Market Overview:
The global LED wire bonder market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for mini and micro LED wire bonders in the semiconductor and electronics industries. Mini LED wire bonders are used for bonding mini LEDs, while micro LED wire bonders are used for bonding micro LEDs. These types of LED wire bonders offer high accuracy and precision, which is why they are increasingly being adopted in various applications such as triodes, semiconductor discrete devices, DIP type products, SOP type products, and others. In terms of region, North America is expected to lead the global LED wire bonder market during the forecast period owing to the presence of major players such as ASM Pacific Technology Ltd., Kulicke & Soffa Industries Inc., Tokyo Seimitsu Co Ltd., Advantest Corporation (Japan), Teradyne Inc., Applied Materials Inc., and others in this region. Asia Pacific is also anticipated to witness significant growth during the forecast period due to rising demand from countries such as China and Japan.
Product Definition:
LED Wire Bonder is a device that electrically connects two or more wires together. It is used to create electrical connections between wire leads and circuit board pads, or between two wire leads. The importance of LED Wire Bonder is that it allows for the creation of reliable electrical connections, which are necessary for the proper functioning of electronic devices.
Traditional LED Wire Bonder:
Traditional LED wire boder is a new technology that allows electrical wires to be joined together without any soldering. It uses an adhesive to join the two wires which are then wrapped around a plastic core. The plastic core acts as an insulator and helps protect the circuit from external influences such as vibration, temperature, and pressure.
Mini LED Wire Bonder:
Mini LED wire boder is a new technology that allows to connect multiple light-emitting diodes (LEDs) by using one wire. It helps in increasing the brightness of any LEDs connected in series or parallel and also makes it easier to control the brightness by using pulse width modulation. The product was initially developed for use in data visualization applications, such as creating colorful patterns on monitors with moving objects or background colors that change according to audio signals from a computer game.
Application Insights:
Based on application, the market has been segmented into LED, triode, semiconductor discrete device, DIP type products, SOP type products and others. The LED segment dominated the overall industry in terms of revenue in 2017. This is attributed to increasing demand for high brightness LEDs from various end-use industries such as automotive and construction among others.
The growing popularity of smart cities project across the globe is expected to boost product demand over the forecast period. Smart city projects involve installation of large number of streetlights with energy-efficient lighting solutions like led wirebonder over a large area which requires a huge amount of leds per unit length light source string or cable.
Regional Analysis:
The Asia Pacific led the global market in 2017 and is expected to continue its dominance over the next seven years. The region is home to some of the largest electronic product manufacturers such as Samsung Electronics Co., Ltd, LG Display Co., Ltd, and others. These companies are investing heavily in R&D activities for developing advanced display technologies that can be integrated with various other components using wire bonding techniques. This factor will further boost regional growth during the forecast period.
Growth Factors:
- Increasing demand for LED lighting from the automotive and signage sectors
- Rising demand for energy-efficient lighting solutions
- Growing popularity of LED wire bonders in the semiconductor industry
- Technological advancements in LED wire bonding technology
- Proliferation of automated production lines
Scope Of The Report
Report Attributes
Report Details
Report Title
LED Wire Bonder Market Research Report
By Type
Traditional LED Wire Bonder, Mini LED Wire Bonder, Micro LED Wire Bonder
By Application
LED, Triode, Semiconductor Discrete Device, DIP Type Products, SOP Type Products, Others
By Companies
ASMPT, Xinyichang Technology, Shinkawa, Palomar, Weiheng Automation Equipment, GKG Precision Machine, ASMPT
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
202
Number of Tables & Figures
142
Customization Available
Yes, the report can be customized as per your need.
Global LED Wire Bonder Market Report Segments:
The global LED Wire Bonder market is segmented on the basis of:
Types
Traditional LED Wire Bonder, Mini LED Wire Bonder, Micro LED Wire Bonder
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
LED, Triode, Semiconductor Discrete Device, DIP Type Products, SOP Type Products, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ASMPT
- Xinyichang Technology
- Shinkawa
- Palomar
- Weiheng Automation Equipment
- GKG Precision Machine
- ASMPT
Highlights of The LED Wire Bonder Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Traditional LED Wire Bonder
- Mini LED Wire Bonder
- Micro LED Wire Bonder
- By Application:
- LED
- Triode
- Semiconductor Discrete Device
- DIP Type Products
- SOP Type Products
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the LED Wire Bonder Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
LED wire bender is a tool that helps you to join LED lights together by bending the wires around them.
