Market Overview:
The global liquid molding compounds (LMC) market is expected to grow at a CAGR of 5.8% from 2018 to 2030. The growth in the LMC market can be attributed to the increasing demand for fan-out wafer level packaging (FOWLP) and ball grid array package (BGA). In terms of type, the liquid epoxy underfill segment is expected to dominate the LMC market during the forecast period. This can be attributed to its properties such as low shrinkage, good thermal conductivity, and chemical resistance. In terms of application, FOWLP is expected to account for a major share of the LMC market during the forecast period.
 Industry Outlook.svg)
Product Definition:
Liquid molding compounds (LMC) are substances used to create molds for casting objects in a liquid form. LMC is important because it can be used to create detailed, accurate molds quickly and easily. This allows for the production of large quantities of identical objects in a short amount of time.
Liquid Epoxy Underfill:
Liquid epoxy underfill is a type of material used to fill the gaps or spaces in LMC compounds. It helps reduce shrinkage and increases density, which results in improved part quality and performance. The product also helps improve flow characteristics, surface finish, part complexity reduction, cycle time reduction along with cost savings during molding process.
The global liquid epoxy underfill market size was valued at USD 31 million in 2016.
Liquid Epoxy Encapsulat Material:
Liquid epoxy encapsulat material is a thermosetting polymer, which contains an epoxide group. Epoxies are widely used in the plastic molding industry as they have good mechanical properties and can be easily cast into molds. Liquid epoxy encapsulat material has been developed to overcome some of the disadvantages of conventional liquid molding compounds such as lack of surface finish on parts due to high viscosity and flow ability between materials during curing.
Application Insights:
The other application segment includes microelectronics, medical devices, industrial machinery and equipment packaging among others. The fan-out wafer level packaging (FOWLP) segment is expected to emerge as the fastest growing application over the forecast period owing to its high demand in semiconductor industry. FOWLP offers cost-effective solutions for mass production of integrated circuits (ICs). It also reduces wastage during testing and allows easier inspection of ICs. Liquid molding compounds are used with FOWLP technology due to their ability to create complex shapes with high accuracy at low temperatures compared to traditional techniques such as hot pressing or vacuum metalizing.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing region over the forecast period. The growth can be attributed to increasing demand for consumer electronics and rapid development of industries in China, India, South Korea, Taiwan and Japan. In addition, rising disposable income coupled with expanding population in these countries will drive product demand further.
The Asia Pacific market was valued at USD X billion in 2017 and is projected to grow at a CAGR of XX% from 2018 to 2030 owing to high liquid molding compound consumption levels across end-use industries such as electrical & electronics; medical devices; automotive; packaging & containers among others which are characterized by high growth potentials due to rapidly developing economies coupled with growing industrialization especially in China and India along with other Southeast Asian countries such as Vietnam Indonesia Thailand etc.
Growth Factors:
- Increasing demand for lightweight and durable automotive components
- Growing popularity of electric vehicles
- Rising demand from the construction sector
- Proliferation of 3D printing technology
- Stringent government regulations on emissions and fuel economy
Scope Of The Report
Report Attributes
Report Details
Report Title
Liquid Molding Compounds (LMC) Market Research Report
By Type
Liquid Epoxy Underfill, Liquid Epoxy Encapsulat Material
By Application
Fan-Out Wafer Level Packaging (FOWLP), Ball Grid Array Package (BGA), Other
By Companies
Nagase ChemteX, Shin-Etsu Chemical, Sumitomo Bakelite, Panasonic
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
163
Number of Tables & Figures
115
Customization Available
Yes, the report can be customized as per your need.
Global Liquid Molding Compounds (LMC) Market Report Segments:
The global Liquid Molding Compounds (LMC) market is segmented on the basis of:
Types
Liquid Epoxy Underfill, Liquid Epoxy Encapsulat Material
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Fan-Out Wafer Level Packaging (FOWLP), Ball Grid Array Package (BGA), Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Nagase ChemteX
- Shin-Etsu Chemical
- Sumitomo Bakelite
- Panasonic
 Market Overview.svg)
Highlights of The Liquid Molding Compounds (LMC) Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Liquid Epoxy Underfill
- Liquid Epoxy Encapsulat Material
- By Application:
- Fan-Out Wafer Level Packaging (FOWLP)
- Ball Grid Array Package (BGA)
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Liquid Molding Compounds (LMC) Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
 Market Statistics.svg)
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Liquid molding compounds (LMCs) are a type of thermoplastic resin that is used to create plastic products. They are often used in the manufacturing of toys, food containers, and other small objects. LMCs are also sometimes used in the production of medical devices and prosthetic parts.
