Market Overview:
The global microelectronics packaging materials market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturization and higher performance in electronic devices. In addition, the growing demand for semiconductor and MEMS devices is also contributing to the growth of this market. The hermetic lids segment is expected to hold the largest share of the global microelectronics packaging materials market during the forecast period. This can be attributed to their high reliability and superior performance characteristics as compared with other types of packaging materials.
Product Definition:
Microelectronics packaging materials are the materials used to package microelectronic components and assemblies. These include semiconductor chips, resistors, capacitors, and diodes. The most common microelectronics packaging material is epoxy resin.
Hermetic Lids:
Hermetic lids are used in microelectronics packaging materials to cover and protect the electronic devices. The hermetic lid is a semi-permeable membrane that prevents the entry of gases or volatile compounds into the container. It also helps in preventing light from affecting sensitive electronics, especially when it comes to mobile phones and tablets.
The global hermetic lids market size was valued at USD 1,867 million in 2015.
Ceramic Packages:
Ceramic Packages are materials made from fine, durable particles that are resistant to chemicals and high temperatures. Ceramics differ from metals in terms of their electrical conductivity; however, they have a lower melting point. The ceramic packages offer thermal shock resistance which is an essential feature for electronic devices that use on/off switches or sensors.
Application Insights:
The market is segmented by application into semiconductors, micro-electro-mechanical systems (MEMS), medical, optical, and others. The MEMS application segment dominated the global market in 2017 owing to its high growth rate and increasing usage in various devices such as inertial sensors, accelerometers, gyroscopes & scanners.
In addition, it also has excellent moisture resistance which enables long product shelf life under normal conditions. These factors are anticipated to drive industry growth over the forecast period.
Microelectronics packaging materials are used for manufacturing a wide range of products including semiconductors; integrated circuits; passive components like resistors & capacitors;.
Regional Analysis:
Asia Pacific region accounted for the largest revenue share in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to rising investments by foreign players in China, Taiwan, Japan and South Korea. In addition, increasing demand for electronic products such as smartphones and laptops is also expected to drive regional market growth over the forecast period.
The industry in North America has been witnessing healthy growth due to high disposable income coupled with growing consumer awareness regarding advanced technologies such as 3D-stacked ICs and 5G network standards. Moreover, presence of major industry participants including Micron Technology Inc., Intel Corporation; Texas Instruments Inc.; Broadcom Limited; Qualcomm Technologies Inc.; Avago Technolgies LLC; Skyworks Solutions Holdings, LLC; Maxim Integrated Products Inc.; Fairchild Semiconductor International Corp.; Xilinx Corporation will fuel regional product demand over the next eight years.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive and healthcare sectors
- Growing popularity of flexible electronics
- Proliferation of next-generation packaging technologies
- Stringent government regulations for product safety
Scope Of The Report
Report Attributes
Report Details
Report Title
Microelectronics Packaging Materials Market Research Report
By Type
Hermetic Lids, Ceramic Packages, Preforms, Braze And Solder Alloys
By Application
Semiconductor, Micro-Electro-Mechanical System(MEMS), Medical, Optical, Others
By Companies
Materion Corporation, STI Electronics, SHING HONG TAI COMPANY, Hermetic Solutions Group, Inseto, Yixing City Jitai Electronics
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
231
Number of Tables & Figures
162
Customization Available
Yes, the report can be customized as per your need.
Global Microelectronics Packaging Materials Market Report Segments:
The global Microelectronics Packaging Materials market is segmented on the basis of:
Types
Hermetic Lids, Ceramic Packages, Preforms, Braze And Solder Alloys
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Semiconductor, Micro-Electro-Mechanical System(MEMS), Medical, Optical, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Materion Corporation
- STI Electronics
- SHING HONG TAI COMPANY
- Hermetic Solutions Group
- Inseto
- Yixing City Jitai Electronics
Highlights of The Microelectronics Packaging Materials Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Hermetic Lids
- Ceramic Packages
- Preforms
- Braze And Solder Alloys
- By Application:
- Semiconductor
- Micro-Electro-Mechanical System(MEMS)
- Medical
- Optical
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Microelectronics Packaging Materials Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Microelectronics packaging materials are used to protect electronic devices from damage during shipping and storage. They can include protective foils, shrink wrap, bubble wrap, and other materials.
