Market Overview:
The global low pressure molding hot melt adhesive market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for low pressure molding hot melt adhesive from the automotive and electronic component industries. In terms of type, the polyamide segment is expected to lead the global low pressure molding hot melt adhesive market during the forecast period, followed by polyolefin and copolyester segments. In terms of application, the electronic component segment is expected to lead the global low pressure molding hot melt adhesive market duringthe forecast period, followed by automotive and others segments.
Product Definition:
The definition of Low Pressure Molding Hot Melt Adhesive is a thermoplastic adhesive that is used in the low pressure molding process. The importance of this type of adhesive is that it provides a strong bond between two surfaces and it can be used to create parts with intricate details.
Polyamide:
Polyamide is a synthetic, semi-aromatic polyamide. It has excellent chemical and temperature resistance properties. Polyamides are used in various industries including automotive, construction, electrical & electronics packaging and consumer goods on account of their high strength to weight ratio as compared to other plastics which makes them ideal for use in the aforementioned applications.
The global polyamide market size was estimated at USD 3.51 billion in 2015.
Polyolefin:
Polyolefin is a polymer, which contains multiple olefin units. It has high strength and low density, which makes it ideal for molding applications in the construction and automotive industries. Polyolefins are used as substitutes to metals such as steel; due to their lightweight properties they are widely used in automobiles & aircrafts. They also have excellent resistance against chemicals & fuels; making them suitable for manufacturing components that come into direct contact with food & beverages or chemical substances.
Application Insights:
The electronic component application segment led the global low pressure molding hot melt adhesive market in 2017. This is attributed to the high demand for electronics products, especially in emerging economies such as China and India. In addition, a rise in disposable income has enabled consumers to spend more on luxury goods, thus driving up product demand for various consumer goods applications such as mobile phones and laptops.
Automotive was the second largest application segment of the global LPMHMA industry in 2017 due to increasing production of passenger cars and heavy vehicles across various regions including Asia Pacific and North America. The growth of this industry is driven by rising sales of automobiles owing to growing middle class population along with increasing disposable income levels which enables consumers purchase higher end vehicles with better features compared to basic models available in mass markets at affordable prices.
Regional Analysis:
Asia Pacific dominated the global market in 2017. The region is expected to witness high growth over the forecast period owing to rapid industrialization and increasing population in developing economies such as China, India, Indonesia, Vietnam and Thailand. This has led to an increase in demand for consumer goods along with automobiles.
The Asia Pacific economy is characterized by a large number of manufacturers who cater to local as well as export markets across various application industries including automotive, electrical & electronics and packaging among others. The availability of low-cost labor coupled with less stringent regulations regarding VOC emissions compared to developed regions such as North America or Europe makes it an attractive manufacturing hub for global hot melt adhesives manufacturers looking at cost optimization strategies followed by Asian countries especially China and Taiwan Province of Japan (TPE).
Growth Factors:
- Increasing demand for lightweight and fuel-efficient vehicles
- Growing automotive industry in developing countries
- Rising demand for medical adhesives and tapes
- Increasing use of adhesive bonding in construction industry
- Technological advancements in hot melt adhesive formulations
Scope Of The Report
Report Attributes
Report Details
Report Title
Low Pressure Molding Hot Melt Adhesive Market Research Report
By Type
Polyamide, Polyolefin, Copolyester, Others
By Application
Electronic Component, Automotive, Others
By Companies
Henkel, Bostik, MOLDMAN SYSTEMS LLC, SUNTIP, Austromelt, Liancheng Rixin Fine Synthetic Material Co., Ltd., H.B. Fuller, 3M, Jowat, Evonik, Huntsman, Schaetti, Bühnen, Sipol, TEX YEAR, Shanghai Tianyang Hot Adhesives Co., Ltd., Eastman, Toyobo
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
159
Number of Tables & Figures
112
Customization Available
Yes, the report can be customized as per your need.
Global Low Pressure Molding Hot Melt Adhesive Market Report Segments:
The global Low Pressure Molding Hot Melt Adhesive market is segmented on the basis of:
Types
Polyamide, Polyolefin, Copolyester, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Electronic Component, Automotive, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Henkel
- Bostik
- MOLDMAN SYSTEMS LLC
- SUNTIP
- Austromelt
- Liancheng Rixin Fine Synthetic Material Co., Ltd.
