Market Overview:
The global MOCVD wafer market is expected to grow at a CAGR of xx% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices across different applications, such as consumer electronics, signal base stations, data centers, and others. In addition, the growing demand for advanced semiconductor devices is also fueling the growth of this market. Based on type, the global MOCVD wafer market can be segmented into low frequency pHEMT (planar heterojunction bipolar transistor), HBT (heterojunction bipolar transistor), and LDPD (light emitting diode). Among these segments, low frequency pHEMT is expected to witness highest growth during the forecast period. This can be attributed to its growing demand in various applications such as consumer electronics and signal base stations. Based on application, the global MOCVD wafer market can be segmented into consumer electronics; signal base station; data center; medical device; automotive & transportation; military & aerospace ; industrial control ; lighting ; and other applications . Among these segments ,consumer electronics held largest share in 2017 .This trend is projected continue over next few years owing rising adoption of semiconductors across different electronic products including smartphones ,tablets etc .
Product Definition:
A MOCVD Wafer is a type of semiconductor wafer that is made using the metal organic chemical vapor deposition (MOCVD) process. MOCVD wafers are used in the manufacture of semiconductor devices, such as integrated circuits (ICs), light-emitting diodes (LEDs), and lasers. The MOCVD process deposits thin films of various materials, including metals and dielectrics, on a substrate to create electronic devices.
Low Frequency pHEMT:
Low Frequency pHEMT, also known as lifeline or low-temperature epoxy matrix temperature (LTP) emulsion, is a new technology for manufacturing semiconductor devices. It utilizes a different approach from the traditional high frequency method in which the reactants are mixed and then heated to give rise to an epoxy network.
HBT:
High-Burden Tires are used in the manufacturing of semiconductors. They are made from silica and carbon compounds with a high load factor. HBT is manufactured by compressing these materials under extremely high pressure, which is then reduced to create the desired product for use in electronic devices such as integrated circuits (IC).
Application Insights:
The consumer electronics segment is expected to witness significant growth over the forecast period. The rapid development in technology has led to an increased demand for MOCVD wafers for the production of various electronic products such as smartphones, wearable devices, and televisions. The data center application segment accounted for a share of 15.3% in 2017 owing to increasing demand from cloud service providers and internet infrastructure builders.
The growing adoption of IoT (Internet Of Things) across several industries including automotive, healthcare, smart city etc., is anticipated to drive the market over the forecast period. Furthermore, rising R&D activities by numerous companies are likely to contribute towards industry growth over the coming years as well as create new opportunities for players operating in this space at present time.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The region is home to some of the major consumer electronics manufacturers such as Samsung Electronics Co., Ltd.; Sony Corporation; LG Electronics Inc.; and Fujifilm Holdings Corporation. These companies are actively involved in capitalizing on Taiwan Semiconductor Manufacturing Company’s (TSMC) new found flexibility with respect to process technologies by offering a cost-effective solution for their production needs. TSMC has announced that it plans to increase its wafer manufacturing capacity by 30% from 2018, which will help it cater to demand from various end-use industries such as mobile phones, data centers, and others.
Growth Factors:
- Increasing demand for LED lighting
- Rising demand from the optoelectronics and semiconductor industries
- Growing adoption of MOCVD technology in the fabrication of compound semiconductor devices
- Proliferation of nanotechnology and MEMS/MOEMS applications
- Development of new materials and processes that improve MOCVD wafer performance
Scope Of The Report
Report Attributes
Report Details
Report Title
MOCVD Wafer Market Research Report
By Type
Low Frequency pHEMT, HBT, LDPD
By Application
Consumer Electronics, Signal Base Station, Data Center, Others
By Companies
Beijing Tongmei Xtal Technology Co., Ltd., IntelliEPI Inc., Freiberg, Shin-Etsu Chemical, Showa Denko, GE aviation, AXT Inc, Xiamen Compound Semiconductor Wafers, Yunnan Lincang Xinyuan Germanium Industry, Grinm Advanced Materials
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
248
Number of Tables & Figures
174
Customization Available
Yes, the report can be customized as per your need.