Some of the major players in the microelectronics packaging materials market are Materion Corporation, STI Electronics, SHING HONG TAI COMPANY, Hermetic Solutions Group, Inseto, Yixing City Jitai Electronics.
The microelectronics packaging materials market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Microelectronics Packaging Materials Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Microelectronics Packaging Materials Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Microelectronics Packaging Materials Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Microelectronics Packaging Materials Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Microelectronics Packaging Materials Market Size & Forecast, 2018-2028
4.5.1 Microelectronics Packaging Materials Market Size and Y-o-Y Growth
4.5.2 Microelectronics Packaging Materials Market Absolute $ Opportunity
Chapter 5 Global Microelectronics Packaging Materials Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Microelectronics Packaging Materials Market Size Forecast by Type
5.2.1 Hermetic Lids
5.2.2 Ceramic Packages
5.2.3 Preforms
5.2.4 Braze And Solder Alloys
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Microelectronics Packaging Materials Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Microelectronics Packaging Materials Market Size Forecast by Applications
6.2.1 Semiconductor
6.2.2 Micro-Electro-Mechanical System(MEMS)
6.2.3 Medical
6.2.4 Optical
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Microelectronics Packaging Materials Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Microelectronics Packaging Materials Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Microelectronics Packaging Materials Analysis and Forecast
9.1 Introduction
9.2 North America Microelectronics Packaging Materials Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Microelectronics Packaging Materials Market Size Forecast by Type
9.6.1 Hermetic Lids
9.6.2 Ceramic Packages
9.6.3 Preforms
9.6.4 Braze And Solder Alloys
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Microelectronics Packaging Materials Market Size Forecast by Applications
9.10.1 Semiconductor
9.10.2 Micro-Electro-Mechanical System(MEMS)
9.10.3 Medical
9.10.4 Optical
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Microelectronics Packaging Materials Analysis and Forecast
10.1 Introduction
10.2 Europe Microelectronics Packaging Materials Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Microelectronics Packaging Materials Market Size Forecast by Type
10.6.1 Hermetic Lids
10.6.2 Ceramic Packages
10.6.3 Preforms
10.6.4 Braze And Solder Alloys
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Microelectronics Packaging Materials Market Size Forecast by Applications
10.10.1 Semiconductor
10.10.2 Micro-Electro-Mechanical System(MEMS)
10.10.3 Medical
10.10.4 Optical
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Microelectronics Packaging Materials Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Microelectronics Packaging Materials Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Microelectronics Packaging Materials Market Size Forecast by Type
11.6.1 Hermetic Lids
11.6.2 Ceramic Packages
11.6.3 Preforms
11.6.4 Braze And Solder Alloys
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Microelectronics Packaging Materials Market Size Forecast by Applications
11.10.1 Semiconductor
11.10.2 Micro-Electro-Mechanical System(MEMS)
11.10.3 Medical
11.10.4 Optical
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Microelectronics Packaging Materials Analysis and Forecast
12.1 Introduction
12.2 Latin America Microelectronics Packaging Materials Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Microelectronics Packaging Materials Market Size Forecast by Type
12.6.1 Hermetic Lids
12.6.2 Ceramic Packages
12.6.3 Preforms
12.6.4 Braze And Solder Alloys
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Microelectronics Packaging Materials Market Size Forecast by Applications
12.10.1 Semiconductor
12.10.2 Micro-Electro-Mechanical System(MEMS)
12.10.3 Medical
12.10.4 Optical
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Microelectronics Packaging Materials Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Microelectronics Packaging Materials Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Microelectronics Packaging Materials Market Size Forecast by Type
13.6.1 Hermetic Lids
13.6.2 Ceramic Packages
13.6.3 Preforms
13.6.4 Braze And Solder Alloys
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Microelectronics Packaging Materials Market Size Forecast by Applications
13.10.1 Semiconductor
13.10.2 Micro-Electro-Mechanical System(MEMS)
13.10.3 Medical
13.10.4 Optical
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Microelectronics Packaging Materials Market: Competitive Dashboard
14.2 Global Microelectronics Packaging Materials Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Materion Corporation
14.3.2 STI Electronics
14.3.3 SHING HONG TAI COMPANY
14.3.4 Hermetic Solutions Group
14.3.5 Inseto
14.3.6 Yixing City Jitai Electronics
