Market Overview:
The global memory module sockets market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for electronic products, computers, and aerospace applications, and the rising need for national defense systems. Additionally, the growing trend of miniaturization is also contributing to the growth of this market. On the basis of type, volatile memory module sockets are expected to dominate this market during the forecast period from 2018 to 2030. This can be attributed to their low power consumption as well as high performance levels when compared with other types of memory modules such as non-volatile ones.
Product Definition:
A memory module socket is a connector on a computer motherboard into which memory modules are inserted. Memory module sockets come in different sizes, depending on the type of memory they accept. They may also have different shapes, such as DIMM, SO-DIMM, or RIMM.
Volatile:
The volatile market is expected to grow at a CAGR of XX% from 2016 to 2024. The growth can be attributed to the increasing demand for high-speed and low-power chipsets in electronic devices such as smartphones, tablets, laptops, and computers. Volatile memory is used in these devices due to its ability to retain data without power supply.
Non-volatile:
Non-volatile memory is a type of memory used in electronic devices such as computers, smartphones, and other consumer electronics. The most common types of non-volatile memories include resistive RAM (Reram), flash and EEPROM. These are often used for storing configuration settings, program/instructions along with data in the form of digital patterns or codes that can be read by the computer system even if power is lost to the device.
Application Insights:
The electronic product segment accounted for the largest market share in 2017 and is projected to continue its dominance over the forecast period. This can be attributed to growing demand from end-use industries such as consumer electronics, telecommunication and IT, healthcare, automotive and aerospace. The increasing need for system memory across various applications has led manufacturers to develop products with enhanced performance characteristics at affordable prices.
The computer application segment is estimated to register a significant CAGR of XX% during the forecast period owing to high product demand from server & workstation manufacturers worldwide. National defense was another prominent application segment that accounted for a significant market share in 2017 due largelyto government mandates regarding use of advanced technology products in military aircrafts among other uses such as communication systems & satellites among others). Increasing usage of mainframe computers by companies along with rising R&D activities pertainingto embedded systems are expected drive industry growth over the coming years (2030).
Regional Analysis:
The Asia Pacific regional market accounted for the largest share in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to increasing investments in developing electronic products, computer systems, and aerospace & defense equipment. Moreover, rising demand for mobile devices has led to increased sales of memory modules across this region.
Europe was the second-largest regional market in 2017 owing to high product demand from electronics industry on account of technological advancements coupled with growing applications in digital services sector such as e-commerce websites and cloud computing platforms among others. In addition, presence of major electronic component manufacturers including Infineon technologies along with key players such as Micron Technology Inc., Samsung Electronics Co., Ltd., SK Hynix Inc.
North America region is projected to witness significant growth due to rapid adoption across end-use industries such as aerospace & defense.
Growth Factors:
- Increasing demand for advanced memory modules in consumer electronics and data centers
- Growing popularity of cloud-based services and big data analytics
- Proliferation of next-generation mobile devices and wearable electronics
- Rising demand for high-performance computing (HPC) systems
- Emergence of new memory technologies such as 3D XPoint
Scope Of The Report
Report Attributes
Report Details
Report Title
Memory Module Sockets Market Research Report
By Type
Volatile, Non-volatile
By Application
Electronic product, Computer, Aerospace, National defense
By Companies
TE, Samtec, Amphenol, Molex, Hirose, Amphenol FCI, JAE, JST, HARTING, Yamaichi, TE, Fujitsu, International Electrotechnical Commission, MicroTCA
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
179
Number of Tables & Figures
126
Customization Available
Yes, the report can be customized as per your need.
Global Memory Module Sockets Market Report Segments:
The global Memory Module Sockets market is segmented on the basis of:
Types
Volatile, Non-volatile
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Electronic product, Computer, Aerospace, National defense
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- TE
- Samtec
- Amphenol
- Molex
- Hirose
- Amphenol FCI
- JAE
- JST
- HARTING
- Yamaichi
- TE
- Fujitsu
- International Electrotechnical Commission
- MicroTCA
Highlights of The Memory Module Sockets Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Volatile
- Non-volatile
- By Application:
- Electronic product
- Computer
- Aerospace
- National defense
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Memory Module Sockets Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Memory module sockets are the connectors on a motherboard that allow memory modules to be inserted and removed.
Some of the major players in the memory module sockets market are TE, Samtec, Amphenol, Molex, Hirose, Amphenol FCI, JAE, JST, HARTING, Yamaichi, TE, Fujitsu, International Electrotechnical Commission, MicroTCA.
The memory module sockets market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Memory Module Sockets Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Memory Module Sockets Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Memory Module Sockets Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Memory Module Sockets Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Memory Module Sockets Market Size & Forecast, 2020-2028 4.5.1 Memory Module Sockets Market Size and Y-o-Y Growth 4.5.2 Memory Module Sockets Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Volatile
5.2.2 Non-volatile
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Electronic product
6.2.2 Computer
6.2.3 Aerospace
6.2.4 National defense
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Memory Module Sockets Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Memory Module Sockets Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Volatile
9.6.2 Non-volatile
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Electronic product
9.10.2 Computer
9.10.3 Aerospace
9.10.4 National defense
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Volatile
10.6.2 Non-volatile
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Electronic product
10.10.2 Computer
10.10.3 Aerospace
10.10.4 National defense
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Volatile
11.6.2 Non-volatile
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Electronic product
11.10.2 Computer
11.10.3 Aerospace
11.10.4 National defense
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Volatile
12.6.2 Non-volatile
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Electronic product
12.10.2 Computer
12.10.3 Aerospace
12.10.4 National defense
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Volatile
13.6.2 Non-volatile
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Electronic product
13.10.2 Computer
13.10.3 Aerospace
13.10.4 National defense
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Memory Module Sockets Market: Competitive Dashboard
14.2 Global Memory Module Sockets Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 TE
14.3.2 Samtec
14.3.3 Amphenol
14.3.4 Molex
14.3.5 Hirose
14.3.6 Amphenol FCI
14.3.7 JAE
14.3.8 JST
14.3.9 HARTING
14.3.10 Yamaichi
14.3.11 TE
14.3.12 Fujitsu
14.3.13 International Electrotechnical Commission
14.3.14 MicroTCA