Global MOCVD Wafer Market Report Segments:
The global MOCVD Wafer market is segmented on the basis of:
Types
Low Frequency pHEMT, HBT, LDPD
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Signal Base Station, Data Center, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Beijing Tongmei Xtal Technology Co., Ltd.
- IntelliEPI Inc.
- Freiberg
- Shin-Etsu Chemical
- Showa Denko
- GE aviation
- AXT Inc
- Xiamen Compound Semiconductor Wafers
- Yunnan Lincang Xinyuan Germanium Industry
- Grinm Advanced Materials
Highlights of The MOCVD Wafer Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Low Frequency pHEMT
- HBT
- LDPD
- By Application:
- Consumer Electronics
- Signal Base Station
- Data Center
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the MOCVD Wafer Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A MOCVD Wafer is a semiconductor wafer that has been processed using Molecular Beam Epitaxy (MBA). This process uses high-energy beams of atoms or molecules to create very small, uniform chips from a large piece of material.
Some of the key players operating in the mocvd wafer market are Beijing Tongmei Xtal Technology Co., Ltd., IntelliEPI Inc., Freiberg, Shin-Etsu Chemical, Showa Denko, GE aviation, AXT Inc, Xiamen Compound Semiconductor Wafers, Yunnan Lincang Xinyuan Germanium Industry, Grinm Advanced Materials.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 MOCVD Wafer Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 MOCVD Wafer Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 MOCVD Wafer Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the MOCVD Wafer Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global MOCVD Wafer Market Size & Forecast, 2018-2028
4.5.1 MOCVD Wafer Market Size and Y-o-Y Growth
4.5.2 MOCVD Wafer Market Absolute $ Opportunity
Chapter 5 Global MOCVD Wafer Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 MOCVD Wafer Market Size Forecast by Type
5.2.1 Low Frequency pHEMT
5.2.2 HBT
5.2.3 LDPD
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global MOCVD Wafer Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 MOCVD Wafer Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Signal Base Station
6.2.3 Data Center
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global MOCVD Wafer Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 MOCVD Wafer Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America MOCVD Wafer Analysis and Forecast
9.1 Introduction
9.2 North America MOCVD Wafer Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America MOCVD Wafer Market Size Forecast by Type
9.6.1 Low Frequency pHEMT
9.6.2 HBT
9.6.3 LDPD
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America MOCVD Wafer Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Signal Base Station
9.10.3 Data Center
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe MOCVD Wafer Analysis and Forecast
10.1 Introduction
10.2 Europe MOCVD Wafer Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe MOCVD Wafer Market Size Forecast by Type
10.6.1 Low Frequency pHEMT
10.6.2 HBT
10.6.3 LDPD
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe MOCVD Wafer Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Signal Base Station
10.10.3 Data Center
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific MOCVD Wafer Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific MOCVD Wafer Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific MOCVD Wafer Market Size Forecast by Type
11.6.1 Low Frequency pHEMT
11.6.2 HBT
11.6.3 LDPD
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific MOCVD Wafer Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Signal Base Station
11.10.3 Data Center
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America MOCVD Wafer Analysis and Forecast
12.1 Introduction
12.2 Latin America MOCVD Wafer Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America MOCVD Wafer Market Size Forecast by Type
12.6.1 Low Frequency pHEMT
12.6.2 HBT
12.6.3 LDPD
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America MOCVD Wafer Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Signal Base Station
12.10.3 Data Center
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) MOCVD Wafer Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) MOCVD Wafer Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) MOCVD Wafer Market Size Forecast by Type
13.6.1 Low Frequency pHEMT
13.6.2 HBT
13.6.3 LDPD
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) MOCVD Wafer Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Signal Base Station
13.10.3 Data Center
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 MOCVD Wafer Market: Competitive Dashboard
14.2 Global MOCVD Wafer Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Beijing Tongmei Xtal Technology Co., Ltd.
14.3.2 IntelliEPI Inc.
14.3.3 Freiberg
14.3.4 Shin-Etsu Chemical
14.3.5 Showa Denko
14.3.6 GE aviation
14.3.7 AXT Inc
14.3.8 Xiamen Compound Semiconductor Wafers
14.3.9 Yunnan Lincang Xinyuan Germanium Industry
14.3.10 Grinm Advanced Materials