Some of the major companies in the led wire bonder market are ASMPT, Xinyichang Technology, Shinkawa, Palomar, Weiheng Automation Equipment, GKG Precision Machine, ASMPT.
The led wire bonder market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 LED Wire Bonder Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 LED Wire Bonder Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 LED Wire Bonder Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the LED Wire Bonder Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global LED Wire Bonder Market Size & Forecast, 2018-2028
4.5.1 LED Wire Bonder Market Size and Y-o-Y Growth
4.5.2 LED Wire Bonder Market Absolute $ Opportunity
Chapter 5 Global LED Wire Bonder Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 LED Wire Bonder Market Size Forecast by Type
5.2.1 Traditional LED Wire Bonder
5.2.2 Mini LED Wire Bonder
5.2.3 Micro LED Wire Bonder
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global LED Wire Bonder Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 LED Wire Bonder Market Size Forecast by Applications
6.2.1 LED
6.2.2 Triode
6.2.3 Semiconductor Discrete Device
6.2.4 DIP Type Products
6.2.5 SOP Type Products
6.2.6 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global LED Wire Bonder Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 LED Wire Bonder Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America LED Wire Bonder Analysis and Forecast
9.1 Introduction
9.2 North America LED Wire Bonder Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America LED Wire Bonder Market Size Forecast by Type
9.6.1 Traditional LED Wire Bonder
9.6.2 Mini LED Wire Bonder
9.6.3 Micro LED Wire Bonder
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America LED Wire Bonder Market Size Forecast by Applications
9.10.1 LED
9.10.2 Triode
9.10.3 Semiconductor Discrete Device
9.10.4 DIP Type Products
9.10.5 SOP Type Products
9.10.6 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe LED Wire Bonder Analysis and Forecast
10.1 Introduction
10.2 Europe LED Wire Bonder Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe LED Wire Bonder Market Size Forecast by Type
10.6.1 Traditional LED Wire Bonder
10.6.2 Mini LED Wire Bonder
10.6.3 Micro LED Wire Bonder
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe LED Wire Bonder Market Size Forecast by Applications
10.10.1 LED
10.10.2 Triode
10.10.3 Semiconductor Discrete Device
10.10.4 DIP Type Products
10.10.5 SOP Type Products
10.10.6 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific LED Wire Bonder Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific LED Wire Bonder Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific LED Wire Bonder Market Size Forecast by Type
11.6.1 Traditional LED Wire Bonder
11.6.2 Mini LED Wire Bonder
11.6.3 Micro LED Wire Bonder
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific LED Wire Bonder Market Size Forecast by Applications
11.10.1 LED
11.10.2 Triode
11.10.3 Semiconductor Discrete Device
11.10.4 DIP Type Products
11.10.5 SOP Type Products
11.10.6 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America LED Wire Bonder Analysis and Forecast
12.1 Introduction
12.2 Latin America LED Wire Bonder Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America LED Wire Bonder Market Size Forecast by Type
12.6.1 Traditional LED Wire Bonder
12.6.2 Mini LED Wire Bonder
12.6.3 Micro LED Wire Bonder
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America LED Wire Bonder Market Size Forecast by Applications
12.10.1 LED
12.10.2 Triode
12.10.3 Semiconductor Discrete Device
12.10.4 DIP Type Products
12.10.5 SOP Type Products
12.10.6 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) LED Wire Bonder Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) LED Wire Bonder Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) LED Wire Bonder Market Size Forecast by Type
13.6.1 Traditional LED Wire Bonder
13.6.2 Mini LED Wire Bonder
13.6.3 Micro LED Wire Bonder
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) LED Wire Bonder Market Size Forecast by Applications
13.10.1 LED
13.10.2 Triode
13.10.3 Semiconductor Discrete Device
13.10.4 DIP Type Products
13.10.5 SOP Type Products
13.10.6 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 LED Wire Bonder Market: Competitive Dashboard
14.2 Global LED Wire Bonder Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 ASMPT
14.3.2 Xinyichang Technology
14.3.3 Shinkawa
14.3.4 Palomar
14.3.5 Weiheng Automation Equipment
14.3.6 GKG Precision Machine
14.3.7 ASMPT
