Market Overview:
The global microelectronic packages market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturized and lightweight electronic devices, rising demand for advanced telecommunication systems, and growing automotive industry. In terms of type, the ceramic-to-metal segment is expected to hold the largest share of the global microelectronic packages market during the forecast period. This can be attributed to factors such as low thermal expansion coefficient and high electrical conductivity offered by ceramic materials compared with other materials used in microelectronic packages. In terms of application, the electronics segment is expected to hold the largest share of the global microelectronic packages market duringthe forecast period.
Product Definition:
Microelectronic Packages are structures that house and protect microelectronic devices. They are typically made from a variety of materials, including metals, plastics, and ceramics, and come in a wide range of shapes and sizes. The importance of microelectronic packages lies in their ability to protect delicate electronic components from physical damage and environmental contamination while also providing electrical connection between the component and the outside world.
Ceramic to Metal:
Ceramic to metal is a process in which metallic coating is applied on ceramic substrates. Ceramics are non-metallic, crystalline solid materials that are made from fine particles of clay, minerals and metals. The most common types of ceramics include alumina (Al2O3), silicon nitride (Si3N4), zirconia (ZrO2) and hafnia (Hf).
Glass to Metal:
Glass to metal transition is a process in which the glass of a microelectronic package is replaced with metallic leads or pads. It helps reduce the overall weight of the device and increases its functionality. The most common application of this technology includes soldering irons, where it is used for providing better connectivity between different electronic components as well as for providing heat-sink capacity to processor units.
The global glass to metal.
Application Insights:
The electronics segment accounted for the largest revenue share in 2016 and is anticipated to continue its dominance over the forecast period. The growth of this application can be attributed to increasing demand for microelectronic packages with enhanced thermal management capabilities. These components are used in a wide range of electronic products including smartphones, tablets, laptops, workstations and various other consumer devices.
Microelectronic packages provide low EMI solutions that prevent electromagnetic interference from causing disruption or damage to sensitive equipment such as wireless communication devices and medical equipment used in hospitals & clinics. They also offer superior thermal management solutions that enhance the overall reliability of electronic products by reducing heat generation within a device without affecting its performance or lifespan.
Regional Analysis:
Asia Pacific region is expected to witness the highest growth rate of 7.6% over the forecast period, owing to rapid industrialization and increasing per capita income in emerging economies such as China and India. The Asia Pacific regional market includes Japan, South Korea, Taiwan, Singapore, Malaysia and Indonesia. Increasing demand for consumer electronics products such as smartphones and tablets has been driving the regional market growth since 2015.
The North America microelectronic packages market is driven by high disposable incomes of consumers coupled with rising penetration of advanced electronic devices in the region’s telecom sector that resulted into increased demand for semiconductor packaging solutions used in telecommunication equipment production lines including base stations (cellular), radio network controllers (cellular), pico/micro cells (cellular) along with other end-use industries such as aerospace & defense systems & components manufacturing industry etc.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive and telecommunication sectors
- Growing popularity of wearable electronics
- Proliferation of Internet of Things (IoT) devices
- Advances in packaging technology
Scope Of The Report
Report Attributes
Report Details
Report Title
Microelectronic Packages Market Research Report
By Type
Ceramic to Metal, Glass to Metal
By Application
Electronics, Telecommunication, Automotive, Aerospace / Aviation
By Companies
Schott, Ametek, Materion, Amkor, Kyocera, Fujitsu, Hermetic Solutions Group, Egide Group, Teledyne Microelectronics, SGA Technologies, Texas Instruments, Micross Components, Complete Hermetics, Advanced Technology Group, Hi-Rel Group, XT Xing Technologies
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
137
Number of Tables & Figures
96
Customization Available
Yes, the report can be customized as per your need.
Global Microelectronic Packages Market Report Segments:
The global Microelectronic Packages market is segmented on the basis of:
Types
Ceramic to Metal, Glass to Metal
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Electronics, Telecommunication, Automotive, Aerospace / Aviation
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Schott
- Ametek
- Materion
- Amkor
- Kyocera
- Fujitsu
- Hermetic Solutions Group
- Egide Group
- Teledyne Microelectronics
- SGA Technologies
- Texas Instruments
- Micross Components
- Complete Hermetics
- Advanced Technology Group
- Hi-Rel Group
- XT Xing Technologies
Highlights of The Microelectronic Packages Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Ceramic to Metal
- Glass to Metal
- By Application:
- Electronics
- Telecommunication
- Automotive
- Aerospace / Aviation
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Microelectronic Packages Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Microelectronic packages are small, discrete electronic components that can be assembled into systems or devices. They include microprocessors, memory chips, and other digital components.
Some of the major players in the microelectronic packages market are Schott, Ametek, Materion, Amkor, Kyocera, Fujitsu, Hermetic Solutions Group, Egide Group, Teledyne Microelectronics, SGA Technologies, Texas Instruments, Micross Components, Complete Hermetics, Advanced Technology Group, Hi-Rel Group, XT Xing Technologies.
The microelectronic packages market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Microelectronic Packages Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Microelectronic Packages Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Microelectronic Packages Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Microelectronic Packages Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Microelectronic Packages Market Size & Forecast, 2020-2028
4.5.1 Microelectronic Packages Market Size and Y-o-Y Growth
4.5.2 Microelectronic Packages Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Ceramic to Metal
5.2.2 Glass to Metal
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Electronics
6.2.2 Telecommunication
6.2.3 Automotive
6.2.4 Aerospace / Aviation
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Microelectronic Packages Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Microelectronic Packages Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Ceramic to Metal
9.6.2 Glass to Metal
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Electronics
9.10.2 Telecommunication
9.10.3 Automotive
9.10.4 Aerospace / Aviation
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Ceramic to Metal
10.6.2 Glass to Metal
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Electronics
10.10.2 Telecommunication
10.10.3 Automotive
10.10.4 Aerospace / Aviation
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Ceramic to Metal
11.6.2 Glass to Metal
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Electronics
11.10.2 Telecommunication
11.10.3 Automotive
11.10.4 Aerospace / Aviation
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Ceramic to Metal
12.6.2 Glass to Metal
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Electronics
12.10.2 Telecommunication
12.10.3 Automotive
12.10.4 Aerospace / Aviation
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Ceramic to Metal
13.6.2 Glass to Metal
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Electronics
13.10.2 Telecommunication
13.10.3 Automotive
13.10.4 Aerospace / Aviation
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Microelectronic Packages Market: Competitive Dashboard
14.2 Global Microelectronic Packages Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Schott
14.3.2 Ametek
14.3.3 Materion
14.3.4 Amkor
14.3.5 Kyocera
14.3.6 Fujitsu
14.3.7 Hermetic Solutions Group
14.3.8 Egide Group
14.3.9 Teledyne Microelectronics
14.3.10 SGA Technologies
14.3.11 Texas Instruments
14.3.12 Micross Components
14.3.13 Complete Hermetics
14.3.14 Advanced Technology Group
14.3.15 Hi-Rel Group
14.3.16 XT Xing Technologies
