josef Jost, MG Chemicals, Uchihashi Estec, Guangchen Metal Products, Nihon Almit, Zhongya Electronic Solder, Tianjin Songben.
The lead-free solder alloy market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Lead-free Solder Alloy Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Lead-free Solder Alloy Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Lead-free Solder Alloy Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Lead-free Solder Alloy Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Lead-free Solder Alloy Market Size & Forecast, 2018-2028
4.5.1 Lead-free Solder Alloy Market Size and Y-o-Y Growth
4.5.2 Lead-free Solder Alloy Market Absolute $ Opportunity
Chapter 5 Global Lead-free Solder Alloy Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Lead-free Solder Alloy Market Size Forecast by Type
5.2.1 Lead-Free Tin Ball
5.2.2 Lead-Free Tin Bar
5.2.3 Lead-Free Tin Wire
5.2.4 Lead-Free Solder Paste
5.2.5 Other
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Lead-free Solder Alloy Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Lead-free Solder Alloy Market Size Forecast by Applications
6.2.1 BGA
6.2.2 CSP & WLCSP
6.2.3 Flip-Chip & Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Lead-free Solder Alloy Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Lead-free Solder Alloy Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Lead-free Solder Alloy Analysis and Forecast
9.1 Introduction
9.2 North America Lead-free Solder Alloy Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Lead-free Solder Alloy Market Size Forecast by Type
9.6.1 Lead-Free Tin Ball
9.6.2 Lead-Free Tin Bar
9.6.3 Lead-Free Tin Wire
9.6.4 Lead-Free Solder Paste
9.6.5 Other
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Lead-free Solder Alloy Market Size Forecast by Applications
9.10.1 BGA
9.10.2 CSP & WLCSP
9.10.3 Flip-Chip & Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Lead-free Solder Alloy Analysis and Forecast
10.1 Introduction
10.2 Europe Lead-free Solder Alloy Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Lead-free Solder Alloy Market Size Forecast by Type
10.6.1 Lead-Free Tin Ball
10.6.2 Lead-Free Tin Bar
10.6.3 Lead-Free Tin Wire
10.6.4 Lead-Free Solder Paste
10.6.5 Other
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Lead-free Solder Alloy Market Size Forecast by Applications
10.10.1 BGA
10.10.2 CSP & WLCSP
10.10.3 Flip-Chip & Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Lead-free Solder Alloy Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Lead-free Solder Alloy Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Lead-free Solder Alloy Market Size Forecast by Type
11.6.1 Lead-Free Tin Ball
11.6.2 Lead-Free Tin Bar
11.6.3 Lead-Free Tin Wire
11.6.4 Lead-Free Solder Paste
11.6.5 Other
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Lead-free Solder Alloy Market Size Forecast by Applications
11.10.1 BGA
11.10.2 CSP & WLCSP
11.10.3 Flip-Chip & Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Lead-free Solder Alloy Analysis and Forecast
12.1 Introduction
12.2 Latin America Lead-free Solder Alloy Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Lead-free Solder Alloy Market Size Forecast by Type
12.6.1 Lead-Free Tin Ball
12.6.2 Lead-Free Tin Bar
12.6.3 Lead-Free Tin Wire
12.6.4 Lead-Free Solder Paste
12.6.5 Other
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Lead-free Solder Alloy Market Size Forecast by Applications
12.10.1 BGA
12.10.2 CSP & WLCSP
12.10.3 Flip-Chip & Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Lead-free Solder Alloy Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Lead-free Solder Alloy Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Lead-free Solder Alloy Market Size Forecast by Type
13.6.1 Lead-Free Tin Ball
13.6.2 Lead-Free Tin Bar
13.6.3 Lead-Free Tin Wire
13.6.4 Lead-Free Solder Paste
13.6.5 Other
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Lead-free Solder Alloy Market Size Forecast by Applications
13.10.1 BGA
13.10.2 CSP & WLCSP
13.10.3 Flip-Chip & Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Lead-free Solder Alloy Market: Competitive Dashboard
14.2 Global Lead-free Solder Alloy Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Henkel
14.3.2 Nihon Superior
14.3.3 Chernan Technology
14.3.4 Qualitek
14.3.5 Senju Metal Industry
14.3.6 Tamura
14.3.7 Alpha Assembly Solutions
14.3.8 KOKI
14.3.9 Kester
14.3.10 Tongfang Tech
14.3.11 Huaqing Solder
14.3.12 Indium Corporation
14.3.13 Earlysun Technology
14.3.14 AIM Solder
14.3.15 Nordson
14.3.16 Interflux Electronics
14.3.17 Balver Zinn Josef Jost
14.3.18 MG Chemicals
14.3.19 Uchihashi Estec
14.3.20 Guangchen Metal Products
14.3.21 Nihon Almit
14.3.22 Zhongya Electronic Solder
14.3.23 Tianjin Songben
