Market Overview:
The global low temperature solder pastes market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturization and higher density packaging in the semiconductor industry, and the growing trend of using lead-free solders. Low temperature solder pastes are used in SMT assembly and semiconductor packaging applications. The North American region is expected to hold the largest share of the global low temperature solder paste market during the forecast period, followed by Europe and Asia Pacific. The growth in these regions can be attributed to factors such as rising demand for miniaturization and higher density packaging, increase in electronic device shipments, and growing trend of using lead-free solders.
Product Definition:
Low Temperature Solder Pastes are a type of solder paste that is designed to be used with low temperature soldering irons. Low Temperature Solder Pastes are important because they allow users to solder smaller components without damaging them.
No Clean:
No Clean is a type of flux that was designed to replace the conventional clean flux used in high-temperature solders. The major factor driving demand for no clean solder paste is its ability to protect against oxidation, which leads to joint failure. It also has the added benefit of providing mechanical strength and thermal conductivity to joints, along with improved electrical characteristics such as flow rate and reliability.
Nead to Wash:
Nead to wash is a type of cleaning process used in low temperature solder pastes industry. It helps remove oxides and other unwanted materials from the paste surface by using water at a certain temperature. Nead to wash technique is widely used for removing oxides, dirt, dust and other unwanted materials from the paste surface during soldering operations.
Application Insights:
SMT assembly was the largest application segment in 2017 and is expected to continue its dominance over the forecast period. SMT, also known as Surface Mount Technology, has been witnessing significant growth due to its ability to combine small size with high performance components. The global low temperature solder pastes market by type (no clean, nead-to-wash) is projected to register a revenue-based CAGR of XX% from 2018 to 2030 owing to increased demand for these products in SMT assembly applications across various end-use industries such as telecommunication & IT and automotive & transportation among others.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The region’s growth can be attributed to increasing demand from end-use industries, such as electronics, automotive, medical devices and others. China is estimated to remain a key consumer of low temperature solder pastes in Asia Pacific due to rapid industrialization along with an increase in foreign investments for manufacturing electronic products.
Europe accounted for more than 25% of the overall revenue share in 2017 owing to high demand from several major application segments including aerospace & defense, IT/communication equipment and automotive among others.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive and aerospace industries
- Growing popularity of lead-free soldering technologies
- Proliferation of 3D printing technology
- Emergence of new applications
Scope Of The Report
Report Attributes
Report Details
Report Title
Low Temperature Solder Pastes Market Research Report
By Type
No Clean, Nead to Wash
By Application
SMT Assembly, Semiconductor Packaging
By Companies
AIM, Genma, Alpha, Qualitek, Superior Flux, Senju, Tamura, Henkel, Kester, Inventec, KOKI, Nihon Superior, Tongfang Tech, Earlysun, Chipquik, Chemtools, Indium Corporation, SRA-Solder
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
221
Number of Tables & Figures
155
Customization Available
Yes, the report can be customized as per your need.
Global Low Temperature Solder Pastes Market Report Segments:
The global Low Temperature Solder Pastes market is segmented on the basis of:
Types
No Clean, Nead to Wash
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
SMT Assembly, Semiconductor Packaging
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- AIM
- Genma
- Alpha
- Qualitek
- Superior Flux
- Senju
- Tamura
- Henkel
- Kester
- Inventec
- KOKI
- Nihon Superior
- Tongfang Tech
- Earlysun
- Chipquik
- Chemtools
- Indium Corporation
- SRA-Solder
Highlights of The Low Temperature Solder Pastes Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- No Clean
- Nead to Wash
- By Application:
- SMT Assembly
- Semiconductor Packaging
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Low Temperature Solder Pastes Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Low temperature solder pastes are a type of solder that is used at temperatures below the melting point of lead. This type of solder is often used in electronics because it has a higher thermal conductivity than other types of solders and it can be easily applied to surfaces.
Some of the key players operating in the low temperature solder pastes market are AIM, Genma, Alpha, Qualitek, Superior Flux, Senju, Tamura, Henkel, Kester, Inventec, KOKI, Nihon Superior, Tongfang Tech, Earlysun, Chipquik, Chemtools, Indium Corporation, SRA-Solder.
The low temperature solder pastes market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Low Temperature Solder Pastes Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Low Temperature Solder Pastes Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Low Temperature Solder Pastes Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Low Temperature Solder Pastes Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Low Temperature Solder Pastes Market Size & Forecast, 2018-2028
4.5.1 Low Temperature Solder Pastes Market Size and Y-o-Y Growth
4.5.2 Low Temperature Solder Pastes Market Absolute $ Opportunity
Chapter 5 Global Low Temperature Solder Pastes Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Low Temperature Solder Pastes Market Size Forecast by Type
5.2.1 No Clean
5.2.2 Nead to Wash
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Low Temperature Solder Pastes Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Low Temperature Solder Pastes Market Size Forecast by Applications
6.2.1 SMT Assembly
6.2.2 Semiconductor Packaging
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Low Temperature Solder Pastes Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Low Temperature Solder Pastes Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Low Temperature Solder Pastes Analysis and Forecast
9.1 Introduction
9.2 North America Low Temperature Solder Pastes Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Low Temperature Solder Pastes Market Size Forecast by Type
9.6.1 No Clean
9.6.2 Nead to Wash
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Low Temperature Solder Pastes Market Size Forecast by Applications
9.10.1 SMT Assembly
9.10.2 Semiconductor Packaging
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Low Temperature Solder Pastes Analysis and Forecast
10.1 Introduction
10.2 Europe Low Temperature Solder Pastes Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Low Temperature Solder Pastes Market Size Forecast by Type
10.6.1 No Clean
10.6.2 Nead to Wash
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Low Temperature Solder Pastes Market Size Forecast by Applications
10.10.1 SMT Assembly
10.10.2 Semiconductor Packaging
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Low Temperature Solder Pastes Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Low Temperature Solder Pastes Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Low Temperature Solder Pastes Market Size Forecast by Type
11.6.1 No Clean
11.6.2 Nead to Wash
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Low Temperature Solder Pastes Market Size Forecast by Applications
11.10.1 SMT Assembly
11.10.2 Semiconductor Packaging
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Low Temperature Solder Pastes Analysis and Forecast
12.1 Introduction
12.2 Latin America Low Temperature Solder Pastes Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Low Temperature Solder Pastes Market Size Forecast by Type
12.6.1 No Clean
12.6.2 Nead to Wash
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Low Temperature Solder Pastes Market Size Forecast by Applications
12.10.1 SMT Assembly
12.10.2 Semiconductor Packaging
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Low Temperature Solder Pastes Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Low Temperature Solder Pastes Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Low Temperature Solder Pastes Market Size Forecast by Type
13.6.1 No Clean
13.6.2 Nead to Wash
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Low Temperature Solder Pastes Market Size Forecast by Applications
13.10.1 SMT Assembly
13.10.2 Semiconductor Packaging
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Low Temperature Solder Pastes Market: Competitive Dashboard
14.2 Global Low Temperature Solder Pastes Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 AIM
14.3.2 Genma
14.3.3 Alpha
14.3.4 Qualitek
14.3.5 Superior Flux
14.3.6 Senju
14.3.7 Tamura
14.3.8 Henkel
14.3.9 Kester
14.3.10 Inventec
14.3.11 KOKI
14.3.12 Nihon Superior
14.3.13 Tongfang Tech
14.3.14 Earlysun
14.3.15 Chipquik
14.3.16 Chemtools
14.3.17 Indium Corporation
14.3.18 SRA-Solder