- H.B. Fuller
- 3M
- Jowat
- Evonik
- Huntsman
- Schaetti
- Bühnen
- Sipol
- TEX YEAR
- Shanghai Tianyang Hot Adhesives Co., Ltd.
- Eastman
- Toyobo
Highlights of The Low Pressure Molding Hot Melt Adhesive Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Polyamide
- Polyolefin
- Copolyester
- Others
- By Application:
- Electronic Component
- Automotive
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Low Pressure Molding Hot Melt Adhesive Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Low pressure molding hot melt adhesive is a type of adhesive that is used to bond two or more pieces of plastic together. It is a fast-acting, low-temperature adhesive that can be used in a variety of applications, including manufacturing and construction.
Some of the major players in the low pressure molding hot melt adhesive market are Henkel, Bostik, MOLDMAN SYSTEMS LLC, SUNTIP, Austromelt, Liancheng Rixin Fine Synthetic Material Co., Ltd., H.B. Fuller, 3M, Jowat, Evonik, Huntsman, Schaetti, B¼hnen, Sipol, TEX YEAR, Shanghai Tianyang Hot Adhesives Co., Ltd., Eastman, Toyobo.
The low pressure molding hot melt adhesive market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Low Pressure Molding Hot Melt Adhesive Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Low Pressure Molding Hot Melt Adhesive Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Low Pressure Molding Hot Melt Adhesive Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Low Pressure Molding Hot Melt Adhesive Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Low Pressure Molding Hot Melt Adhesive Market Size & Forecast, 2018-2028 4.5.1 Low Pressure Molding Hot Melt Adhesive Market Size and Y-o-Y Growth 4.5.2 Low Pressure Molding Hot Melt Adhesive Market Absolute $ Opportunity
Chapter 5 Global Low Pressure Molding Hot Melt Adhesive Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Type
5.2.1 Polyamide
5.2.2 Polyolefin
5.2.3 Copolyester
5.2.4 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Low Pressure Molding Hot Melt Adhesive Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Applications
6.2.1 Electronic Component
6.2.2 Automotive
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Low Pressure Molding Hot Melt Adhesive Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Low Pressure Molding Hot Melt Adhesive Analysis and Forecast
9.1 Introduction
9.2 North America Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Type
9.6.1 Polyamide
9.6.2 Polyolefin
9.6.3 Copolyester
9.6.4 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Applications
9.10.1 Electronic Component
9.10.2 Automotive
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Low Pressure Molding Hot Melt Adhesive Analysis and Forecast
10.1 Introduction
10.2 Europe Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Type
10.6.1 Polyamide
10.6.2 Polyolefin
10.6.3 Copolyester
10.6.4 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Applications
10.10.1 Electronic Component
10.10.2 Automotive
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Low Pressure Molding Hot Melt Adhesive Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Type
11.6.1 Polyamide
11.6.2 Polyolefin
11.6.3 Copolyester
11.6.4 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Applications
11.10.1 Electronic Component
11.10.2 Automotive
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Low Pressure Molding Hot Melt Adhesive Analysis and Forecast
12.1 Introduction
12.2 Latin America Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Type
12.6.1 Polyamide
12.6.2 Polyolefin
12.6.3 Copolyester
12.6.4 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Applications
12.10.1 Electronic Component
12.10.2 Automotive
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Low Pressure Molding Hot Melt Adhesive Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Type
13.6.1 Polyamide
13.6.2 Polyolefin
13.6.3 Copolyester
13.6.4 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Low Pressure Molding Hot Melt Adhesive Market Size Forecast by Applications
13.10.1 Electronic Component
13.10.2 Automotive
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Low Pressure Molding Hot Melt Adhesive Market: Competitive Dashboard
14.2 Global Low Pressure Molding Hot Melt Adhesive Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Henkel
14.3.2 Bostik
14.3.3 MOLDMAN SYSTEMS LLC
14.3.4 SUNTIP
14.3.5 Austromelt
14.3.6 Liancheng Rixin Fine Synthetic Material Co., Ltd.
14.3.7 H.B. Fuller
14.3.8 3M
14.3.9 Jowat
14.3.10 Evonik
14.3.11 Huntsman
14.3.12 Schaetti
14.3.13 Bühnen
14.3.14 Sipol
14.3.15 TEX YEAR
14.3.16 Shanghai Tianyang Hot Adhesives Co., Ltd.
14.3.17 Eastman
14.3.18 Toyobo