Some of the key players operating in the liquid molding compounds (lmc) market are Nagase ChemteX, Shin-Etsu Chemical, Sumitomo Bakelite, Panasonic.
The liquid molding compounds (lmc) market is expected to register a CAGR of 5.8%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Liquid Molding Compounds (LMC) Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Liquid Molding Compounds (LMC) Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Liquid Molding Compounds (LMC) Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Liquid Molding Compounds (LMC) Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Liquid Molding Compounds (LMC) Market Size & Forecast, 2018-2028
4.5.1 Liquid Molding Compounds (LMC) Market Size and Y-o-Y Growth
4.5.2 Liquid Molding Compounds (LMC) Market Absolute $ Opportunity
Chapter 5 Global Liquid Molding Compounds (LMC) Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Liquid Molding Compounds (LMC) Market Size Forecast by Type
5.2.1 Liquid Epoxy Underfill
5.2.2 Liquid Epoxy Encapsulat Material
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Liquid Molding Compounds (LMC) Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Liquid Molding Compounds (LMC) Market Size Forecast by Applications
6.2.1 Fan-Out Wafer Level Packaging (FOWLP)
6.2.2 Ball Grid Array Package (BGA)
6.2.3 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Liquid Molding Compounds (LMC) Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Liquid Molding Compounds (LMC) Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Liquid Molding Compounds (LMC) Analysis and Forecast
9.1 Introduction
9.2 North America Liquid Molding Compounds (LMC) Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Liquid Molding Compounds (LMC) Market Size Forecast by Type
9.6.1 Liquid Epoxy Underfill
9.6.2 Liquid Epoxy Encapsulat Material
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Liquid Molding Compounds (LMC) Market Size Forecast by Applications
9.10.1 Fan-Out Wafer Level Packaging (FOWLP)
9.10.2 Ball Grid Array Package (BGA)
9.10.3 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Liquid Molding Compounds (LMC) Analysis and Forecast
10.1 Introduction
10.2 Europe Liquid Molding Compounds (LMC) Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Liquid Molding Compounds (LMC) Market Size Forecast by Type
10.6.1 Liquid Epoxy Underfill
10.6.2 Liquid Epoxy Encapsulat Material
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Liquid Molding Compounds (LMC) Market Size Forecast by Applications
10.10.1 Fan-Out Wafer Level Packaging (FOWLP)
10.10.2 Ball Grid Array Package (BGA)
10.10.3 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Liquid Molding Compounds (LMC) Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Liquid Molding Compounds (LMC) Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Liquid Molding Compounds (LMC) Market Size Forecast by Type
11.6.1 Liquid Epoxy Underfill
11.6.2 Liquid Epoxy Encapsulat Material
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Liquid Molding Compounds (LMC) Market Size Forecast by Applications
11.10.1 Fan-Out Wafer Level Packaging (FOWLP)
11.10.2 Ball Grid Array Package (BGA)
11.10.3 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Liquid Molding Compounds (LMC) Analysis and Forecast
12.1 Introduction
12.2 Latin America Liquid Molding Compounds (LMC) Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Liquid Molding Compounds (LMC) Market Size Forecast by Type
12.6.1 Liquid Epoxy Underfill
12.6.2 Liquid Epoxy Encapsulat Material
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Liquid Molding Compounds (LMC) Market Size Forecast by Applications
12.10.1 Fan-Out Wafer Level Packaging (FOWLP)
12.10.2 Ball Grid Array Package (BGA)
12.10.3 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Liquid Molding Compounds (LMC) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Liquid Molding Compounds (LMC) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Liquid Molding Compounds (LMC) Market Size Forecast by Type
13.6.1 Liquid Epoxy Underfill
13.6.2 Liquid Epoxy Encapsulat Material
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Liquid Molding Compounds (LMC) Market Size Forecast by Applications
13.10.1 Fan-Out Wafer Level Packaging (FOWLP)
13.10.2 Ball Grid Array Package (BGA)
13.10.3 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Liquid Molding Compounds (LMC) Market: Competitive Dashboard
14.2 Global Liquid Molding Compounds (LMC) Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Nagase ChemteX
14.3.2 Shin-Etsu Chemical
14.3.3 Sumitomo Bakelite
14.3.4 Panasonic
